Rear-face illuminated solid state image sensors
First Claim
1. A microelectronic unit comprising:
- a semiconductor element having a front surface, an opposed rear surface, and a bonding contact disposed at least partially adjacent the front surface;
a packaging layer overlying the semiconductor element;
an image sensing region including light detector elements disposed adjacent a rear surface of the semiconductor element;
a terminal overlying an outermost surface of the packaging layer; and
a conductive via extending through the packaging layer and at least a portion of the bonding contact so as to form an interior wall surface within the bonding contact, the via electrically connecting the terminal and the bonding contact,wherein the image sensing region is electrically isolated from the conductive via.
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Accused Products
Abstract
A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
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Citations
16 Claims
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1. A microelectronic unit comprising:
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a semiconductor element having a front surface, an opposed rear surface, and a bonding contact disposed at least partially adjacent the front surface; a packaging layer overlying the semiconductor element; an image sensing region including light detector elements disposed adjacent a rear surface of the semiconductor element; a terminal overlying an outermost surface of the packaging layer; and a conductive via extending through the packaging layer and at least a portion of the bonding contact so as to form an interior wall surface within the bonding contact, the via electrically connecting the terminal and the bonding contact, wherein the image sensing region is electrically isolated from the conductive via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification