Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS
First Claim
1. A Micro-Electro-Mechanical Systems (MEMS) device, comprising:
- a substrate, having a substrate opening corresponding to a diaphragm region;
a dielectric supporting layer, disposed directly on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region;
a diaphragm, within the dielectric opening, wherein a periphery of the diaphragm is embedded into the dielectric supporting layer; and
a first backplate, disposed on the dielectric supporting layer, having a plurality of first venting holes, connecting to the dielectric opening, wherein the first backplate comprises a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer,wherein the dielectric supporting layer is disposed in between the first backplate and the substrate, and wherein a periphery portion of the conductive layer of the first backplate is disposed on the dielectric supporting layer.
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Abstract
A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
17 Citations
17 Claims
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1. A Micro-Electro-Mechanical Systems (MEMS) device, comprising:
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a substrate, having a substrate opening corresponding to a diaphragm region; a dielectric supporting layer, disposed directly on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region; a diaphragm, within the dielectric opening, wherein a periphery of the diaphragm is embedded into the dielectric supporting layer; and a first backplate, disposed on the dielectric supporting layer, having a plurality of first venting holes, connecting to the dielectric opening, wherein the first backplate comprises a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer, wherein the dielectric supporting layer is disposed in between the first backplate and the substrate, and wherein a periphery portion of the conductive layer of the first backplate is disposed on the dielectric supporting layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification