Semiconductor device and method of manufacturing the same
First Claim
1. A method of manufacturing a semiconductor device, comprising:
- forminga beam supported by a substrate having a surface,a movable structural body supported by the beam,a first stopper member supported by the substrate and arranged at a distance from the movable structural body in an in-plane direction with respect to the surface,a second stopper member supported by the first stopper member and arranged at a distance from the movable structural body in an out-of-plane direction with respect to the surface,a third stopper member supported by the first stopper member, arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and arranged at a distance from the movable structural body,a first sacrificial film formed between the movable structural body and the first stopper member,a second sacrificial film formed between the movable structural body and the second stopper member, anda third sacrificial film formed between the movable structural body and the third stopper member; and
performing an etching process to remove the first sacrificial film, the second sacrificial film and the third sacrificial film, to form a first gap between the movable structural body and the first stopper member, form a second gap between the movable structural body and the second stopper member, and form a third gap between the movable structural body and the third stopper member.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.
5 Citations
2 Claims
-
1. A method of manufacturing a semiconductor device, comprising:
-
forming a beam supported by a substrate having a surface, a movable structural body supported by the beam, a first stopper member supported by the substrate and arranged at a distance from the movable structural body in an in-plane direction with respect to the surface, a second stopper member supported by the first stopper member and arranged at a distance from the movable structural body in an out-of-plane direction with respect to the surface, a third stopper member supported by the first stopper member, arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and arranged at a distance from the movable structural body, a first sacrificial film formed between the movable structural body and the first stopper member, a second sacrificial film formed between the movable structural body and the second stopper member, and a third sacrificial film formed between the movable structural body and the third stopper member; and performing an etching process to remove the first sacrificial film, the second sacrificial film and the third sacrificial film, to form a first gap between the movable structural body and the first stopper member, form a second gap between the movable structural body and the second stopper member, and form a third gap between the movable structural body and the third stopper member. - View Dependent Claims (2)
-
Specification