Electronic device for vehicle

• US 10,256,170 B2
• Filed: 12/21/2015
• Issued: 04/09/2019
• Est. Priority Date: 01/08/2015
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Sueyoshi, Tetsuya, Ando, Hiroaki
• Primary Examiner(s): Haughton, Anthony M
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US15/539,538
• Publication Number:
  US 20170352608A1
• Time in Patent Office: 1,205 Days
• Field of Search: 361676-678, 36167946-67954, 361688-723, 165 801- 805, 16510433, 165185, 174 151- 153, 174 161- 163, 174547, 174548, 257712-722, 257E23088, 24453, 24458-459, 454184, 312236
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/20863 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.

Claims

1. An electronic device for a vehicle comprising:

a flexible substrate arranged to extend along a flowing path of wind produced by a fan unit; and

a semiconductor package disposed on the flexible substrate to be cooled by the wind, wherein

when an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area,

the flexible substrate electrically connects a touch panel operated by a user to a printed-circuit board on which an electronic component is mounted,

the flexible substrate inclines upwardly between the touch panel and the printed-circuit board, and

the inflow port is located between the touch panel and the printed-circuit board in a thickness direction of the printed-circuit board, and the printed-circuit board is located between the inflow port and the semiconductor package in the thickness direction of the printed-circuit board.

2. The electronic device according to claim 1, wherein

the cross-section area that is larger than the first cross-section area is larger than a cross-section area of a second space to which the wind flows in directly from the inflow port.

3. The electronic device according to claim 1, wherein

the semiconductor package is arranged in the space where a condition that a main path of the wind is separated from the flexible substrate is satisfied due to the wind being reflected by the flexible substrate.

4. The electronic device according to claim 1, further comprising:

a reinforcing board to reinforce the flexible substrate corresponding to a region where the semiconductor package is arranged.

5. The electronic device according to claim 1, further comprising:

a frame having a plane part parallel to the touch panel and the printed-circuit board, and a bent part parallel to the flexible substrate and the semiconductor package.

6. The electronic device according to claim 5, further comprising:

a reinforcing board interposed between the frame and the flexible substrate to reinforce the flexible substrate.

7. The electronic device according to claim 6, further comprising:

a cover covering the semiconductor package, wherein the flowing path of wind is defined between the cover and the flexible substrate, and the cross-section area of the flowing path is defined between the cover and the flexible substrate in a direction perpendicular to the flexible substrate.

8. The electronic device according to claim 7, wherein

the first cross-section area is defined between the cover and an attachment subject, to which the electronic device is attached, in the thickness direction of the printed-circuit board.

9. The electronic device according to claim 7, wherein

the flowing path has a first space between the semiconductor package and the cover, a second space between the inflow port and the first space at an upstream of the first space, and a third space adjacent to a tip end of the frame at a downstream of the second space, and a cross-section area of the first space is larger than a cross-section area of the second space and is larger than a cross-section area of the third space.

10. An electronic device for a vehicle comprising:

a flexible substrate arranged to extend along a flowing path of wind produced by a fan unit;

a reinforcing board configured to reinforce the flexible substrate; and

a semiconductor package disposed on the flexible substrate to be cooled by the wind, wherein

when an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area,

the flexible substrate electrically connects a touch panel operated by a user to a printed-circuit board on which an electronic component is mounted,

the flexible substrate inclines upwardly between the touch panel and the printed-circuit board, and

the inflow port is located between the touch panel and the printed-circuit board in a thickness direction of the printed-circuit board, and the printed-circuit board is located between the inflow port and the semiconductor package in the thickness direction of the printed-circuit board.

11. The electronic device according to claim 10, further comprising:

a frame having a plane part parallel to the touch panel and the printed-circuit board, and a bent part parallel to the flexible substrate and the semiconductor package.

12. The electronic device according to claim 11, further comprising:

a cover covering the semiconductor package, wherein the flowing path of wind is defined between the cover and the flexible substrate, and the cross-section area of the flowing path is defined between the cover and the flexible substrate in a direction perpendicular to the flexible substrate.

13. The electronic device according to claim 12, wherein

the first cross-section area is defined between the cover and an attachment subject, to which the electronic device is attached, in the thickness direction of the printed-circuit board.

14. The electronic device according to claim 12, wherein

the flowing path has a first space between the semiconductor package and the cover, a second space between the inflow port and the first space at an upstream of the first space, and a third space adjacent to a tip end of the frame at a downstream of the second space, and a cross-section area of the first space is larger than a cross-section area of the second space and is larger than a cross-section area of the third space.