Vertical and horizontal circuit assemblies
First Claim
1. An apparatus comprising:
- a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and
an inductor having a coil portion, a first terminal and a second terminal,the coil portion of the inductor being disposed on a first side of the apparatus,the first terminal of the inductor being coupled with the leadframe via a first contact pad, the first contact pad being disposed on a second side of the apparatus that is opposite the first side of the apparatus,the second terminal of the inductor being coupled with the leadframe via a second contact pad, the second contact pad being disposed on the second side of the apparatus, andthe leadframe, the assembly and the inductor being arranged in a stacked configuration.
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Accused Products
Abstract
In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.
19 Citations
20 Claims
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1. An apparatus comprising:
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a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus; an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and an inductor having a coil portion, a first terminal and a second terminal, the coil portion of the inductor being disposed on a first side of the apparatus, the first terminal of the inductor being coupled with the leadframe via a first contact pad, the first contact pad being disposed on a second side of the apparatus that is opposite the first side of the apparatus, the second terminal of the inductor being coupled with the leadframe via a second contact pad, the second contact pad being disposed on the second side of the apparatus, and the leadframe, the assembly and the inductor being arranged in a stacked configuration. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus comprising:
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a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus; an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and an inductor having a coil portion, a first terminal, and a second terminal, the coil portion of the inductor being disposed on a first side of the apparatus, the first terminal of the inductor being coupled with the leadframe via a first contact pad, the first contact pad being disposed on a second side of the apparatus that is opposite that first side of the apparatus, the second terminal of the inductor being coupled with the leadframe via a second contact pad, the second contact pad being disposed on the second side of the apparatus, and the leadframe being disposed between the assembly and the coil portion of the inductor. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification