Tamper-proof electronic packages formed with stressed glass
First Claim
1. A tamper-proof electronic package comprising:
- a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided glass enclosure including a first glass enclosure side and a second glass enclosure side, the second glass enclosure side extending away from the first glass enclosure side, and the first glass enclosure side and the second glass enclosure side each defining a respective side of the secure volume; and
a tamper-respondent detector monitoring, at least in part, the stressed glass to facilitate defining the secure volume, the stressed glass fragmenting with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detecting the fragmenting of the stressed glass, the tamper-respondent detector monitoring structural integrity of the stressed glass via a sensor disposed on an inner surface of the stressed glass within the secure volume, the sensor fragmenting with fragmentation of the stressed glass to facilitate detection of the attempted intrusion event and erasure of confidential information stored within the secure volume.
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Accused Products
Abstract
Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.
243 Citations
19 Claims
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1. A tamper-proof electronic package comprising:
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a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided glass enclosure including a first glass enclosure side and a second glass enclosure side, the second glass enclosure side extending away from the first glass enclosure side, and the first glass enclosure side and the second glass enclosure side each defining a respective side of the secure volume; and a tamper-respondent detector monitoring, at least in part, the stressed glass to facilitate defining the secure volume, the stressed glass fragmenting with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detecting the fragmenting of the stressed glass, the tamper-respondent detector monitoring structural integrity of the stressed glass via a sensor disposed on an inner surface of the stressed glass within the secure volume, the sensor fragmenting with fragmentation of the stressed glass to facilitate detection of the attempted intrusion event and erasure of confidential information stored within the secure volume. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A tamper-proof electronic package comprising:
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a circuit board; a glass enclosure mounted to the circuit board, and enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided glass enclosure including a first glass enclosure side and a second glass enclosure side, the second glass enclosure side extending away from the first glass enclosure side, and the first glass enclosure side and the second glass enclosure side each defining a respective side of the secure volume; a tamper-respondent detector monitoring, at least in part, the stressed glass to facilitate defining the secure volume, the stressed glass fragmenting with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detecting the fragmenting of the stressed glass, the tamper-respondent detector monitoring structural integrity of the stressed glass via a sensor on an inner surface of the stressed glass within the secure volume, the sensor fragmenting with fragmentation of the stressed glass to facilitate detection of the attempted intrusion event and erasure of confidential information stored within the secure volume; and an embedded tamper-respondent sensor within the circuit board, the embedded tamper-respondent sensor further facilitating defining, at least in part, the secure volume. - View Dependent Claims (14, 15, 16)
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17. A fabrication method comprising:
fabricating a tamper-proof electronic package, the fabricating comprising; providing a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided glass enclosure including a first glass enclosure side and a second glass enclosure side, the second glass enclosure side extending away from the first glass enclosure side, and the first glass enclosure side and the second glass enclosure side each defining a respective side of the secure volume; and providing a tamper-respondent detector monitoring, at least in part, the stressed glass to facilitate defining the secure volume, the stressed glass fragmenting with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detecting the fragmenting of the stressed glass, the tamper-respondent detector monitoring structural integrity of the stressed glass via a sensor an inner surface of the stressed glass within the secure volume, the sensor fragmenting with fragmentation of the stressed glass to facilitate detection of the attempted intrusion event and erasure of confidential information stored within the secure volume. - View Dependent Claims (18, 19)
Specification