Laser diode chip on printed circuit board
First Claim
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1. A light source module comprising:
- a multilayer printed circuit board (ML-PCB) having;
a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the plurality of core layers comprises a heat sink plane;
a top layer on a first side of the core having formed thereon a first conducting element and second and third conducting elements respectively on either side of the first conducting element, wherein each of the first, second, and third conducting elements is thermally coupled to the heat sink plane of the at least one of the plurality of core layers by a plurality of microvias;
a bottom layer on a second side of the core opposite the first side; and
a semiconducting light source having a first electrode bonded to the first conducting element with a thermally and electrically conducting epoxy and electrically connected to each of the second and third electrodes by a plurality of bond wires.
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Abstract
A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.
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Citations
20 Claims
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1. A light source module comprising:
a multilayer printed circuit board (ML-PCB) having; a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the plurality of core layers comprises a heat sink plane; a top layer on a first side of the core having formed thereon a first conducting element and second and third conducting elements respectively on either side of the first conducting element, wherein each of the first, second, and third conducting elements is thermally coupled to the heat sink plane of the at least one of the plurality of core layers by a plurality of microvias; a bottom layer on a second side of the core opposite the first side; and a semiconducting light source having a first electrode bonded to the first conducting element with a thermally and electrically conducting epoxy and electrically connected to each of the second and third electrodes by a plurality of bond wires. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A camera comprising:
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a memory; and a light source component comprising; a multilayer printed circuit board (ML-PCB) comprising; a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the plurality of core layers comprises a heat sink plane; a top layer on a first side of the core having formed thereon a first conducting element and second and third conducting elements respectively on either side of the first conducting element, wherein each of the first, second, and third conducting elements is thermally coupled to the heat sink plane of the at least one of the plurality of core layers by a plurality of microvias; a bottom layer on a second side of the core opposite the first side; and a semiconducting light source having a first electrode bonded to the first conducting element with a thermally and electrically conducting epoxy and electrically connected to each of the second and third electrodes by a plurality of bond wires. - View Dependent Claims (17, 18, 19)
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20. A system comprising:
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a memory; and a camera comprising a light source component, the light source component comprising; a multilayer printed circuit board (ML-PCB) comprising; a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the plurality of core layers comprises a heat sink plane; a top layer on a first side of the core having formed thereon a first conducting element and second and third conducting elements respectively on either side of the first conducting element, wherein each of the first, second, and third conducting elements is thermally coupled to the heat sink plane of the at least one of the plurality of core layers by a plurality of microvias; a bottom layer on a second side of the core opposite the first side; and a semiconducting light source having a first electrode bonded to the first conducting element with a thermally and electrically conducting epoxy and electrically connected to each of the second and third electrodes by a plurality of bond wires.
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Specification