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Transient electronic device with ion-exchanged glass treated interposer

  • US 10,262,954 B2
  • Filed: 08/29/2017
  • Issued: 04/16/2019
  • Est. Priority Date: 04/23/2015
  • Status: Active Grant
First Claim
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1. A method for manufacturing a transient electronic device using comprising:

  • subjecting at least one interposer to an ion-exchange treatment, said at least one interposer including a glass substrate having a first surface and an opposing second surface, and including a trigger device on the glass substrate, said trigger device being configured to generate and apply an initial fracture force on said glass substrate in response to a trigger signal;

    fixedly attaching an integrated circuit (IC) die to the treated glass substrate such that a plurality of IC contact points disposed in a first pattern on a surface of the semiconductor substrate are electrically connected to corresponding first interposer contact structures disposed on the first surface of the treated glass substrate; and

    securing the interposer to a package structure such that a plurality of first package contact structures disposed in a second pattern on a surface of the package structure are electrically connected to corresponding second interposer contact structures disposed on the second surface of the treated glass substrate,wherein subjecting the glass substrate to ion-exchange treatment comprises increasing an ion content of the glass substrate such that secondary fractures generated in said glass substrate in response to said initial fracture force propagate through said glass substrate, andwherein fixedly attaching the IC die to the treated glass substrate comprises bonding the IC die such that the secondary fractures propagate into said IC die with sufficient energy to fracture said IC die.

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