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Methods for surface attachment of flipped active components

  • US 10,262,966 B2
  • Filed: 05/25/2018
  • Issued: 04/16/2019
  • Est. Priority Date: 06/08/2011
  • Status: Active Grant
First Claim
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1. A method of making a wafer having transfer-printable active components disposed therein or thereon, comprising:

  • providing a wafer;

    disposing active components in or on the wafer, the active components each comprising a circuit structure having a post surface and an opposing stamp surface, the circuit structure comprising an electronic circuit;

    disposing a plurality of electrically conductive connection posts on each of the active components, the plurality of connection posts protruding from the post surface, wherein the plurality of connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and

    disposing a breakable component tether releasably attaching the circuit structure to the wafer.

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