Methods for surface attachment of flipped active components
First Claim
1. A method of making a wafer having transfer-printable active components disposed therein or thereon, comprising:
- providing a wafer;
disposing active components in or on the wafer, the active components each comprising a circuit structure having a post surface and an opposing stamp surface, the circuit structure comprising an electronic circuit;
disposing a plurality of electrically conductive connection posts on each of the active components, the plurality of connection posts protruding from the post surface, wherein the plurality of connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and
disposing a breakable component tether releasably attaching the circuit structure to the wafer.
3 Assignments
0 Petitions
Accused Products
Abstract
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.
257 Citations
21 Claims
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1. A method of making a wafer having transfer-printable active components disposed therein or thereon, comprising:
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providing a wafer; disposing active components in or on the wafer, the active components each comprising a circuit structure having a post surface and an opposing stamp surface, the circuit structure comprising an electronic circuit; disposing a plurality of electrically conductive connection posts on each of the active components, the plurality of connection posts protruding from the post surface, wherein the plurality of connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and disposing a breakable component tether releasably attaching the circuit structure to the wafer. - View Dependent Claims (2, 3, 4, 5)
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6. An active component, comprising:
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a circuit structure comprising an electronic circuit and connection pads, each of the connection pads electrically connected to the electronic circuit; an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit; and a fractured component tether physically connected to the circuit structure. - View Dependent Claims (7, 8, 9, 10, 11)
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12. A wafer comprising:
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an electronic circuit; connection pads electrically connected to the electronic circuit; an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit; and a breakable component tether releasably attaching the electronic circuit to the wafer. - View Dependent Claims (13, 14)
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15. A method of making a wafer having transfer-printable active components disposed thereon or therein, comprising:
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providing a wafer; disposing an electronic circuit in or on the wafer; disposing connection pads in or on the wafer, each of the connection pads electrically connected to the electronic circuit; disposing an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit; and disposing a breakable component tether releasably attaching the electronic structure to the wafer. - View Dependent Claims (16, 17, 18)
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19. A printed structure comprising:
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a destination substrate comprising electrical contacts; a circuit structure comprising an electronic circuit, connection pads, and a broken tether, wherein each of the connection pads is electrically connected to the electronic circuit; and an electrically conductive connection post protruding from each of the connection pads and electrically connected to the electronic circuit, wherein the connection post is in electrical contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contact to the connection post. - View Dependent Claims (20, 21)
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Specification