Power converter

• US 10,264,695 B2
• Filed: 06/08/2015
• Issued: 04/16/2019
• Est. Priority Date: 09/25/2014
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Matsuo, Takeshi
• Primary Examiner(s): Hoffberg, Robert J
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US15/328,091
• Publication Number:
  US 20170223859A1
• Time in Patent Office: 1,408 Days
• Field of Search: 361676-678, 36167946-67954, 361688-723, 165 801- 805, 16510433, 165185, 174 151- 153, 174 161- 163, 174547, 174548, 257712-722, 257E23088, 24453, 24458-459, 454184, 312236
• CPC Class Codes: H02M 1/14 Arrangements for reducing ripples from dc input or output
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/44 by static converters
• CPC Class Codes: H05K 7/1427 Housings
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A power converter includes a power semiconductor module, a control circuit board, and a case. The power semiconductor module includes a switching element and a metal module case for forming a storage space to store the switching element. The case includes a resin case, a metal case, and a metal base. The resin case stores the power semiconductor module. The metal case stores the control circuit board. The metal base is disposed so as to separate a storage space of the resin case and a storage space of the metal case. The resin case forms a refrigerant flow channel. The metal base includes a first opening. The power semiconductor module is disposed such that the storage space of the module case and the storage space of the metal case are connected via the first opening of the metal base.

Claims

1. A power converter, comprising:

a plurality of power semiconductor modules configured to convert DC power into AC power, wherein each of the power semiconductor modules includes a switching element and a metal module case that stores the switching element;

a control circuit board configured to control each power semiconductor module; and

a case configured to store the plurality of power semiconductor modules and the control circuit board, wherein the case comprises;

a resin case configured to store the plurality of power semiconductor modules in a refrigerant flow channel formed in the resin case, wherein the refrigerant flow channel provides a pathway for a refrigerant to cool the plurality of power semiconductor modules,

a metal case that is electrically coupled to the metal module case of each of the plurality of power semiconductor modules and configured to store the control circuit board, and

a metal base electrically coupled to the metal case and of each of the plurality of power semiconductor that is configured to mechanically couple the resin case to the metal case, wherein the metal base includes a separate opening for each of the plurality of semiconductor modules;

wherein each of the plurality of the power semiconductor modules are disposed in a respective separate opening of the metal base such that each respective module case is projected in the refrigerant flow channel.

2. The power converter according to claim 1, further comprising:

a smoothing capacitor electrically coupled to the plurality of semiconductor modules and configured to smooth the DC power;

wherein the smoothing capacitor is suspended in the refrigerant flow channel by the plurality of semiconductor modules.

3. The power converter according to claim 1, wherein the metal base includes a fixing portion configured to fix the power converter on a vehicle side.

4. A power converter, comprising:

a plurality of power semiconductor modules that each include a power semiconductor element stored in a metal module case;

a control circuit board configured to output a control signal to the plurality of power semiconductor modules;

a metal case to store the control circuit board;

a resin case configured to store the plurality of semiconductor modules and in a refrigerant flow channel space formed in the resin case, wherein the refrigerant flow channel space cools the metal module case of each of the plurality of power semiconductor modules; and

a metal base configured to mechanically couple the metal case to the resin case wherein the metal base includes a plurality of openings wherein each opening corresponds to a respective power semiconductor module of the plurality of semiconductor modules, the plurality of openings configured to communicate an internal space of the metal module case in which each power semiconductor element is stored and a space in which the control circuit board is disposed, and

wherein the power semiconductor element of each of the plurality of power semiconductor modules are connected to the control circuit board via their respective opening.

5. The power converter according to claim 4,

a smoothing capacitor electrically coupled to the plurality of power semiconductor modules and configured to smooth DC power

wherein the smoothing capacitor is suspended in the refrigerant flow channel space by the plurality of power semiconductor modules.