Photonic package and method forming same

• US 10,267,988 B2
• Filed: 10/05/2017
• Issued: 04/23/2019
• Est. Priority Date: 06/30/2017
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Huang, Sung-Hui, Lai, Jui Hsieh, Huang, Tien-Yu, Chen, Wen-Cheng, Lin, Yushun
• Primary Examiner(s): Connelly, Michelle R
• Application Number:
  US15/725,911
• Publication Number:
  US 20190004247A1
• Time in Patent Office: 565 Days
• Field of Search: None
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector

Abstract

A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.

Claims

1. A method comprising:

bonding an electronic die to a photonic die, wherein the photonic die comprises a first opening;

attaching an adapter onto the photonic die, wherein a portion of the adapter is at a same level as a portion of the electronic die;

forming a through-hole penetrating through the adapter, wherein the through-hole is aligned to the first opening;

attaching an optical device to the adapter, wherein the optical device comprises a coupler, wherein the optical device is configured to emit a light into the photonic die or receive a light from the photonic die, wherein an optical fiber of the coupler extends into the through-hole and the first opening;

after the adapter is attached to the photonic die, encapsulating the electronic die and the adapter in an encapsulating material; and

performing a planarization to remove top portions of the adapter and the electronic die, wherein the through-hole is exposed after the planarization.

2. The method of claim 1, wherein the photonic die further comprises a second opening, and the adapter further comprises an additional through-hole aligned to the second opening, and the method further comprises attaching a lamp aligned to the second opening.

3. The method of claim 1, wherein the photonic die is a discrete die that has been sawed from a wafer, and the method further comprises:

after the adapter is attached to the photonic die, dispensing an adhesive between the adapter and the electronic die.

4. The method of claim 1, wherein the attaching the optical device to the adapter comprises disposing at least a portion of the optical device overlapping the adapter.

5. The method of claim 1, wherein the photonic die further comprises a second opening, and the method further comprises:

bonding a lamp to the photonic die, wherein after the adapter is attached, the lamp is located in the second opening in the adapter.

6. The method of claim 1 further comprising forming the adapter comprising:

forming an opening in a blank plate;

forming a protection layer extending into the opening; and

sawing the blank plate having the opening to form a plurality of adapters, with the adapter being one of the plurality of adapters.

7. A method comprising:

forming an adapter comprising;

forming a first opening in a blank plate; and

forming a protection layer having a portion extending into the first opening;

attaching the adapter onto a photonic die, wherein the photonic die is in a wafer;

bonding an electronic die onto the photonic die;

encapsulating the electronic die and the adapter in an encapsulating material;

performing a planarization on the encapsulating material to expose the adapter, the first opening in the adapter, and the electronic die; and

sawing the encapsulating material and the wafer to form a plurality of packages, wherein one of the packages comprises the adapter, the photonic die, and the electronic die.

8. The method of claim 7, further comprising:

forming a second opening in the photonic die, wherein after the adapter is attached to the photonic die, the first opening is joined with the second opening to form a continuous opening.

9. The method of claim 7 further comprising attaching a coupler to the adapter, wherein an optical fiber of the coupler extends into the first opening.

10. The method of claim 9, wherein the optical fiber of the coupler further extends into an additional opening in the photonic die.

11. The method of claim 7 further comprising:

forming a through-via in the photonic die, wherein the through-via penetrates through a semiconductor substrate in the photonic die; and

forming a solder region to electrically couple to the through-via.

12. The method of claim 7, wherein the forming the adapter comprises forming a second opening in the adapter, and the method further comprises:

attaching a lamp on top of the adapter, wherein the lamp is directly over the second opening.

13. The method of claim 7, wherein the forming the adapter comprises forming a second opening in the adapter, and disposing a lamp inside the second opening of the adapter.

14. A package comprising:

a photonic die comprising a first opening;

an electronic die over and bonded to the photonic die;

an adapter over and attached to the photonic die, wherein the adapter comprises a through-hole penetrating through the adapter, and the through-hole is aligned to the first opening;

an optical coupler, wherein a portion of the optical coupler overlaps the through-hole in the adapter, wherein an optical fiber portion of the optical coupler extends into the first opening, and remaining portions of the optical coupler other than the optical fiber portion are outside of the photonic die and the first opening; and

an encapsulant over the photonic die, wherein the electronic die and the adapter are encapsulated in the encapsulant, and wherein top surfaces of the encapsulant, the adapter, and the electronic die are substantially coplanar.

15. The package of claim 14, wherein a portion of the adapter is at a same level as a portion of the electronic die.

16. The package of claim 14, wherein the photonic die further comprises a second opening, and the package further comprises a lamp overlapping the second opening.

17. The package of claim 14, wherein the optical coupler comprises an optical fiber extending into the through-hole and the first opening.

18. The package of claim 14, wherein the adapter comprises a silicon layer, with no active device and passive device formed on the silicon layer.

19. The package of claim 14, wherein the electronic die is electrically connected to devices inside the photonic die.

20. The package of claim 14 further comprising an underfill between the electronic die and the photonic die.