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Thermally conductive closure for electronics

  • US 10,268,012 B2
  • Filed: 03/18/2016
  • Issued: 04/23/2019
  • Est. Priority Date: 03/19/2015
  • Status: Active Grant
First Claim
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1. A closure for optoelectronic circuitry comprising:

  • a base having a sidewall extending upwardly from a bottom, the sidewall defining a cable port;

    cooling pads disposed at the bottom of the base;

    a cover that attaches to the base to close an interior of the closure;

    a circuit board disposed within the interior of the closure, the circuit board including the optoelectronic circuitry; and

    a management tray coupled to the base, the management tray including a platform disposed between the circuit board and the cover, the management tray including a fiber coupling region and a fiber storage region.

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