Memory package, memory module including the same, and operation method of memory package
First Claim
Patent Images
1. A memory package comprising:
- a nonvolatile memory chip;
a volatile memory chip of which an access speed is faster than an access speed of the nonvolatile memory chip; and
a logic chip including a data managing unit, the data managing unit configured to;
receive data from an external device external to the memory package;
determine an attribute of the received data; and
write the received data into one of the volatile memory chipand the nonvolatile memory chip based on the determined attribute,wherein the volatile memory chip, the nonvolatile memory chip and the logic chip are vertically stacked and connected to each other through a through silicon via,wherein the attribute indicates whether the received data are hot data or cold data, the hot data being data frequently accessed by the external device and the cold data being data not frequently accessed by the external device respectively,the data managing unit is configured to set a first address for the hot data to be written into the volatile memory chip, and to set a second address for the cold data to be written into the nonvolatile memory chip,the logic chip is configured to receive a refresh command from the external device, and perform a refresh operation on the volatile memory chip in response to the refresh command,the data managing unit is further configured to determine a first data stored in the nonvolatile memory chip as hot data and migrate the first data to the volatile memory chip through a migration operation, andboth of the refresh operation and the migration operation occur in response to the refresh command.
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Abstract
Disclosed is a memory package. The memory package includes a nonvolatile memory chip, a volatile memory chip of which an access speed is faster than an access speed of the nonvolatile memory chip, and a logic chip for performing a refresh operation about the volatile memory chip in response to a refresh command from an external device, and migrating at least a portion of data stored in the nonvolatile memory chip to the volatile memory chip when the refresh operation is performed.
34 Citations
21 Claims
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1. A memory package comprising:
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a nonvolatile memory chip; a volatile memory chip of which an access speed is faster than an access speed of the nonvolatile memory chip; and a logic chip including a data managing unit, the data managing unit configured to; receive data from an external device external to the memory package; determine an attribute of the received data; and write the received data into one of the volatile memory chip and the nonvolatile memory chip based on the determined attribute, wherein the volatile memory chip, the nonvolatile memory chip and the logic chip are vertically stacked and connected to each other through a through silicon via, wherein the attribute indicates whether the received data are hot data or cold data, the hot data being data frequently accessed by the external device and the cold data being data not frequently accessed by the external device respectively, the data managing unit is configured to set a first address for the hot data to be written into the volatile memory chip, and to set a second address for the cold data to be written into the nonvolatile memory chip, the logic chip is configured to receive a refresh command from the external device, and perform a refresh operation on the volatile memory chip in response to the refresh command, the data managing unit is further configured to determine a first data stored in the nonvolatile memory chip as hot data and migrate the first data to the volatile memory chip through a migration operation, and both of the refresh operation and the migration operation occur in response to the refresh command. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A memory package comprising:
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a package substrate; a plurality of nonvolatile memory chips disposed on the package substrate, the plurality of nonvolatile memory chips being vertically stacked in a stack of chips that includes only nonvolatile memory chips and connected each other by through-silicon vias; a volatile memory chip of which an access speed is faster than an access speed of the nonvolatile memory chip; and a logic chip including a data managing unit, the data managing unit configured to; receive data from an external device external to the memory package; determine an attribute of the received data; and write the received data into one of the volatile memory chip and the nonvolatile memory chip based on the determined attribute, wherein the volatile memory chip and the logic chip are vertically stacked, and disposed on the package substrate horizontally spaced apart from the plurality of nonvolatile memory chips, wherein the attribute indicates whether the received data are hot data or cold data, the hot data being data frequently accessed by the external device and the cold data being data not frequently accessed by the external device respectively, the data managing unit is configured to set a first address for the hot data to be written into the volatile memory chip, and to set a second address for the cold data to be written into the nonvolatile memory chip, the logic chip is configured to receive a refresh command from the external device, and perform a refresh operation on the volatile memory chip in response to the refresh command, the data managing unit is further configured to determine a first data stored in the nonvolatile memory chip as hot data and migrate the first data to the volatile memory chip through a migration operation, and both of the refresh operation and the migration operation occur in response to the refresh command. - View Dependent Claims (13, 14, 15, 16, 17, 19, 20, 21)
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18. The memory package of 12, wherein the logic chip further includes a nonvolatile memory managing unit, and the nonvolatile memory managing unit is configured to perform a garbage collection operation and a wear leveling operation on the nonvolatile memory chip.
Specification