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Etching substrates using ale and selective deposition

  • US 10,269,566 B2
  • Filed: 04/21/2017
  • Issued: 04/23/2019
  • Est. Priority Date: 04/29/2016
  • Status: Active Grant
First Claim
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1. A method of processing substrates, the method comprising:

  • (a) exposing a substrate comprising a first carbon containing material to an oxidant and igniting a first plasma with a first bias power to modify a surface of the first carbon containing material; and

    (b) exposing the modified surface to a second plasma at a second bias power and for a duration sufficient to remove the modified surface without sputtering.

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