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Electronic packages for flip chip devices

  • US 10,269,687 B2
  • Filed: 02/16/2017
  • Issued: 04/23/2019
  • Est. Priority Date: 02/24/2015
  • Status: Active Grant
First Claim
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1. An electronic package comprising:

  • a leadframe having a thickness extending from a top surface of the leadframe to a bottom surface of the leadframe and comprising;

    a first terminal having a plurality of first terminal fingers extending therefrom and a second terminal having a plurality of second terminal fingers extending therefrom wherein the plurality of first terminal fingers are interdigitated with the plurality of second terminal fingers;

    wherein the first terminal and the second terminal have a first thickness extending from the top surface of the leadframe to the bottom surface of the leadframe; and

    wherein the plurality of first terminal fingers and the plurality of second terminal fingers have a second thickness extending from the top surface of the leadframe to an intermediate plane that is located between the top surface and the bottom surface of the leadframe;

    a GaN-based die electrically coupled to the top surface of the leadframe, and including a source pad having a plurality of source fingers and a drain pad having a plurality of drain fingers wherein the plurality of source fingers are interdigitated with the plurality of drain fingers;

    a plurality of interconnects disposed between the GaN-based die and the top surface of the leadframe and configured to provide electrical continuity between the plurality of first terminal fingers and the plurality of drain fingers, and between the plurality of second terminal fingers and the plurality of source fingers, respectively;

    one or more channels formed in the bottom surface of the leadframe to a depth of at least the intermediate plane; and

    an encapsulant encapsulating the GaN-based die and at least a portion of the leadframe, the encapsulant extending from at least a top surface of the GaN-based die to the bottom surface of the leadframe.

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