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Semiconductor element

  • US 10,269,734 B2
  • Filed: 07/16/2015
  • Issued: 04/23/2019
  • Est. Priority Date: 07/16/2015
  • Status: Active Grant
First Claim
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1. A semiconductor element which has an element first main surface, an element second main surface which is a reverse surface of the element first main surface, and element side surfaces and is configured from a semiconductor substrate part and an insulating layer part, the semiconductor element comprising:

  • a signal transmission/reception terminal configured to be provided on the element first main surface and transmit/receive signals to/from an external-substrate signal transmission/reception terminal provided on an external substrate that is external to the semiconductor element in a contact manner; and

    a signal transmission/reception coil configured to be provided on the element side surface and transmit/receive signals to/from an external semiconductor element signal transmission/reception unit which is provided to an external semiconductor element that is external to the semiconductor element via the element side surface in a non-contact manner, whereinthe signal transmission/reception coil includes a conductor that is formed inside the insulating layer part and a conductor that is formed inside the semiconductor substrate part,the semiconductor substrate part is a semiconductor substrate having a semiconductor substrate first main surface, a semiconductor substrate second main surface which is a reverse surface of the semiconductor substrate first main surface, and semiconductor substrate side surfaces,the insulating layer part is an insulating layer which is arranged on the semiconductor substrate first main surface and has an insulating layer main surface which is a reverse surface of a surface in contact with the semiconductor substrate first main surface, and insulating layer side surfaces,the element first main surface is the insulating layer main surface, the element second main surface is the semiconductor substrate second main surface, and the element side surface is formed by the semiconductor substrate side surface and the insulating layer side surface, andthe signal transmission/reception coil includes a pair of coil forming conductors formed inside the insulating layer, a pair of coil forming through conductors passing through the semiconductor substrate and connected to the pair of coil forming conductors, and a coil forming bridge conductor which is formed on the element second main surface and forms a connection between the pair of coil forming through conductors.

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