Hermetic terminal for an AIMD having a composite brazed conductive lead

• US 10,272,252 B2
• Filed: 05/24/2017
• Issued: 04/30/2019
• Est. Priority Date: 11/08/2016
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Seitz, Keith W., Marzano, Thomas, Stevenson, Robert A., Frysz, Christine A., Woods, Jason, Brendel, Richard L., Martino, Marc Gregory
• Primary Examiner(s): Wehrheim, Lindsey G
• Application Number:
  US15/603,521
• Publication Number:
  US 20180126175A1
• Time in Patent Office: 706 Days
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/018 Dielectrics
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 4/236 leading through the housing, i.e. lead-through
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor

Abstract

An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.

Claims

1. A feedthrough attachable to an active implantable medical device (AIMD), the feedthrough comprising:

a) a ferrule, comprising a conductive ferrule body defined as having a ferrule first side opposite a ferrule second side and defining a ferrule opening between and through the ferrule first and second sides;

b) an insulator substrate assembly comprising;

i) an insulator body defined as having an insulator first side opposite an insulator second side, the insulator first side and insulator second side separated and connected by an outer surface, wherein the insulator body is at least partially disposed within the ferrule opening;

ii) at least one via hole disposed through the insulator body and extending from the insulator first side to the insulator second side;

iii) an internal metallization formed at least partially on an inner surface of the at least one via hole;

iv) a first conductive leadwire having a first leadwire first end disposed within the at least one via hole and having a first leadwire second end extending outwardly beyond the insulator first side;

v) a second conductive leadwire which is not of the same material as the first leadwire, the second leadwire having a second leadwire first end disposed within the at least one via hole and having a second leadwire second end extending outwardly beyond the insulator second side;

vi) wherein the first leadwire first end is disposed at or adjacent to the second leadwire first end;

vii) a first braze contacting the first leadwire first end, the second leadwire first end and the internal metallization, the first braze forming a first hermetic seal separating the insulator first side from the insulator second side in the at least one via hole;

viii) an external metallization disposed at least partially on the outer surface of the insulator body,

ix) wherein the insulator body is at least partially disposed within the ferrule opening; and

c) a second braze contacting the external metallization of the insulator body and the conductive ferrule body to thereby form a second hermetic seal at the ferrule opening.

2. The feedthrough of claim 1, further including a feedthrough filter capacitor disposed on the insulator second side, the feedthrough filter capacitor comprising:

a) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the active and ground electrode plates are disposed within a capacitor dielectric;

b) a first passageway disposed through the capacitor dielectric;

c) a capacitor internal metallization disposed within the first passageway and being electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate; and

d) a capacitor external metallization disposed on an outer surface of the capacitor dielectric and being electrically connected to the at least one ground electrode plate and in non-conductive relation with the at least one active electrode plate.

3. The feedthrough of claim 2, further including a third conductive leadwire having a third leadwire first end disposed within the first passageway of the feedthrough filter capacitor and having a third leadwire second end extending outwardly beyond the feedthrough filter capacitor, wherein the second leadwire second end is disposed within the first passageway of the feedthrough filter capacitor, and wherein the second leadwire second end is at or adjacent to the third leadwire first end.

4. The feedthrough of claim 3, further including a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second leadwire second end, the third leadwire first end and the capacitor internal metallization together.

5. The feedthrough of claim 4, wherein the first electrically conductive material is selected from the group consisting of a solder, a solder BGA, a solder paste, an epoxy, and a polyimide.

6. The feedthrough of claim 4, further including a second electrically conductive material electrically connecting the capacitor external metallization to at least one of the ferrule and the second braze.

7. The feedthrough of claim 1, further including at least one internal ground plate disposed within the insulator body, the internal ground plate electrically connecting the internal metallization on the inner surface of the at least one via hole to the external metallization on the outer surface of the insulator body.

8. The feedthrough of claim 1, wherein the first braze and second braze are connected by a braze channel.

9. The feedthrough of claim 1, further including a conductive clip electrically coupled between and to the second conductive leadwire and the ferrule.

10. The feedthrough of claim 1, wherein the ferrule includes a conductive peninsula extending at least partially into the ferrule opening, and wherein the first braze electrically couples the second leadwire to the conductive peninsula.

11. The feedthrough of claim 1, further including a chip capacitor disposed on the second insulator side, the chip capacitor comprising:

a) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the active and ground electrode plates are disposed within a capacitor dielectric;

b) an active capacitor metallization electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate; and

c) a ground capacitor metallization electrically connected to the at least one ground electrode plate and in non-conductive relation with the at least one active electrode plate.

12. The feedthrough of claim 11, further including a first electrically conductive material electrically coupling the active capacitor metallization to the second conductive leadwire.

13. The feedthrough of claim 12, further including a second electrically conductive material electrically coupling the ground capacitor metallization to at least one of the ferrule and the second gold braze.

14. The feedthrough of claim 13, wherein the chip capacitor is attached to the insulator body.

15. The feedthrough of claim 13, wherein the chip capacitor is attached to a circuit board, and wherein the circuit board is attached to the insulator body.

16. The feedthrough of claim 12, further including an oxide-resistant metal addition, wherein a second electrically conductive material electrically couples the ground capacitor metallization to the oxide-resistant metal addition, and wherein a third electrically conductive material electrically connects the oxide-resistant metal addition to the ferrule or wherein the oxide-resistant metal addition is welded to the ferrule.

17. The feedthrough of claim 1, wherein the second conductive leadwire comprises platinum or palladium.

18. The feedthrough of claim 17, wherein the first conductive leadwire comprises niobium or tantalum.

19. The feedthrough of claim 1, wherein the first braze and second braze each comprise a gold braze.

20. The feedthrough of claim 19, wherein the first braze is disposed at or adjacent to the insulator second side, but does not extend to the insulator first side.

21. The feedthrough of claim 19, wherein the first braze is disposed at or adjacent to the insulator first side, but does not extend to the insulator second side.

22. The feedthrough of claim 1, wherein the third leadwire first end is pre-tinned.

23. The feedthrough of claim 1, wherein the first and second hermetic seals have a leak rate that is not greater than 1×

10<sup>−

7</sup> std cc He/sec.

24. The feedthrough of claim 1, wherein the external metallization disposed on the outer surface of the insulator body comprises an adhesion metallization and a wetting metallization, and wherein the adhesion metallization is disposed at least partially on the outer surface of the insulator body and wherein the wetting metallization is disposed on the adhesion metallization.

25. The feedthrough of claim 2, wherein an insulative washer is disposed between the insulator substrate assembly and the feedthrough filter capacitor.

26. The feedthrough of claim 1, wherein the ferrule is configured to be joined to a housing for the AIMD by a laser weld or braze.

27. The feedthrough of claim 1, wherein the ferrule is formed from and as a continuous part of a housing for the AIMD.

28. The feedthrough of claim 1, wherein, when the feedthrough assembly is attached to a housing for the AIMD, the insulator first side is a body fluid side that resides outside the AIMD and the insulator second side is a device side that resides inside the AIMD.

29. An insulative feedthrough that is configured to attachable to an active implantable medical device (AIMD), the insulative feedthrough comprising:

a) a feedthrough body comprising a material which is both electrically insulative and biocompatible, wherein the feedthrough body has a body fluid side opposite a device side, wherein, when the feedthrough body is attached to a housing for the AIMD, the body fluid side of the feedthrough body resides outside the AIMD and the device side of the feedthrough body resides inside the AIMD;

b) a passageway disposed through the feedthrough body extending from the body fluid side to the device side;

c) a composite conductor disposed within the passageway, the composite conductor comprising a body fluid side metallic wire electrically conductive to a device side metallic wire,

i) wherein the body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side;

ii) wherein the device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side;

iii) wherein the body fluid side metallic wire is hermetically sealed to the feedthrough body by a braze;

iv) wherein the body fluid side metallic wire is biocompatible;

v) wherein the body fluid side metallic wire is not the same material as the device side metallic wire; and

vi) wherein the body fluid side metallic wire is conductively connected to the device side metallic wire by at least one of the braze and a weld.

30. The insulative feedthrough of claim 29, further including a ferrule made from an electrically conductive material, the ferrule configured to be hermetically sealed to a housing of the active implantable medical device, wherein the ferrule defines a ferrule opening and the feedthrough body is hermetically sealed to the ferrule closing the ferrule opening.

31. The insulative feedthrough of claim 30, wherein the ferrule comprises titanium.

32. The insulative feedthrough of claim 31, wherein the hermetic seal between the ferrule and the feedthrough body comprises an adhesion layer disposed on an outer surface of the feedthrough body, a wetting layer disposed on the adhesion layer, and a gold braze hermetically sealing the wetting layer to the ferrule.

33. The insulative feedthrough of claim 32, wherein the ferrule opening defines an inner ferrule surface, and wherein the feedthrough body is at least partially disposed within ferrule opening and hermetically sealed by the gold braze to the ferrule inner surface.

34. The insulative feedthrough of claim 29, wherein the device side metallic wire is not biocompatible.

35. The insulative feedthrough of claim 29, wherein the body fluid side metallic wire comprises platinum.

36. The insulative feedthrough of claim 35, wherein the body fluid side metallic wire comprising platinum does not include iridium.

37. The insulative feedthrough of claim 29, wherein the second end of the body fluid side metallic wire extends outwardly beyond the feedthrough body on the body fluid side.

38. The insulative feedthrough of claim 29, wherein the second end of the device side metallic wire extends outwardly beyond the feedthrough body on the device side.

39. The insulative feedthrough of claim 29, wherein the second end of the body fluid side metallic wire is aligned with a body fluid side surface of the feedthrough body.

40. The insulative feedthrough of claim 29, wherein the second end of the device side metallic wire is aligned with a device side surface of the feedthrough body.

41. The insulative feedthrough of claim 29, wherein the second end of the body fluid side metallic wire is recessed inwardly from a body fluid side surface of the feedthrough body.

42. The insulative feedthrough of claim 29, wherein the second end of the device side metallic wire is recessed inwardly from a device side surface of the feedthrough body.

43. The insulative feedthrough of claim 29, wherein the first end of the body fluid side metallic wire is soldered or welded to the first end of the device side metallic wire.

44. The insulative feedthrough of claim 29, wherein the hermetic seal between the body fluid side metallic wire and the feedthrough body comprises an adhesion layer disposed on an inner surface of the passageway, a wetting layer disposed on the adhesion layer, and a gold braze hermetically sealing the wetting layer to the body fluid side metallic wire.

45. The insulative feedthrough of claim 44, wherein the gold braze is connected to the device side metallic wire.

46. The insulative feedthrough of claim 29, further including a capacitor disposed on the device side of the feedthrough body, wherein the capacitor comprises at least one active electrode plate and at least one ground electrode plate disposed within a capacitor dielectric, and wherein an active metallization is electrically connected to the at least one active electrode plate and a ground metallization is electrically connected to the at least one ground electrode plate.

47. The insulative feedthrough of claim 46, wherein the active metallization is in electrical communication with the device side metallic wire, and wherein the ground metallization is in electrical communication with the ferrule.

48. The insulative feedthrough of claim 47, wherein the capacitor is a chip capacitor.

49. The insulative feedthrough of claim 48, wherein the chip capacitor is mounted to the feedthrough body.

50. The insulative feedthrough of claim 48, wherein the chip capacitor is mounted to a circuit board, and wherein the circuit board is mounted to the feedthrough body.

51. The insulative feedthrough of claim 47, wherein the capacitor is a feedthrough capacitor.

52. The insulative feedthrough of claim 51, wherein the feedthrough capacitor is mounted to an adhesive washer and the adhesive washer is mounted to the feedthrough body.

53. The insulative feedthrough of claim 52, wherein the second end of the device side metallic wire extends outwardly beyond the feedthrough body on the device side and is disposed within a metallized via formed through the feedthrough capacitor, and wherein the metallization of the metallized via comprises the active metallization.

54. The insulative feedthrough of claim 53, further including a third wire disposed on the device side and extending into the metallized via of the capacitor.

55. The insulative feedthrough of claim 54, further including a conductive material electrically connected to the second end of the device side metallic wire, to the third wire, and to the active metallization of the capacitor.

56. The insulative feedthrough of claim 30, further including an internally grounded capacitor disposed on the device side of the feedthrough body, wherein the capacitor comprises at least one active electrode plate and at least one ground electrode plate disposed within a capacitor dielectric, and wherein an active metallization is electrically connected to the at least one active electrode plate and a ground metallization is electrically connected to the at least one ground electrode plate, wherein the active metallization is formed within an active via disposed through the capacitor dielectric and the ground metallization is formed within a ground via disposed through the capacitor, wherein the capacitor does not have an external metallization on an outer surface of the capacitor dielectric and the ground electrode plate does not extend to the outer surface of the capacitor.

57. The insulative feedthrough of claim 56, wherein the feedthrough body comprises a conductive pathway in electrical communication with the ferrule on one end of the conductive pathway and in electrical communication with the ground metallization on an opposite end of the electrical pathway.

58. The insulative feedthrough of claim 57, wherein the conductive pathway comprises a gold braze.

59. The insulative feedthrough of claim 58, wherein the gold braze also hermetically seals the feedthrough body to the ferrule.

60. The insulative feedthrough of claim 59, further including a conductive pin in electrical communication with the ground metallization on one end of the conductive pin and in electrical communication with the gold braze on an opposite end of the conductive pin.

61. The insulative feedthrough of claim 57, wherein the conductive pathway comprises at least one conductive ground layer disposed within the feedthrough body.

62. The insulative feedthrough of claim 61, further including a conductive pin in electrical communication with the ground metallization on one end of the conductive pin and in electrical communication with the conductive ground layer on an opposite end of the conductive pin.

63. The insulative feedthrough of claim 56, wherein the ferrule includes an extension extending into the ferrule opening, and wherein a conductive wire is electrically connected to the ferrule extension and also electrically connected to the ground metallization of the internally grounded capacitor.

64. The insulative feedthrough of claim 29, comprising:

a) a ferrule made from a conductive material, the ferrule configured to be hermetically sealed to a housing of the active implantable medical device, wherein the ferrule defines a ferrule opening and the feedthrough body is hermetically sealed to the ferrule closing the ferrule opening;

b) a feedthrough capacitor disposed on the device side of the feedthrough body, wherein the feedthrough capacitor comprises at least one active electrode plate and at least one ground electrode plate disposed within a capacitor dielectric, and wherein an active metallization is electrically connected to the at least one active electrode plate and a ground metallization is electrically connected to the at least one ground electrode plate;

c) a gold braze attached to the ferrule on the device side; and

d) an electrically conductive fill connecting the ground metallization to the gold braze.

65. The insulative feedthrough of claim 30, wherein the feedthrough body comprises a glass insulator, wherein the hermetic seal between the feedthrough body and the ferrule is characterized as having been formed at the same time as the hermetic seal between the composite conductor and the feedthrough body.

66. The insulative feedthrough of claim 64, further including an alumina washer disposed over the feedthrough body on the body fluid side.

67. An insulator substrate assembly, comprising:

a) an insulator body configured to be attachable to a ferrule or a housing of an active implantable medical device, the insulator body defined as having an insulator first side opposite an insulator second side, the insulator first side and insulator second side separated and connected by an insulator outer surface;

b) at least one via hole disposed through the insulator body extending from the insulator first side to the insulator second side;

c) a first conductive leadwire having a first leadwire first end disposed within the at least one via hole and having a first leadwire second end disposed at or extending outwardly beyond the insulator first side;

d) a second conductive leadwire having a second leadwire first end disposed within the at least one via hole and having a second leadwire second end disposed at or extending outwardly beyond the insulator second side, wherein the first leadwire is not the same material as the second leadwire,

e) wherein the first leadwire first end is disposed at or adjacent to the second leadwire first end,

f) wherein the first leadwire and second leadwire are in electrical communication with each other, and

g) wherein at least the first leadwire is hermetically sealed within the at least one via hole to the insulator body.