Hermetic terminal for an active implantable medical device with composite co-fired filled via and body fluid side brazed leadwire
First Claim
1. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
- a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD;
b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the feedthrough is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively;
c) at least one via hole extending along a longitudinal axis and defined by a via hole inner surface extending through the alumina insulator to the insulator body fluid side and to the insulator device side;
d) a layer of a ceramic reinforced metal composite comprising alumina and platinum contacting the via hole inner surface, the layer of ceramic reinforced metal composite extending from a ceramic reinforced metal ceramic first end residing at or adjacent to the insulator device side to a ceramic reinforced metal ceramic second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the ceramic reinforced metal composite is spaced toward the longitudinal axis with respect to the via hole inner surface;
e) a substantially pure platinum material contacting the ceramic reinforced metal composite inner surface, the substantially pure platinum material extending from a substantially pure platinum material first end residing at or adjacent to the insulator device side to a substantially pure platinum material second end recessed inwardly into the via hole from the insulator body fluid side;
f) a via hole metallization contacted to the via hole inner surface and to at least the second end of the substantially pure platinum material, the via hole metallization extending toward the insulator body fluid side; and
g) a metallic leadwire at least partially disposed in the at least one via hole at the insulator body fluid side, wherein the leadwire is gold brazed to the via hole metallization so that the gold braze separates the insulator body fluid side from the insulator device side in the at least one via hole, andh) wherein the leadwire is in electrical communication with the gold braze, the via hole metallization and the substantially pure platinum material, thereby forming an electrically conductive pathway extending from the leadwire adjacent to the insulator body fluid side to the first end of the substantially pure platinum material residing at or adjacent and to the insulator device side.
2 Assignments
0 Petitions
Accused Products
Abstract
A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.
56 Citations
30 Claims
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1. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD; b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the feedthrough is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively; c) at least one via hole extending along a longitudinal axis and defined by a via hole inner surface extending through the alumina insulator to the insulator body fluid side and to the insulator device side; d) a layer of a ceramic reinforced metal composite comprising alumina and platinum contacting the via hole inner surface, the layer of ceramic reinforced metal composite extending from a ceramic reinforced metal ceramic first end residing at or adjacent to the insulator device side to a ceramic reinforced metal ceramic second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the ceramic reinforced metal composite is spaced toward the longitudinal axis with respect to the via hole inner surface; e) a substantially pure platinum material contacting the ceramic reinforced metal composite inner surface, the substantially pure platinum material extending from a substantially pure platinum material first end residing at or adjacent to the insulator device side to a substantially pure platinum material second end recessed inwardly into the via hole from the insulator body fluid side; f) a via hole metallization contacted to the via hole inner surface and to at least the second end of the substantially pure platinum material, the via hole metallization extending toward the insulator body fluid side; and g) a metallic leadwire at least partially disposed in the at least one via hole at the insulator body fluid side, wherein the leadwire is gold brazed to the via hole metallization so that the gold braze separates the insulator body fluid side from the insulator device side in the at least one via hole, and h) wherein the leadwire is in electrical communication with the gold braze, the via hole metallization and the substantially pure platinum material, thereby forming an electrically conductive pathway extending from the leadwire adjacent to the insulator body fluid side to the first end of the substantially pure platinum material residing at or adjacent and to the insulator device side. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD; b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the feedthrough is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively; c) at least one via hole extending along a longitudinal axis and defined by a via hole inner surface extending through the alumina insulator to the insulator body fluid side and to the insulator device side; d) a layer of a ceramic reinforced metal composite comprising alumina and platinum contacting the via hole inner surface, the layer of ceramic reinforced metal composite extending from a ceramic reinforced metal ceramic first end residing at or adjacent to the insulator device side to a ceramic reinforced metal ceramic second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the ceramic reinforced metal composite is spaced toward the longitudinal axis with respect to the via hole inner surface; e) a platinum wire contacting the ceramic reinforced metal composite inner surface, the platinum wire extending from a platinum wire first end residing at or adjacent to the insulator device side to a platinum wire second end recessed inwardly into the via hole from the insulator body fluid side; f) a via hole metallization contacted to the via hole inner surface and to the second ends of the ceramic reinforced metal composite and the platinum wire, the via hole metallization extending toward the insulator body fluid side; and g) a metallic leadwire at least partially disposed in the at least one via hole at the insulator body fluid side, wherein the leadwire is gold brazed to the via hole metallization so that the gold braze separates the insulator body fluid side from the insulator device side in the at least one via hole, and h) wherein the metallic leadwire is in electrical communication with the gold braze, the via hole metallization and the platinum wire, thereby forming an electrically conductive pathway extending to the metallic leadwire adjacent to the insulator body fluid side and to the platinum wire first end at or adjacent to the insulator device side. - View Dependent Claims (20, 21, 22, 23, 24)
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25. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD; b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the feedthrough is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively; c) at least one via hole extending along a longitudinal axis and defined by a via hole inner surface extending through the alumina insulator to the insulator body fluid side and to the insulator device side; d) a layer of a ceramic reinforced metal composite comprising alumina and platinum contacting the via hole inner surface, the layer of ceramic reinforced metal composite extending from a ceramic reinforced metal ceramic first end residing at or adjacent to the insulator device side to a ceramic reinforced metal ceramic second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the ceramic reinforced metal composite is spaced toward the longitudinal axis with respect to the via hole inner surface; e) a substantially pure platinum material contacting the ceramic reinforced metal composite inner surface, the substantially pure platinum material extending from a substantially pure platinum material first end residing at or adjacent to the insulator device side to a substantially pure platinum material second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the substantially pure platinum material is spaced toward the longitudinal axis with respect to the inner surface of the ceramic reinforced metal composite; f) a first platinum wire contacting the substantially pure platinum material inner surface and extending from a first platinum wire first end residing at or adjacent to the insulator device side to a first platinum wire second end recessed inwardly into the via hole from the insulator body fluid side; g) a via hole metallization contacted to the via hole inner surface and to the first platinum wire second end, the via hole metallization extending toward the insulator body fluid side; and h) a second platinum wire at least partially disposed in the at least one via hole at the insulator body fluid side, wherein the second platinum wire is gold brazed to the via hole metallization so that the gold braze separates the insulator body fluid side from the insulator device side in the at least one via hole, and i) wherein the second platinum wire is in electrical communication with the gold braze, the via hole metallization, and the first platinum wire, thereby forming an electrically conductive pathway extending from the second platinum wire adjacent to the insulator body fluid side to the first end of the first platinum wire residing at or adjacent and to the insulator device side. - View Dependent Claims (26, 27, 28, 29, 30)
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Specification