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Hermetic terminal for an active implantable medical device with composite co-fired filled via and body fluid side brazed leadwire

  • US 10,272,253 B2
  • Filed: 10/30/2017
  • Issued: 04/30/2019
  • Est. Priority Date: 11/10/2016
  • Status: Active Grant
First Claim
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1. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:

  • a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD;

    b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the feedthrough is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively;

    c) at least one via hole extending along a longitudinal axis and defined by a via hole inner surface extending through the alumina insulator to the insulator body fluid side and to the insulator device side;

    d) a layer of a ceramic reinforced metal composite comprising alumina and platinum contacting the via hole inner surface, the layer of ceramic reinforced metal composite extending from a ceramic reinforced metal ceramic first end residing at or adjacent to the insulator device side to a ceramic reinforced metal ceramic second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the ceramic reinforced metal composite is spaced toward the longitudinal axis with respect to the via hole inner surface;

    e) a substantially pure platinum material contacting the ceramic reinforced metal composite inner surface, the substantially pure platinum material extending from a substantially pure platinum material first end residing at or adjacent to the insulator device side to a substantially pure platinum material second end recessed inwardly into the via hole from the insulator body fluid side;

    f) a via hole metallization contacted to the via hole inner surface and to at least the second end of the substantially pure platinum material, the via hole metallization extending toward the insulator body fluid side; and

    g) a metallic leadwire at least partially disposed in the at least one via hole at the insulator body fluid side, wherein the leadwire is gold brazed to the via hole metallization so that the gold braze separates the insulator body fluid side from the insulator device side in the at least one via hole, andh) wherein the leadwire is in electrical communication with the gold braze, the via hole metallization and the substantially pure platinum material, thereby forming an electrically conductive pathway extending from the leadwire adjacent to the insulator body fluid side to the first end of the substantially pure platinum material residing at or adjacent and to the insulator device side.

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