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Method for manufacturing microelectromechanical system structure having a cavity and through-holes of different widths

  • US 10,273,152 B2
  • Filed: 01/31/2018
  • Issued: 04/30/2019
  • Est. Priority Date: 09/27/2017
  • Status: Active Grant
First Claim
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1. A method for manufacturing a microelectromechanical system (MEMS) structure, comprising:

  • forming a first trench and a second trench in a MEMS substrate by performing a main etching process;

    etching the MEMS substrate through the first trench and the second trench to form a first through hole and an extended second trench by performing a first step of an over-etching process; and

    etching the MEMS substrate through the extended second trench to form a second through hole by performing a second step of the over-etching process,wherein a width of the first trench is greater than a width of the second trench, and a height of the first trench is greater than ¾

    of a height of the MEMS substrate, and a height of the second trench is smaller than ⅔

    of the height of the MEMS substrate.

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