Optical image stabilization (OIS) unit of a camera module
First Claim
1. An OIS (Optical Image Stabilization) unit, comprising;
- a housing comprising a base and a first substrate;
a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis;
a wire connecting the housing and the holder module;
a first coil disposed on a periphery of the bobbin;
a magnet configured to move the bobbin relative to the holder module by interacting with the first coil;
a second coil configured to move the holder module relative to the housing by interacting with the magnet;
a first solder disposed at a distal end of the wire to couple the wire to the housing;
a second solder disposed at the other distal end of the wire to couple the wire to the holder module; and
a buffer portion disposed at a part of the wire by being distanced from at least one of the first solder and the second solder to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module,wherein the wire and the spring member are electrically connected through the second solder.
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Accused Products
Abstract
An Optical Image Stabilization unit including a wire connecting a housing to a holder module, a bobbin disposed inside the outer blade, a spring member disposed at the outer blade to support a movement of the bobbin in a direction along an optical axis, a first coil disposed at a periphery of the bobbin, a magnet moving the bobbin relative to the holder module by interacting with the first coil, a second coil moving the holder module relative to the housing by interacting with the magnet, a first solder portion disposed at a distal end of the wire to couple the wire to the housing, a second solder portion disposed at the other distal end of the wire to couple the wire to the holder module, and a buffer portion disposed at a part of the wire by being distanced from at least one of the first solder portion and the second solder portion to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module.
18 Citations
30 Claims
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1. An OIS (Optical Image Stabilization) unit, comprising;
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a housing comprising a base and a first substrate; a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis; a wire connecting the housing and the holder module; a first coil disposed on a periphery of the bobbin; a magnet configured to move the bobbin relative to the holder module by interacting with the first coil; a second coil configured to move the holder module relative to the housing by interacting with the magnet; a first solder disposed at a distal end of the wire to couple the wire to the housing; a second solder disposed at the other distal end of the wire to couple the wire to the holder module; and a buffer portion disposed at a part of the wire by being distanced from at least one of the first solder and the second solder to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module, wherein the wire and the spring member are electrically connected through the second solder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An OIS (Optical Image Stabilization) unit, comprising:
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a housing; a holder module comprising an outer blade spaced apart from a base, a bobbin disposed in the outer blade, and a spring member disposed on the outer blade to support a movement of the bobbin in a direction along an optical axis; a wire connecting the housing and the holder module; a first coil disposed on a periphery of the bobbin; a magnet configured to move the bobbin relative to the holder module by interacting with the first coil; a second coil configured to move the holder module relative to the housing by interacting with the magnet; a first solder disposed at a distal end of the wire to couple the wire to the housing; a second solder disposed at the other distal end of the wire to couple the wire to the holder module; and a buffer portion comprising a portion disposed between the first solder and the second solder to attach the wire to at least one of the housing and the holder module, wherein the buffer portion contacts at least one of the first solder and the second solder. - View Dependent Claims (27, 28, 29, 30)
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Specification