Methods and apparatus for obtaining diagnostic information relating to an industrial process

• US 10,274,834 B2
• Filed: 03/08/2018
• Issued: 04/30/2019
• Est. Priority Date: 10/02/2013
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Ypma, Alexander, Menger, Jasper, Deckers, David, Han, David, Koopman, Adrianus Cornelis Matheus, Lyulina, Irina, Middlebrooks, Scott Anderson, Van Haren, Richard Johannes Franciscus, Wildenberg, Jochem Sebastiaan
• Primary Examiner(s): Iacoletti, Michelle M
• Application Number:
  US15/915,674
• Publication Number:
  US 20180253015A1
• Time in Patent Office: 418 Days
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
• CPC Class Codes: G03F 7/70616 Monitoring the printed patterns
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 7/70641 Focus
• CPC Class Codes: G03F 7/706837 Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
• CPC Class Codes: G03F 9/7092 Signal processing
• CPC Class Codes: G06F 16/26 Visual data mining; Browsing structured data

Abstract

In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Claims

1. A method comprising:

obtaining object data for a set of physical product units that have been subjected nominally to a same device manufacturing process;

obtaining performance data representing one or more performance parameters measured for each product unit of the set of product units;

performing, by a hardware computer system, a multivariate analysis on the object data to decompose the object data into one or more fingerprints;

correlating, by the hardware computer system, the performance data to the one or more obtained fingerprints;

determining, by the hardware computer system, a correction based on the correlation between the performance data and the one or more obtained fingerprints; and

based on the determined correction, output electronic data for configuration or modification of the device manufacturing process or of a measurement process of physical product units subjected to the device manufacturing process.

2. The method of claim 1, wherein the object data for each product unit comprises a residual resulting from one or more parameters measured on the product unit at points spatially distributed across the product unit being subjected to a correction obtainable in the device manufacturing process.

3. The method of claim 1, wherein the object data comprises a height map of a physical product unit.

4. The method of claim 1, wherein the object data comprises alignment data of a physical product unit.

5. The method of claim 1, wherein the performance data comprises overlay data and/or critical dimension data.

6. The method of claim 1, wherein the performance data is measured by a metrology tool.

7. The method of claim 1, wherein the correlating comprises using linear regression to obtain a degree of correlation between the performance data and the one or more obtained fingerprints.

8. The method of claim 1, wherein the determining of the correction is further based on user interaction.

9. An apparatus configured to at least:

collect object data for a set of physical product units that have been subjected nominally to a same device manufacturing process;

perform a multivariate analysis on the object data to decompose the object data into one or more fingerprints;

visualize the one or more fingerprints;

determine a labeling of the one or more fingerprints;

estimate a performance impact of the one or more fingerprints; and

based on the estimated performance impact, output electronic data for configuration or modification of the device manufacturing process or of a measurement process of physical product units subjected to the device manufacturing process.

10. The apparatus of claim 9, wherein the performance impact comprises an overlay error.

11. The apparatus of claim 9, wherein the estimate of the performance impact is based on a correlation analysis between (i) height and/or alignment data and (ii) overlay data and/or critical dimension data.

12. The apparatus of claim 9, further comprising a user interface.

13. The apparatus of claim 12, wherein the user interface provides for an operator to ask for relevancy of the one or more fingerprints.

14. The apparatus of claim 9, further configured to provide automatic clustering of the object data.

15. The apparatus of claim 9, further configured to provide visualization of scatter of the object data.

16. The apparatus of claim 9, further configured to provide generation of a correction to an apparatus used in the device manufacturing process.

17. A non-transitory computer program product comprising machine readable instructions configured to cause a computer system to at least:

obtain object data for a set of physical product units that have been subjected nominally to a same device manufacturing process;

obtain performance data representing one or more performance parameters measured for each product unit of the set of product units;

perform a multivariate analysis on the object data to decompose the object data into one or more fingerprints;

correlate the performance data to the one or more obtained fingerprints;

determine a correction based on the correlation between the performance data and the one or more obtained fingerprints; and

based on the determined correction, output electronic data for configuration or modification of the device manufacturing process or of a measurement process of physical product units subjected to the device manufacturing process.

18. The non-transitory computer program product of claim 17, wherein the object data for each product unit comprises a residual resulting from one or more parameters measured on the product unit at points spatially distributed across the product unit being subjected to a correction obtainable in the device manufacturing process.

19. A non-transitory computer program product comprising machine readable instructions configured to cause a computer system to at least:

collect object data for a set of physical product units that have been subjected nominally to a same device manufacturing process;

perform a multivariate analysis on the object data to decompose the object data into one or more fingerprints;

visualize the one or more fingerprints;

determine a labeling of the one or more fingerprints;

estimate a performance impact of the one or more fingerprints; and

based on the estimated performance impact, output electronic data for configuration or modification of the device manufacturing process or of a measurement process of physical product units subjected to the device manufacturing process.

20. The non-transitory computer program product of claim 19, wherein the estimate of the performance impact is based on a correlation analysis between (i) height and/or alignment data and (ii) overlay data and/or critical dimension data.