Signal relay board for power semiconductor modules

• US 10,276,386 B2
• Filed: 06/29/2017
• Issued: 04/30/2019
• Est. Priority Date: 08/17/2016
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Makino, Ryohei, Kubouchi, Motoyoshi, Takahashi, Kiyoshi
• Primary Examiner(s): Ahmed, Selim U
• Application Number:
  US15/638,009
• Publication Number:
  US 20180053654A1
• Time in Patent Office: 670 Days
• CPC Class Codes: H01L 21/22 Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
• CPC Class Codes: H01L 21/24 Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body H01L21/182 takes precedence
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/48 using discharge tubes with control electrode or semiconductor devices with control electrode
• CPC Class Codes: H05K 1/00 Printed circuits
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections

Abstract

Signal relay board for power semiconductor modules enabling electrical connection between power semiconductor modules and a drive unit driving same. A first wire layer, a second wire layer, a third wire layer, and a fourth wire layer of a multiphase wire portion are assigned with a first control wire layer serving as a path to provide a control signal to a first semiconductor device of the modules, a first ground wire layer serving as a path to provide a ground potential to a low potential side terminal of the first semiconductor device of the semiconductor modules, a second control wire layer serving as a path to provide a control signal to a second semiconductor device of the modules, and a second ground wire layer serving as a path to provide a ground potential to the second semiconductor device of the modules.

Claims

1. A signal relay board for power semiconductor modules configured to provide connection between a plurality of power semiconductor modules which houses a first semiconductor device and a second semiconductor device connected in series and a drive unit which drives the first semiconductor device and the second semiconductor device, the signal relay board for power semiconductor modules comprising:

a multiphase wire portion in which a first wire layer, a second wire layer, a third wire layer, and a fourth wire layer are stacked in this order, wherein the first wire layer, the second wire layer, the third wire layer, and the fourth wire layer are respectively assigned with a first control wire layer which serves as a path to provide a control signal to the first semiconductor device of the plurality of power semiconductor modules, a first ground wire layer which serves as a path to provide a ground potential to a low potential side terminal of the first semiconductor device of the plurality of power semiconductor modules, a second control wire layer which serves as a path to provide a control signal to the second semiconductor device of the plurality of power semiconductor modules, and a second ground wire layer which serves as a path to provide a ground potential to the second semiconductor device of the plurality of power semiconductor modules.

2. The signal relay board for power semiconductor modules according to claim 1, further comprising a first wiring pair composed of the first control wire layer and the first ground wire layer arranged adjacent to each other, and a second wiring pair composed of the second control wire layer and the second ground wire layer arranged adjacent to each other.

3. The signal relay board for power semiconductor modules according to claim 1, wherein the first control wire layer, the first ground wire layer, the second control wire layer, and the second ground wire layer are stacked in this order.

4. The signal relay board for power semiconductor modules according to claim 2, wherein with respect to each of the first wiring pair and the second wiring pair, a control wiring pattern and a ground wiring pattern are formed to face each other.

5. The signal relay board for power semiconductor modules according to claim 1, wherein an insulation property between the second wire layer and the third wire layer is set to be greater than an insulation property between the first wire layer and the second wire layer and an insulation property between the third wire layer and the fourth wire layer.

6. The signal relay board for power semiconductor modules according to claim 1, wherein a board core member is arranged between the second wire layer and the third wire layer.

7. The signal relay board for power semiconductor modules according to claim 2, wherein with respect to each of the first wiring pair and the second wiring pair, the wiring pattern is configured such that a wire length between the drive unit and each of the plurality of power semiconductor modules is equal.

8. The signal relay board for power semiconductor modules according to claim 1, wherein the multiphase wire portion is configured to mount a passive electronic component on at least one of a front surface and a rear surface.

9. The signal relay board for power semiconductor modules according to of claim 1, wherein a wiring pattern formed on a front surface or a wire layer near the front surface and a second wiring pattern formed on a rear surface or a wire layer near the rear surface are arranged symmetrically as viewed from the front surface, a passive electronic component mounted on the front surface and a passive electronic component mounted on the rear surface are arranged symmetrically as viewed from the front surface, and a pattern for mounting the passive electronic component mounted on the front surface, and a pattern for mounting the passive electronic component on the rear surface are arranged symmetrically as viewed from the front surface.

10. The signal relay board for power semiconductor modules according to claim 1, wherein the semiconductor devices are composed of a wide bandgap semiconductor element.

11. The signal relay board for power semiconductor modules according to claim 2, wherein an insulation property between the second wire layer and the third wire layer is set to be greater than an insulation property between the first wire layer and the second wire layer, and is set to be greater than an insulation property between the third wire layer and the fourth wire layer.

12. The signal relay board for power semiconductor modules according to claim 3, wherein an insulation property between the second wire layer and the third wire layer is set to be greater than an insulation property between the first wire layer and the second wire layer, and is set to be greater than an insulation property between the third wire layer and the fourth wire layer.

13. The signal relay board for power semiconductor modules according to claim 4, wherein an insulation property between the second wire layer and the third wire layer is set to be greater than an insulation property between the first wire layer and the second wire layer, and is set to be greater than an insulation property between the third wire layer and the fourth wire layer.

14. The signal relay board for power semiconductor modules according to claim 2, wherein a board core member is arranged between the second wire layer and the third wire layer.

15. The signal relay board for power semiconductor modules according to claim 3, wherein a board core member is arranged between the second wire layer and the third wire layer.

16. The signal relay board for power semiconductor modules according to claim 4, wherein a board core member is arranged between the second wire layer and the third wire layer.

17. The signal relay board for power semiconductor modules according to claim 5, wherein a board core member is arranged between the second wire layer and the third wire layer.

18. The signal relay board for power semiconductor modules according to claim 2, wherein the multiphase wire portion is configured to mount a passive electronic component on at least one of a front surface and a rear surface.

19. The signal relay board for power semiconductor modules according to claim 3, wherein the multiphase wire portion is configured to mount a passive electronic component on at least one of a front surface and a rear surface.