System and method for power electronics with a high and low temperature zone cooling system
First Claim
1. A power electronics system comprising:
- at least one outer wall defining an outer zone, said outer zone comprising a plurality of first electronic components, said plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields;
at least one inner wall defining an inner zone, said inner zone disposed within said outer zone, said inner zone comprising a plurality of second electronic components, said plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, said inner zone substantially electromagnetically sealed against electromagnetic interference generated by said plurality of first electronic components; and
a heat transfer assembly coupled to said at least one inner wall, wherein said heat transfer assembly is configured to facilitate operating said plurality of second electronic components below the second normal operating maximum temperature by transferring heat from said inner zone to said outer zone.
1 Assignment
0 Petitions
Accused Products
Abstract
A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components. The system further includes a heat transfer assembly coupled to the at least one inner wall and configured to facilitate operating the plurality of second electronic components below the second normal operating maximum temperature by transferring heat from the inner zone to the outer zone.
23 Citations
24 Claims
-
1. A power electronics system comprising:
-
at least one outer wall defining an outer zone, said outer zone comprising a plurality of first electronic components, said plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields; at least one inner wall defining an inner zone, said inner zone disposed within said outer zone, said inner zone comprising a plurality of second electronic components, said plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, said inner zone substantially electromagnetically sealed against electromagnetic interference generated by said plurality of first electronic components; and a heat transfer assembly coupled to said at least one inner wall, wherein said heat transfer assembly is configured to facilitate operating said plurality of second electronic components below the second normal operating maximum temperature by transferring heat from said inner zone to said outer zone. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A power electronics system comprising:
-
at least one outer wall defining an outer zone, said outer zone comprising a plurality of first electronic components, said plurality of first electronic components having a first no operating maximum temperature and capable of generating electromagnetic fields; a plurality of inner walls defining a plurality of inner zones, each inner zone of said plurality of inner zones disposed within said outer zone, each inner zone of said plurality of inner zones comprising a plurality of second electronic components, said plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, each inner zone substantially electromagnetically sealed against electromagnetic interference generated by said plurality of first electronic components; and a plurality of heat transfer assemblies coupled to said plurality of inner walls, each heat transfer assembly of said plurality of heat transfer assemblies configured to cool an inner zone of said plurality of inner zones, wherein said plurality of heat transfer assemblies are configured to facilitate operating said plurality of second electronic components below the second normal operating maximum temperature by transferring heat from said plurality of inner zones to said outer zone. - View Dependent Claims (14, 15, 16, 17, 18, 19)
-
-
20. A method of manufacturing a power electronics system, said method comprising:
-
providing an outer casing, the outer casing including a plurality of outer walls defining an outer zone; placing at least one first electronic component within the outer zone, the at least one first electronic component having a first normal operating maximum temperature; placing an inner casing within the outer zone, the inner casing including a plurality of inner walls defining an inner zone; placing at least one second electronic component within the inner zone, the at least one second electronic component having a second normal operating maximum temperature less than the first normal operating maximum temperature; and coupling at least one heat transfer assembly to at least one inner wall of the plurality of inner walls, the at least one heat transfer assembly configured to transfer heat from the inner zone to the outer zone. - View Dependent Claims (21, 22, 23, 24)
-
Specification