Metal shielding layer in backside illumination image sensor chips and methods for forming the same

• US 10,276,621 B2
• Filed: 04/10/2017
• Issued: 04/30/2019
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chang, Shih-Chieh, Tsai, Jian-Shin, Huang, Chih-Chang, Lee, Ing-Ju, Sun, Ching-Yao, Wu, Jyun-Ru, Huang, Ching-Che, Wu, Szu-An, Wang, Ying-Lang
• Primary Examiner(s): Chaudhari, Chandra
• Application Number:
  US15/483,904
• Publication Number:
  US 20170213861A1
• Time in Patent Office: 750 Days
• Field of Search: None
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements

Abstract

A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed at a surface of the semiconductor substrate, wherein the photo-sensitive device is configured to receive a light signal from the backside of the semiconductor substrate, and convert the light signal to an electrical signal. An amorphous-like adhesion layer is disposed on the backside of the semiconductor substrate. The amorphous-like adhesion layer includes a compound of nitrogen and a metal. A metal shielding layer is disposed on the backside of the semiconductor substrate and contacting the amorphous-like adhesion layer.

Claims

1. A back-side illuminated image sensing device comprising:

a semiconductor substrate;

a first photo-sensitive device at a first surface of the semiconductor substrate;

an adhesion layer on a second surface of the semiconductor substrate opposite the first surface of the semiconductor substrate, wherein substantially all grains in the adhesion layer have sizes smaller than about 50 Å

, and wherein the adhesion layer comprises nitrogen and a metal; and

a metal shielding layer contacting the adhesion layer, wherein the adhesion layer is disposed between the metal shielding layer and the semiconductor substrate.

2. The back-side illuminated image sensing device of claim 1, wherein the back-side illuminated image sensing device has a gray level uniformity of less than 7%, the gray level uniformity is a ratio of a difference between a gray level at an edge of the semiconductor substrate and a gray level at a center of the semiconductor substrate to the gray level at the center of the semiconductor substrate.

3. The back-side illuminated image sensing device of claim 1, wherein the first photo-sensitive device is exposed to incident light through an opening in the metal shielding layer.

4. The back-side illuminated image sensing device of claim 1, further comprising a second photo-sensitive device at the first surface of the semiconductor substrate, wherein the metal shielding layer blocks the second photo-sensitive device from exposure to incident light.

5. The back-side illuminated image sensing device of claim 1, wherein the adhesion layer comprises a first layer, and wherein the first layer comprises a combination of a metal and nitrogen.

6. The back-side illuminated image sensing device of claim 5, wherein the adhesion layer further comprises a second layer between the first layer and the semiconductor substrate and having a different composition than the first layer, and wherein the second layer comprises the metal.

7. The back-side illuminated image sensing device of claim 1, further comprising a passivation layer disposed on an opposing side of the metal shielding layer as the semiconductor substrate, wherein the passivation layer further extends along sidewalls of the metal shielding layer and the adhesion layer.

8. The back-side illuminated image sensing device of claim 1, further comprising one or more buffer layers between the adhesion layer and the semiconductor substrate.

9. A back-side illuminated image sensing device comprising:

a semiconductor substrate;

a first photo-sensitive device at a first surface of the semiconductor substrate;

an adhesion layer over a second surface of the semiconductor substrate opposite the first surface, wherein the adhesion layer comprises a combination of nitrogen and a metal; and

a metal shielding layer over the adhesion layer, wherein the metal shielding layer is further disposed over and aligned with the first photo-sensitive device, and wherein the back-side illuminated image sensing device has a gray level uniformity of less than 7%, the gray level uniformity is a ratio of a difference between a gray level at an edge of the semiconductor substrate and a gray level at a center of the semiconductor substrate to the gray level at the center of the semiconductor substrate.

10. The back-side illuminated image sensing device of claim 9, wherein the semiconductor substrate comprises a second photo-sensitive device at the first surface, and wherein an opening through the metal shielding layer is aligned with the second photo-sensitive device.

11. The back-side illuminated image sensing device of claim 9, wherein all grains in the adhesion layer have sizes smaller than about 50 Å

.

12. The back-side illuminated image sensing device of claim 9, wherein the adhesion layer comprises:

a lower portion comprising the metal; and

an upper portion over the lower portion and comprising a nitride of the metal.

13. The back-side illuminated image sensing device of claim 9, further comprising:

a first buffer layer over the semiconductor substrate, wherein the adhesion layer is disposed over the first buffer layer; and

a second buffer layer over the metal shielding layer.

14. The back-side illuminated image sensing device of claim 9 further comprising a passivation layer over the metal shielding layer and extending along sidewalls of the metal shielding layer and the adhesion layer.

15. A device comprising:

a substrate comprising a first image sensor at a first surface of the substrate;

an adhesion layer over a second surface of the substrate opposite the first surface, wherein the adhesion layer comprises a compound of nitrogen and a metal, and wherein substantially all grains in the adhesion layer are smaller than about 50 Å

, and wherein the adhesion layer is patterned so that the adhesion layer does not extend directly over the first image sensor; and

a metal shielding layer over the adhesion layer, wherein the metal shielding layer is patterned such that the metal shielding layer does not extend directly over the first image sensor.

16. The device of claim 15, further comprising a passivation layer over and along sidewalls of the adhesion layer and the metal shielding layer.

17. The device of claim 15 further comprising a first buffer layer between the adhesion layer and the substrate.

18. The device of claim 17, wherein the adhesion layer and the metal shielding layer are disposed between the first buffer layer and a second buffer layer.

19. The device of claim 17, wherein the first buffer layer does not extend directly over the first image sensor, the device further comprising a third buffer layer between the first buffer layer and the substrate, wherein the third buffer layer extends directly over the first image sensor.

20. The device of claim 15, wherein the substrate comprises a second image sensor at the first surface, and wherein the adhesion layer and the metal shielding layer are both disposed directly over the second image sensor.