Method for the fluidic assembly of emissive displays

• US 10,276,754 B2
• Filed: 03/21/2018
• Issued: 04/30/2019
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Sasaki, Kenji, Schuele, Paul J., Ulmer, Kurt, Lee, Jong-Jan
• Primary Examiner(s): Malek, Maliheh
• Application Number:
  US15/927,546
• Publication Number:
  US 20180219138A1
• Time in Patent Office: 405 Days
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Abstract

Fluidic assembly methods are presented for the fabrication of emissive displays. An emissive substrate is provided with a top surface, and a first plurality of wells formed in the top surface. Each well has a bottom surface with a first electrical interface. Also provided is a liquid suspension of emissive elements. The suspension is flowed across the emissive substrate and the emissive elements are captured in the wells. As a result of annealing the emissive substrate, electrical connections are made between each emissive element to the first electrical interface of a corresponding well. A eutectic solder interface metal on either the substrate or the emissive element is desirable as well as the use of a fluxing agent prior to thermal anneal. The emissive element may be a surface mount light emitting diode (SMLED) with two electrical contacts on its top surface (adjacent to the bottom surfaces of the wells).

Claims

1. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells formed in the top surface, each well comprising a bottom surface with a first electrical interface, and a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a first liquid suspension with a plurality of first type light emitting diodes (LEDs), each first type LED comprising a post, made from an insulator, extending from a surface;

flowing the first liquid suspension across the emissive substrate top surface;

capturing the first type of LEDs in the wells, oriented so that the posts are exposed and extending out of well openings in the emissive substrate top surface;

providing a second liquid suspension with a plurality of second type LEDs, each second type of LED comprising a post, made from an insulator, extending from a surface;

flowing the second liquid suspension across the emissive substrate top surface;

capturing the second type of LEDs in the wells, oriented so that the posts are exposed and extending out of well openings in the emissive substrate top surface;

performing a final annealing of the emissive substrate; and

,

in response to the final annealing, electrically connecting LEDs to the first electrical interface of corresponding wells.

2. The method of claim 1 further comprising:

prior to the final annealing, providing a third liquid suspension with a plurality of third type LEDs, each third type of LED comprising a post, made from an insulator, extending from a surface; and

,

flowing the third liquid suspension across the emissive substrate top surface.

3. The method of claim 1 wherein providing the emissive substrate wells includes providing a plurality of circular wells having a first diameter, and providing a plurality of circular wells having a second diameter, less than the first diameter;

wherein providing the first liquid suspension includes providing first type of LED disks having a round shape with a third diameter greater than the second diameter and less than the first diameter; and

,

wherein providing the second liquid suspension includes providing second type of LED disks having a round shape with a fourth diameter less than the second diameter.

4. The method of claim 1 wherein providing the emissive substrate wells includes providing a plurality of wells having a first shape, and providing a plurality of wells having a second shape, different than the first shape;

wherein providing the first liquid suspension includes providing a first type of LED having the third shape capable of filling the first shape wells, but incapable of filling the second shape wells; and

,

wherein providing the second liquid suspension includes providing a second type of LED having a fourth shape capable of filling the second shape wells.

5. The method of claim 1 further comprising:

prior to flowing the second liquid suspension, performing an initial annealing.

6. The method of claim 1 wherein electrically connecting LEDs includes connecting each of the first and second type LEDs to the first electrical interface of corresponding wells without the formation of overlying metal layers, additional conductive traces, or wire bonding on the substrate, subsequent to the final annealing.

7. The method of claim 1 further comprising:

engaging an auxiliary mechanism for distributing the first and second type of LEDs selected from the group consisting of a brush (rotating or non-rotating), wiper, rotating cylinder, pressurized fluid, and mechanical vibration; and

,

wherein capturing the first and second type of LEDs in the wells includes capturing the first and second type of LEDs in response to the auxiliary mechanism engaging elements selected from the group consisting of the LEDs emissive elements in the first and second liquid suspensions and the emissive substrate top surface.

8. The method of claim 7 wherein providing the emissive substrate includes providing an emissive substrate having a length and a width;

wherein engaging the auxiliary mechanism includes engaging a brush, having a rotation axis and brush length at least equal to the emissive substrate width, as follows;

in a first pass, translating the brush length across the emissive substrate length in the first direction;

simultaneously with the first pass of brush translation, rotating the brush to create a local variance in liquid suspension velocity.

9. The method of claim 8 wherein engaging the auxiliary mechanism includes:

rotating the brush at a rate in a range of 120 to 300 revolutions per minute (RPM); and

,

translating the brush at a speed in a range of 3 to 10 centimeter per second (cm/s).

10. The method of claim 1 wherein providing the emissive substrate includes providing wells with solder-coated first electrical interfaces.

11. The method of claim 1 wherein flowing the first and second liquid suspensions across the emissive substrate top surface includes creating a maximum local density of first and second type LEDs, respectively, in the first and second liquid suspensions in a range of 0.3 to 0.8 monolayers.

12. The method of claim 1 wherein providing the first and second liquid suspensions of, respectively, first and second type LEDs includes providing first and second type vertical LEDs having a bottom surface with a first electrical contact and a top surface with a second electrical contact, with the post extending from the vertical LED top surface;

wherein capturing the first and second type LEDs in the wells includes capturing the first and second type LED bottom surfaces directly overlying corresponding well bottom surfaces; and

,

wherein electrically connecting the LEDs to the first electrical interface of corresponding wells includes electrically connecting each first and second type LED first electrical contact to a corresponding well first electrical interface.

13. The method of claim 1 wherein electrically connecting the LEDs includes electrically connecting each first and second type LED to the first electrical interface of corresponding wells without the application of external pressure on the first and second type LEDs.

14. The method of claim 1 wherein flowing the first and second liquid suspensions across the substrate top surface includes moving, respectively, the first and second type LEDs across the substrate top surface at least partially in response to asymmetrical drag forces created by the surface orientation of the first and second type LEDs with respect to the substrate top surface.

15. The method of claim 1 wherein capturing the first and second type LEDs in the wells includes surface orienting the first and second type LED first electrical contacts directly overlying well bottom surfaces in response to the emissive element posts.

16. The method of claim 1 wherein providing the emissive substrate includes each well comprising a bottom surface with both the first electrical interface and a second electrical interface;

wherein providing the first and second liquid suspensions includes providing, respectively, first and second type surface mount LEDs having a bottom surface and a top surface, with a first electrical contact and a second electrical contact formed on the top surface, and with the post extending from the bottom surface;

wherein capturing the first and second type LEDs in the wells includes capturing each first and second type surface mount LED top surface directly overlying a corresponding well bottom surface; and

,

wherein electrically connecting the LED to the first electrical interface of corresponding wells includes electrically connecting each first and second type surface mount LED first electrical contact to a corresponding well first electrical interface and each first and second type LED second electrical contact to a corresponding well second electrical interface.

17. The method of claim 1 wherein providing the first and second liquid suspensions comprises providing first and second liquid suspensions including a solder fluxing agent.

18. The method of claim 1 further comprising:

subsequent to capturing the first and second type LEDs in the wells, and prior to the final annealing of the emissive substrate, filling the first and second type LED populated wells with a solder fluxing agent.

19. The method of claim 1 further comprising:

simultaneously with capturing the first and second type LEDs in the wells, collecting uncaptured first and second type LEDs; and

,

resuspending the collected first and second type LEDs, respectively in first and second liquid suspensions, for subsequent emissive display fabrication.

20. The method of claim 1 further comprising:

forming a plurality of color modifiers overlying exposed surfaces of a corresponding plurality of LEDs.

21. The method of claim 1 further comprising:

forming a plurality of light diffusers overlying a corresponding plurality of LEDs.

22. The method of claim 1 wherein providing the first and second liquid suspensions includes providing a liquid selected from the group consisting of alcohols, polyols, ketones, halocarbons, and water.

23. The method of claim 1 wherein providing the first and second liquid suspensions includes providing, respectively, first and second type LEDs having solder-coated electrical contacts.

24. The method of claim 1 wherein providing the emissive substrate includes providing the emissive substrate with a plurality of wells having a first shape and a plurality of wells having a second shape, different than the first shape;

wherein providing the first liquid suspension includes providing first type of LEDs having a third shape capable of filling the first shape wells, but incapable of filling the second shape wells;

wherein capturing the first type of LEDs includes capturing the first type of LEDs in the first shape wells;

wherein providing the second liquid suspension includes providing second type LEDs having a fourth shape capable of filling the second shape wells, but incapable of filling the first shape wells; and

,

wherein capturing the second type of LEDs includes capturing the second type of LEDs in the second shape wells.

25. The method of claim 24 wherein providing the emissive substrate includes providing the emissive substrate with a plurality of wells having a fifth shape, different than the first and second shapes, comprising a bottom surface with a first electrical interface;

the method further comprising;

prior to performing the final annealing, providing a third liquid suspension including a third type of LED, with a post made from an insulator and extending from a surface, having a sixth shape capable of filling the fifth shape wells, but incapable of filling the first and second shape wells;

flowing the third liquid suspension across the emissive substrate top surface; and

,

capturing the third type of LEDs in the sixth shape wells.

26. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells formed in the top surface, each well comprising a bottom surface with a first electrical interface, and a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a first liquid suspension with a first type of emissive elements, each first type of emissive element having a single post centered on the bottom surface;

flowing the first liquid suspension across the emissive substrate top surface;

capturing the first type of emissive elements in the wells, surface orienting the first type of emissive element top surfaces directly overlying the well bottom surfaces, oriented so that the posts are exposed and extending out of well openings in the emissive substrate top surface, in response to the emissive element posts;

providing a second liquid suspension with a second type of emissive elements, each second type of emissive element having a single post centered on the bottom surface;

flowing the second liquid suspension across the emissive substrate top surface;

capturing the second type of emissive elements in the wells, surface orienting the second type of emissive element top surfaces directly overlying the well bottom surfaces, oriented so that the posts are exposed and extending out of well openings in the emissive substrate top surface, in response to the emissive element posts;

performing a final annealing of the emissive substrate; and

,

in response to the final annealing, electrically connecting the emissive elements to the first electrical interface of corresponding wells.

27. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells formed in the top surface, each well comprising a bottom surface with a first electrical interface, and a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a first liquid suspension with a first type of vertical emissive elements having a top surface with a first electrical contact a bottom surface with a second electrical contact, and a post extending from the top surface;

flowing the first liquid suspension across the emissive substrate top surface;

capturing the first type of emissive elements in the wells, oriented so that the posts are exposed and extending out of well openings in the emissive substrate top surface;

providing a second liquid suspension with a second type of vertical emissive elements having a top surface with a first electrical contact, a bottom surface with a second electrical contact, and a post extending from the top surface;

flowing the second liquid suspension across the emissive substrate top surface;

capturing the second type of emissive elements in the wells, oriented so that the posts are exposed and extending out of well openings in the emissive substrate top surface;

performing a final annealing of the emissive substrate; and

,

in response to the final annealing, electrically connecting the emissive elements to the first electrical interface of corresponding wells.

28. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells formed in the top surface, each well comprising a bottom surface with a first electrical interface and a second electrical interface, and a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a first liquid suspension with a plurality of first type light surface mount light emitting diodes (LEDs), each first type surface mount LED comprising a bottom surface and a top surface, with a first electrical contact and a second electrical contact formed on the top surface, and with an insulator material post extending from the bottom surface;

flowing the first liquid suspension across the emissive substrate top surface;

capturing the first type of surface mount LEDs with the top surface directly overlying a corresponding well bottom surface;

providing a second liquid suspension with a plurality of second type surface mount LEDs, each second type surface mount LED comprising a bottom surface and a top surface, with a first electrical contact and a second electrical contact formed on the top surface, and with an insulator material post extending from the bottom surface;

flowing the second liquid suspension across the emissive substrate top surface;

capturing the second type of surface mount LEDs with the top surface directly overlying a corresponding well bottom surface;

performing a final annealing of the emissive substrate; and

,

electrically connecting each first and second type surface mount LED first electrical contact to a corresponding well first electrical interface and each first and second type LED second electrical contact to a corresponding well second electrical interface.