Fluidic assembly of emissive displays

• US 10,276,755 B2
• Filed: 03/21/2018
• Issued: 04/30/2019
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Sasaki, Kenji, Schuele, Paul J., Ulmer, Kurt, Lee, Jong-Jan
• Primary Examiner(s): Malek, Maliheh
• Application Number:
  US15/927,626
• Publication Number:
  US 20180219139A1
• Time in Patent Office: 405 Days
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Abstract

Fluidic assembly methods are presented for the fabrication of emissive displays. An emissive substrate is provided with a top surface, and a first plurality of wells formed in the top surface. Each well has a bottom surface with a first electrical interface. Also provided is a liquid suspension of emissive elements. The suspension is flowed across the emissive substrate and the emissive elements are captured in the wells. As a result of annealing the emissive substrate, electrical connections are made between each emissive element to the first electrical interface of a corresponding well. A eutectic solder interface metal on either the substrate or the emissive element is desirable as well as the use of a fluxing agent prior to thermal anneal. The emissive element may be a surface mount light emitting diode (SMLED) with two electrical contacts on its top surface (adjacent to the bottom surfaces of the wells).

Claims

1. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells having a first shape and a plurality of wells having a second shape, different than the first shape, each well comprising a bottom surface with a first electrical interface, and providing a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a liquid suspension with a first type of emissive element having a third shape capable of filling the first shape wells, but incapable of filling the second shape wells, and a second type of emissive element having a fourth shape capable of filling the second shape wells, but incapable of filling the first shape wells, with each first and second type of emissive element having a single post centered on a surface;

flowing the liquid suspension across the emissive substrate top surface;

capturing the first type of emissive elements in the first shape wells and the second type of emissive elements in the second shape wells, oriented so that the posts of the first and second type of emissive elements are exposed and extending out of respective well openings in the emissive substrate top surface;

annealing the emissive substrate; and

,

in response to the annealing, electrically connecting the first and second type emissive elements to the first electrical interface of corresponding wells.

2. The method of claim 1 wherein electrically connecting emissive elements includes connecting each of the first and second type emissive elements to the first electrical interface without the formation of overlying metal layers, additional conductive traces, or wire bonding on the substrate, subsequent to the final annealing.

3. The method of claim 1 further comprising:

engaging an auxiliary mechanism for distributing the first and second type of emissive elements selected from the group consisting of a brush (rotating or non-rotating), wiper, rotating cylinder, pressurized fluid, and mechanical vibration; and

,

wherein capturing the first and second type of emissive elements in the wells includes capturing the first and second type of emissive elements in response to the auxiliary mechanism engaging elements selected from the group consisting of the emissive elements in the liquid suspension and the emissive substrate top surface.

4. The method of claim 3 wherein providing the emissive substrate includes providing an emissive substrate having a length and a width;

wherein engaging the auxiliary mechanism includes engaging a brush, having a rotation axis and brush length at least equal to the emissive substrate width, as follows;

in a first pass, translating the brush length across the emissive substrate length in the first direction;

simultaneously with the first pass of brush translation, rotating the brush to create a local variance in liquid suspension velocity.

5. The method of claim 4 wherein engaging the auxiliary mechanism includes:

rotating the brush at a rate in a range of 120 to 300 revolutions per minute (RPM); and

,

translating the brush at a speed in a range of 3 to 10 centimeter per second (cm/s).

6. The method of claim 1 wherein providing the emissive substrate includes providing first and second shape wells with solder-coated first electrical interfaces.

7. The method of claim 1 wherein flowing the liquid suspension across the emissive substrate top surface includes creating a maximum local density of first and second type emissive elements in the liquid suspension in a range of 0.3 to 0.8 monolayers.

8. The method of claim 1 wherein providing the liquid suspension of first and second type emissive elements includes providing first and second type vertical emissive elements having a bottom surface with a first electrical contact and a top surface with a second electrical contact, with the posts centered on the top surface of the first and second emissive elements;

wherein capturing the first and second type emissive elements in the wells includes capturing the first and second type emissive element top surfaces directly overlying corresponding well bottom surfaces; and

,

wherein electrically connecting the emissive elements to the first electrical interface of a corresponding well includes electrically connecting each first and second type emissive element first electrical contact to a corresponding well first electrical interface.

9. The method of claim 1 wherein electrically connecting the emissive elements includes electrically connecting each first and second type emissive element to the first electrical interface of a corresponding well without the application of external pressure on the first and second type emissive elements.

10. The method of claim 1 wherein flowing the liquid suspension across the substrate top surface includes moving the first and second type emissive elements across the substrate top surface at least partially in response to asymmetrical drag forces created by the surface orientation on the first and second type emissive elements with respect to the substrate top surface.

11. The method of claim 1 wherein capturing the first and second type emissive elements in the wells includes surface orienting the first and second type emissive element first electrical contacts directly overlying well bottom surfaces in response to the emissive element posts.

12. The method of claim 1 wherein providing the emissive substrate includes each well comprising a bottom surface with both the first electrical interface and a second electrical interface;

wherein providing the liquid suspension includes providing first and second type surface mount emissive elements having a bottom surface and a top surface, with a first electrical contact and a second electrical contact formed on the top surface and the post centered on the bottom surface;

wherein capturing the first and second type emissive elements in the wells includes capturing each first and second type surface mount emissive element top surface directly overlying a corresponding well bottom surface; and

,

wherein electrically connecting the emissive element to the first electrical interface of a corresponding well includes electrically connecting each first and second type surface mount emissive element first electrical contact to a corresponding well first electrical interface and each first and second type emissive element second electrical contact to a corresponding well second electrical interface.

13. The method of claim 1 wherein providing the liquid suspension includes providing a liquid suspension including a solder fluxing agent.

14. The method of claim 1 further comprising:

subsequent to capturing the first and second type emissive elements in the wells, and prior to the annealing of the emissive substrate, filling the first and second type emissive element populated wells with a solder fluxing agent.

15. The method of claim 1 further comprising:

simultaneously with capturing the first and second type emissive elements in the wells, collecting uncaptured first and second type emissive elements; and

,

resuspending the collected first and second type emissive elements in the liquid suspension for subsequent emissive display fabrication.

16. The method of claim 1 further comprising:

forming a plurality of color modifiers overlying exposed surfaces of a corresponding plurality of emissive elements.

17. The method of claim 1 further comprising:

forming a plurality of light diffusers overlying a corresponding plurality of emissive elements.

18. The method of claim 1 wherein providing the liquid suspension includes providing a liquid selected from the group consisting of alcohols, polyols, ketones, halocarbons, and water.

19. The method of claim 1 wherein providing the liquid suspension includes providing first and second type emissive elements having a solder-coated electrical contacts.

20. The method of claim 1 wherein providing the emissive substrate includes providing a plurality of wells having a fifth shape, different than the first and second shapes, comprising a bottom surface with a first electrical interface;

wherein providing the liquid suspension includes providing a third type of emissive element having a sixth shape capable of filling the fifth shape wells, but incapable of filling the first and second shape wells, and including a post centered on a surface; and

,

wherein capturing the first and second type of emissive elements includes capturing the fifth type of emissive element in the sixth shape wells, oriented so that the posts of the first and second type of emissive elements are exposed and extending out of respective well openings in the emissive substrate top surface.

21. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells having a first shape and a plurality of wells having a second shape, different than the first shape, each well comprising a bottom surface with a first electrical interface, and providing a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a liquid suspension with a first type of light emitting diode (LED) having a third shape capable of filling the first shape wells, but incapable of filling the second shape wells, and a second type of LED having a fourth shape capable of filling the second shape wells, but incapable of filling the first shape wells, wherein the first and second type of LEDs each have a post extending from a bottom surface;

flowing the liquid suspension across the emissive substrate top surface;

capturing the first type of LEDs in the first shape wells, surface orienting the first type of LED top surfaces directly overlying the first shape well bottom surfaces with the posts exposed and extending out of first shape well openings in the emissive substrate top surface in response to the first type of LED posts, and capturing the second type of LED in the second shape wells, surface orienting the second type of LED top surfaces directly overlying the second shape well bottom surfaces with the posts exposed and extending out of second shape well openings in the emissive substrate top surface in response to the second type of LED posts;

annealing the emissive substrate; and

,

in response to the annealing, electrically connecting the first and second type LEDs to the first electrical interface of corresponding wells.

22. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells having a first shape and a plurality of wells having a second shape, different than the first shape, each well comprising a bottom surface with a first electrical interface, and providing a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a liquid suspension comprising a first type of vertical emissive element having a third shape capable of filling the first shape wells, a top surface with a first electrical contact, a post extending from the top surface, and a bottom surface with a second electrical contact, wherein the first type of vertical emissive element is incapable of filling the second shape wells, and the liquid suspension also comprising a second type of emissive element having a fourth shape capable of filling the second shape wells, a top surface with a first electrical contact, a post extending from the top surface, and a bottom surface with a second electrical contact, wherein the second type of vertical emissive element is incapable of filling the first shape wells;

flowing the liquid suspension across the emissive substrate top surface;

capturing the first type of emissive elements in the first shape wells and the second type of emissive elements in the second shape wells with the posts exposed and extending out of respective well openings in the emissive substrate top surface;

annealing the emissive substrate; and

,

in response to the annealing, electrically connecting the first and second type emissive elements to the first electrical interface of corresponding wells.

23. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells having a first shape and a plurality of wells having a second shape, different than the first shape, each well comprising a bottom surface with a first electrical interface, and providing a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a liquid suspension with a first type of vertical emissive element having a third shape capable of filling the first shape wells, but incapable of filling the second shape wells, and a second type of vertical emissive element having a fourth shape capable of filling the second shape wells, but incapable of filling the first shape wells;

wherein the first and second type vertical emissive elements each have a bottom surface with a first electrical contact and a top surface with a second electrical contact, with a post centered on the top surface;

flowing the liquid suspension across the emissive substrate top surface;

capturing the top surface of first type of vertical emissive elements in the first shape wells and the top surface of the second type of vertical emissive elements in the second shape wells, directly overlying corresponding well bottom surfaces;

annealing the emissive substrate; and

,

in response to the annealing, electrically connecting the first electrical contact of the first and second type vertical emissive elements to the first electrical interface of corresponding wells.

24. A fluidic assembly method for the fabrication of emissive displays, the method comprising:

providing an emissive substrate with a top surface, a plurality of wells having a first shape and a plurality of wells having a second shape, different than the first shape, each well comprising a bottom surface with a first electrical interface and a second electrical interface, and providing a matrix of column and row traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well;

providing a liquid suspension with a first type of surface mount emissive element having a third shape capable of filling the first shape wells, but incapable of filling the second shape wells, and a second type of surface mount emissive element having a fourth shape capable of filling the second shape wells, but incapable of filling the first shape wells;

wherein the first and second type surface mount emissive elements each have a bottom surface and a top surface, with a first electrical contact and a second electrical contact formed on the top surface, and a post centered on the bottom surface;

flowing the liquid suspension across the emissive substrate top surface;

capturing the top surface of the first type of surface mount emissive elements directly overlying the bottom surface of the first shape wells and capturing the top surface of the second type of surface mount emissive elements directly overlying the bottom surface of the second shape wells;

annealing the emissive substrate; and

,

in response to the annealing, electrically connecting the first and second electrical contacts of the first and second type of surface mount emissive elements, respectively, to the first and second electrical interfaces of corresponding wells.