Method and device for cooling a heat generating component

• US 10,278,306 B2
• Filed: 02/26/2015
• Issued: 04/30/2019
• Est. Priority Date: 09/07/2007
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Brunschwiler, Thomas J., Kloter, Urs, Linderman, Ryan Joseph, Michel, Bruno, Rothuizen, Hugo E., Waelchli, Reto
• Primary Examiner(s): Atkisson, Jianying
• Assistant Examiner(s): Attey, Joel
• Application Number:
  US14/632,194
• Publication Number:
  US 20150176911A1
• Time in Patent Office: 1,524 Days
• Field of Search: 165 803, 165 804, 1651091, 16510433, 165287, 165288, 165908
• CPC Class Codes: F28D 1/0417 with particular circuits for the same heat exchange medium, e.g. with the heat exchange medium flowing through sections having different heat exchange capacities or for heating/cooling the heat exchange medium at different temperatures
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control

Abstract

The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).

Claims

1. An integrated heat spreader, comprising:

at least one heat absorption chamber having a first surface for interfacing with a heat generating component,

wherein the heat absorption chamber comprises at least two physically separated flow paths for the cooling fluid;

at least one heat dissipation chamber having a second surface for interfacing with an external coolant, the second surface being larger than the first surface;

a cooling fluid filling, at least partially, the at least one heat absorption chamber and the at least one heat dissipation chamber;

at least one fluid interconnection oriented to form obtuse angles with respective planes of the first and second surfaces and disposed between the at least one heat absorption chamber and the at least one heat dissipation chamber;

at least one pump element for creating a plurality of flow patterns between the at least one heat absorption chamber and the at least one heat dissipation chamber using a forced movement of the cooling fluid; and

a controller for generating at least one control signal for the at least one pump element, such that the cooling fluid can be driven through the at least one heat absorption chamber using a plurality of flow patterns,

wherein the heat spreader comprises a plurality of regions and associated temperature sensors, the plurality of temperature sensors are coupled to the controller, and the controller is adapted to identify at least one cold region of the heat spreader, the at least one cold region being characterized in that it has a temperature below an average temperature of the plurality of regions, and the controller is further adapted to generate at least one control signal based on the at least one identified cold region, such that the flow of cooling fluid is sourced from the at least one cold region in at least one flow pattern.

2. The integrated heat spreader according to claim 1, wherein the at least one pump element comprises at least one membrane arranged in the at least one heat dissipation chamber.

3. The integrated heat spreader according to claim 1, wherein the at least one heat absorption chamber or heat dissipation chamber comprises at least one chamber wall having a surface enhancement feature for an increased heat exchange between the chamber wall and the cooling fluid.

4. The integrated heat spreader according to claim 1, wherein the heat absorption chamber comprises at least four ports for at least four fluid interconnections, each port hydraulically connected to one further port of the at least four ports of the heat absorption chamber.

5. The integrated heat spreader according to claim 1, the controller is configured to perform actions comprising:

determining an average temperature of the first surface or of the heat generating component using a temperature sensor coupled with the control system;

determining a position of at least one hot spot of the heat generating component, the at least one hot spot having a temperature above the determined average temperature;

mapping the determined position of the at least one hot spot to a location on the first surface of the heat spreader;

generating and sending at least one first control signal for generating a first flow pattern of the cooling fluid through the plurality of chambers passing the mapped location to the at least one pump element; and

generating and sending at least one second control signal in alternating turns with the at least one first control signal to the at least one pump element, the at least one second control signal for generating a second flow pattern of the cooling fluid through the plurality of chambers, returning the cooling fluid back to its initial location.

6. The integrated heat spreader according to claim 5, wherein in the second flow pattern the cooling fluid passes the mapped location of the hot spot in alternating turns with the first flow pattern.

7. The integrated heat spreader according to claim 6, wherein the controller is further configured to:

determine at least one chamber of the plurality of chambers having a temperature below the determined average temperature, wherein, in the step of generating the at least one first control signal, the first flow pattern of the cooling fluid is sourced from the at least one chamber determined to have a below average temperature.

8. The integrated heat spreader according to claim 1, wherein the heat absorption chamber is physically separated from the heat dissipation chamber.