Integrated backup band for use in forming an enclosure for a medical device

• US 10,279,187 B2
• Filed: 04/20/2017
• Issued: 05/07/2019
• Est. Priority Date: 07/11/2014
• Status: Active Grant

• Current Assignee: Neuropace Inc.
• Original Assignee: Neuropace Inc.
• Inventors: Vandenburg, Joseph
• Primary Examiner(s): Layno, Carl H
• Assistant Examiner(s): Piateski, Erin M
• Application Number:
  US15/492,979
• Publication Number:
  US 20170216603A1
• Time in Patent Office: 747 Days
• Field of Search: 607 36
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37514 Brain implants
• CPC Class Codes: B23K 2101/125 Cans
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 2103/14 Titanium or alloys thereof
• CPC Class Codes: B23K 26/24 Seam welding

Abstract

An implantable medical device includes an enclosure having a sidewall and a welded seam in the sidewall, the seam extends along a perimeter of the enclosure. A thermoform is located adjacent a surface of the enclosure and is secured in place within the enclosure. A metalized surface is located adjacent an interior surface of the enclosure sidewall and is secured in place by the thermoform. The metalized surface extends along a perimeter of the enclosure and is configured to obstruct laser energy during a weld seam process. The metalized surface may be provided as a separate backup band component or may be integrated in a perimeter sidewall of the thermoform.

Claims

1. A method of assembling an implantable medical device, the method comprising:

a) placing a backup band in a first half-enclosure having a surface and a sidewall extending from the surface, the backup band having a sidewall and comprising an edge, the backup band placed in the first half-enclosure so that a portion of the sidewall of the backup band comprising the edge extends beyond an edge of the sidewall of the first half-enclosure;

b) after performing step a), placing a thermoform in the first half-enclosure, the thermoform having a surface and a sidewall extending from the surface, wherein the thermoform is placed so that the sidewall of the backup band is between the sidewall of the first half-enclosure and the sidewall of the thermoform;

c) after performing step b), securing the backup band within the first half-enclosure by securing the thermoform to the first half-enclosure;

d) placing a second half-enclosure relative to the first half-enclosure, the second half-enclosure having a surface and a sidewall extending from the surface, the first half-enclosure and the second half-enclosure placed relative to each other so that the sidewall of the second half-enclosure is adjacent to and surrounds the portion of the backup band that extends beyond the edge of the sidewall of the first half-enclosure, and the edge of the first half-enclosure and the edge of the second half-enclosure align with and abut each other to form a seam; and

e) welding the seam to create a hermetic seal, wherein the backup band comprises at least one extension that extends inward from the sidewall of the backup band, and securing the backup band within the first half-enclosure by securing the thermoform to the first half-enclosure comprises placing the thermoform so that the at least one extension of the backup band is secured between the surface of the thermoform and the surface of the first half-enclosure.

2. The method of claim 1, wherein the backup band has no device components associated with it while it is being placed in the first half-enclosure.

3. The method of claim 1, wherein securing a thermoform to the first half-enclosure comprises:

exposing an adhesive on the surface of the thermoform prior to placing the thermoform in the first half-enclosure; and

pressing the surface of the thermoform against the surface of the first half-enclosure.

4. The method of claim 1, wherein securing a thermoform to the first half-enclosure comprises:

establishing a friction fit between the thermoform and the first half-enclosure.

5. The method of claim 1, further comprising:

assembling device components in the second half-enclosure prior to performing step d).

6. The method of claim 1, wherein the surface of the first half-enclosure is non-planar.

7. The method of claim 1, wherein the surface of the second half-enclosure is non-planar.

8. The method of claim 1, wherein the surface of the thermoform is non-planar.

9. The method of claim 1, wherein the sidewall of the backup band extends beyond an edge of the sidewall of the first half-enclosure along the entirety of the sidewall of the first half-enclosure.

10. The method of claim 1, wherein the sidewall of the backup band forms a continuous loop.