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Integrated backup band for use in forming an enclosure for a medical device

  • US 10,279,187 B2
  • Filed: 04/20/2017
  • Issued: 05/07/2019
  • Est. Priority Date: 07/11/2014
  • Status: Active Grant
First Claim
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1. A method of assembling an implantable medical device, the method comprising:

  • a) placing a backup band in a first half-enclosure having a surface and a sidewall extending from the surface, the backup band having a sidewall and comprising an edge, the backup band placed in the first half-enclosure so that a portion of the sidewall of the backup band comprising the edge extends beyond an edge of the sidewall of the first half-enclosure;

    b) after performing step a), placing a thermoform in the first half-enclosure, the thermoform having a surface and a sidewall extending from the surface, wherein the thermoform is placed so that the sidewall of the backup band is between the sidewall of the first half-enclosure and the sidewall of the thermoform;

    c) after performing step b), securing the backup band within the first half-enclosure by securing the thermoform to the first half-enclosure;

    d) placing a second half-enclosure relative to the first half-enclosure, the second half-enclosure having a surface and a sidewall extending from the surface, the first half-enclosure and the second half-enclosure placed relative to each other so that the sidewall of the second half-enclosure is adjacent to and surrounds the portion of the backup band that extends beyond the edge of the sidewall of the first half-enclosure, and the edge of the first half-enclosure and the edge of the second half-enclosure align with and abut each other to form a seam; and

    e) welding the seam to create a hermetic seal, wherein the backup band comprises at least one extension that extends inward from the sidewall of the backup band, and securing the backup band within the first half-enclosure by securing the thermoform to the first half-enclosure comprises placing the thermoform so that the at least one extension of the backup band is secured between the surface of the thermoform and the surface of the first half-enclosure.

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