High efficiency LEDs and LED lamps

• US 10,281,091 B2
• Filed: 03/28/2018
• Issued: 05/07/2019
• Est. Priority Date: 06/27/2009
• Status: Active Grant

• Current Assignee: Cooledge Lighting Inc.
• Original Assignee: Cooledge Lighting Inc.
• Inventors: Tischler, Michael A., Odnoblyudov, Vladimir, Keogh, David
• Primary Examiner(s): Lee, Calvin
• Application Number:
  US15/938,336
• Publication Number:
  US 20180283621A1
• Time in Patent Office: 405 Days
• Field of Search: 438 29, 257 98
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/235 Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps F21K9/238 takes precedence
• CPC Class Codes: F21K 9/237 Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases F21K9/238 takes precedence
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 23/008 the casing being outside the housing of the lighting device
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 7/0066 specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified F21V7/16 - F21V7/30 take precedence
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13033 : TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
• CPC Class Codes: H01L 33/0093 : Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/28 : containing only elements of Group II and Group VI of the Periodic Table
• CPC Class Codes: H01L 33/30 : containing only elements of Group III and Group V of the Periodic Table
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/34 : containing only elements of Group IV of the Periodic Table
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H04N 1/02865 : using an array of light sources or a combination of such arrays, e.g. an LED bar
• CPC Class Codes: H05B 33/12 : Light sources with substantially two-dimensional radiating surfaces
• CPC Class Codes: H05B 45/10 : Controlling the intensity of the light
• CPC Class Codes: H05B 45/12 : using optical feedback
• CPC Class Codes: H05B 45/30 : Driver circuits
• CPC Class Codes: H05B 45/37 : Converter circuits
• CPC Class Codes: H05B 45/3725 : Switched mode power supply [SMPS]
• CPC Class Codes: H05B 45/40 : Details of LED load circuits
• CPC Class Codes: H05B 45/42 : Antiparallel configurations
• CPC Class Codes: H05B 45/44 : with an active control inside an LED matrix
• CPC Class Codes: H05B 45/60 : Circuit arrangements for operating LEDs comprising organic material, e.g. for operating organic light-emitting diodes [OLED] or polymer light-emitting diodes [PLED]
• CPC Class Codes: H05B 47/11 : by determining the brightness or colour temperature of ambient light
• CPC Class Codes: H10K 50/00 : Organic light-emitting devices integrated devices or assemblies of multiple devices H10K59/00, H10K65/00; organic semiconductor lasers H01S5/36
• CPC Class Codes: H10K 59/00 : Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
• CPC Class Codes: Y02B 20/40 : Control techniques providing energy savings, e.g. smart controller or presence detection

Abstract

In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.

Claims

1. A lighting system comprising:

a thermally conductive carrier having a plurality of conductive elements disposed thereover;

disposed over the carrier, a light-emitting array comprising a plurality of electrically connected unpackaged light-emitting diodes (LEDs), each unpackaged LED having at least two electrical contacts, wherein at least some of the electrical contacts are each electrically connected to a conductive element; and

a light-conversion material disposed over the unpackaged LEDs for absorption of at least a portion of light emitted from the unpackaged LEDs and emission of converted light having a different wavelength, converted light and unconverted light emitted by the light-emitting elements combining to form mixed light.

2. The system of claim 1, wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to a first conductive element with a wire bond and (ii) another electrical contact electrically coupled to a second conductive element with at least one of solder or conductive adhesive.

3. The system of claim 1, wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to an electrical contact of a first different unpackaged LED and (ii) another electrical contact electrically coupled to an electrical contact of a second different unpackaged LED.

4. The system of claim 1, wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to a first conductive element with a wire bond and (ii) another electrical contact electrically coupled to a second conductive element with a wire bond.

5. The system of claim 1, wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to a conductive element and (ii) another electrical contact electrically coupled to an electrical contact of a different unpackaged LED.

6. The system of claim 1, wherein at least one electrical contact of at least one of the unpackaged LEDs is electrically coupled to a conductive element with at least one of solder or conductive adhesive.

7. The system of claim 1, further comprising at least two connection points, disposed on the carrier, for facilitating electrical connection to the plurality of unpackaged LEDs.

8. The system of claim 1, wherein at least one electrical contact of at least one of the unpackaged LEDs is electrically coupled to a conductive element with a wire bond.

9. The system of claim 1, wherein at least some of the unpackaged LEDs are electrically connected in a combination of series and parallel configurations.

10. The system of claim 1, further comprising at least one optical element configured for at least one of focusing or shaping the mixed light to a desired illumination pattern.

11. The system of claim 1, wherein the carrier comprises at least one of silicon, aluminum nitride, silicon carbide, diamond, sapphire, aluminum, or copper.

12. The system of claim 1, further comprising an electrically insulating layer between the thermally conductive carrier and the conductive elements.

13. The system of claim 1, wherein the carrier is reflective to a wavelength of converted light emitted by the light-conversion material.

14. The system of claim 1, wherein all of the unpackaged LEDs have substantially the same emission wavelength.

15. The system of claim 1, wherein at least some of the unpackaged LEDs are electrically connected in parallel.

16. The system of claim 1, wherein the unpackaged LEDs are attached to the substrate with an adhesive or solder.

17. The system of claim 1, wherein at least some of the unpackaged LEDs are electrically connected in series.

18. The system of claim 1, wherein the carrier is reflective to a wavelength of light emitted by the LEDs.

19. The system of claim 1, wherein the carrier is reflective to a wavelength of the mixed light.

20. The system of claim 1, wherein the mixed light is substantially white light.

21. The system of claim 1, wherein the carrier defines a plurality of depressions, and each unpackaged LED is disposed within a depression.

22. The system of claim 21, wherein each depression is reflective to a wavelength of converted light emitted by the light-conversion material.

23. The system of claim 21, wherein each depression is reflective to a wavelength of light emitted by the unpackaged LEDs.

24. The system of claim 21, wherein each depression is reflective to a wavelength of the mixed light.