Semiconductor package

• US 10,281,969 B2
• Filed: 08/28/2017
• Issued: 05/07/2019
• Est. Priority Date: 08/29/2016
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Umemoto, Kiyotaka
• Primary Examiner(s): Mandala, Victor A
• Application Number:
  US15/687,698
• Publication Number:
  US 20180059759A1
• Time in Patent Office: 617 Days
• CPC Class Codes: G05B 15/02 electric
• CPC Class Codes: G05B 2219/2208 Each processor controls a different function of the machine
• CPC Class Codes: G05B 23/0237 based on parallel systems, e.g. comparing signals produced at the same time by same type systems and detect faulty ones by noticing differences among their responses
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: G06F 1/28 Supervision thereof, e.g. detecting power-supply failure by out of limits supervision
• CPC Class Codes: G06F 12/0284 Multiple user address space allocation, e.g. using different base addresses interprocessor communication G06F15/163
• CPC Class Codes: G06F 12/0646 Configuration or reconfiguration
• CPC Class Codes: G06F 13/10 Program control for peripheral devices G06F13/14 - G06F13/42 take precedence
• CPC Class Codes: G06F 2212/1048 Scalability
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/10 the devices having separate containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10N 52/00 : Hall-effect devices integrated devices or assemblies of multiple devices H10N59/00

Abstract

A semiconductor package includes a plurality of chips, which include a plurality of corresponding functional blocks having the same function among the chips, and only one of the corresponding functional blocks having the same function among the chips enables function, and one or more functional blocks enable function in each of the chips, so that the functional blocks are distributed among the chips.

Claims

1. A semiconductor package comprising a plurality of chips, wherein

the plurality of chips include a plurality of corresponding functional blocks having the same function among the chips,

only one of the corresponding functional blocks having the same function among the chips enables function, and one or more functional blocks enable function in each of the chips so that the functional blocks are distributed among the chips,

wherein the chips further include a temperature detecting unit corresponding to each of the functional blocks, and a determination unit arranged to determine the functional block to enable function based on a result of detection by the temperature detecting unit.

2. The semiconductor package according to claim 1, wherein the functional blocks are distributed among the chips while the functional block to enable function is changed.

3. The semiconductor package according to claim 2, wherein the functional block to enable function is changed based on the number of start-up times of the semiconductor package.

4. The semiconductor package according to claim 2, wherein the functional block to enable function is changed in accordance with an operation mode of the semiconductor package.

5. The semiconductor package according to claim 1, wherein the semiconductor package is mountable in a vehicle.

6. A semiconductor package comprising two chips, wherein the chips include a plurality of corresponding functional blocks having the same function among the chips, only one of the corresponding functional blocks having the same function among the chips enables function, and one or more functional blocks enable function in each of the chips so that the functional blocks are distributed among the chips,

wherein each of the chips further includes a malfunction monitoring unit arranged to monitor whether or not the functional block has a malfunction, and

wherein when one of the malfunction monitoring units detects a malfunction, all functional blocks of the chip to which the one of the malfunction monitoring units belongs disable function, and the one of the malfunction monitoring units sends notification to the other malfunction monitoring unit so that all functional blocks of the chip to which the other malfunction monitoring unit belongs enable function.

7. The semiconductor package according to claim 6, wherein the functional blocks are distributed among the chips while the functional block to enable function is changed.

8. The semiconductor package according to claim 7, wherein the functional block to enable function is changed based on the number of start-up times of the semiconductor package.

9. The semiconductor package according to claim 7, wherein the functional block to enable function is changed in accordance with an operation mode of the semiconductor package.

10. The semiconductor package according to claim 6, wherein the semiconductor package is mountable in a vehicle.