Sensing module substrate and sensing module including the same

• US 10,282,587 B2
• Filed: 12/30/2016
• Issued: 05/07/2019
• Est. Priority Date: 02/12/2016
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Choi, Inho, Jung, Youngdoo, Kim, Woonbae, Kim, Jungwoo, Park, Ji-Yong, Yang, Kyoungsuk, Ha, Jeong-Kyu
• Primary Examiner(s): Werner, Brian
• Application Number:
  US15/395,623
• Publication Number:
  US 20170235997A1
• Time in Patent Office: 858 Days
• CPC Class Codes: G06V 40/13 Sensors therefor
• CPC Class Codes: G06V 40/1365 Matching; Classification

Abstract

A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

Claims

1. A sensing module substrate comprising:

a film substrate having a first surface and a second surface;

sensing vias which extend completely through the film substrate and penetrate the first surface and the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and

an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

2. The sensing module substrate of claim 1, wherein the sensing vias are arranged in an array in the film substrate.

3. The sensing module substrate of claim 1, wherein the interconnection pattern comprises at least two interconnection elements extending in a longitudinal direction of the film substrate and arranged in parallel.

4. The sensing module substrate of claim 1, wherein the interconnection pattern is spaced apart from the sensing vias and electrically disconnected from the sensing vias.

5. The sensing module substrate of claim 1, wherein the interconnection pattern comprises at least one conductive material.

6. The sensing module substrate of claim 1, wherein the sensing vias comprise at least one conductive material, and the film substrate comprises a polymeric material.

7. The sensing module substrate of claim 1, wherein the interconnection pattern comprises a first interconnection pattern which is provided on and extends in a longitudinal direction of the first surface of the film substrate, and a second interconnection pattern which is provided on and extends in the longitudinal direction of the second surface of the film substrate, and

wherein the sensing module substrate further comprises a connection via which penetrates the film substrate from the first surface to the second surface, and electrically connects the first interconnection pattern and the second interconnection pattern.

8. A sensing module comprising:

a film substrate having a first surface and a second surface;

sensing vias which extend completely through the film substrate and penetrate the first surface and the second surface; and

a semiconductor chip provided at the first surface of the film substrate and coupled to the sensing vias, the semiconductor chip comprising pixels provided at a surface of the semiconductor chip at positions corresponding to the sensing vias.

9. The sensing module of claim 8, wherein the sensing vias are arranged in an array in the film substrate.

10. The sensing module of claim 8, wherein the semiconductor chip is disposed directly beneath the sensing vias.

11. The sensing module of claim 8, wherein the sensing vias are configured to transmit, to the semiconductor chip, information to measure an electric capacitance corresponding to a touch event occurring at the sensing vias on the second surface of the film substrate.

12. The sensing module of claim 8, further comprising;

an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate; and

a connector provided on one of the first surface and the second surface of the film substrate,

wherein the semiconductor chip and the connector are electrically connected through the interconnection pattern.

13. The sensing module of claim 12, wherein the interconnection pattern and the connector are disposed on the first surface of the film substrate.

14. The sensing module of claim 12, the interconnection pattern comprises a first interconnection pattern which is provided on and extends in a longitudinal direction of the first surface of the film substrate, and a second interconnection pattern which is provided on and extends in the longitudinal direction of the second surface of the film substrate, and

wherein the sensing module further comprises a connection via which penetrates the film substrate from the first surface to the second surface, and electrically connects the first interconnection pattern and the second interconnection pattern.

15. The sensing module of claim 8, further comprising sensing plates provided at the surface of the semiconductor chip and at positions corresponding the pixels, wherein the sensing vias are electrically connected to the sensing plates.

16. A sensing module comprising:

a film substrate having a first surface and a second surface;

sensing vias which extend completely through the film substrate and penetrate the first surface and the second surface;

a semiconductor chip provided at the first surface of the film substrate and coupled to the sensing vias, the semiconductor chip comprising pixels provided at a surface of the semiconductor chip at positions corresponding to the sensing vias;

a glass layer provided on the second surface of the film substrate and over the sensing vias; and

a bezel partially covering at least one of a top surface and a side surface of the glass layer.

17. The sensing module of claim 16, wherein the sensing vias are arranged in an array in the film substrate, and the semiconductor chip is disposed directly beneath the sensing vias.

18. The sensing module of claim 16, further comprising:

a first interconnection pattern which is provided on and extends in a longitudinal direction of the first surface of the film substrate;

a second interconnection pattern which is provided on and extends in the longitudinal direction of the second surface of the film substrate; and

a connection via which penetrates the film substrate from the first surface to the second surface, and electrically connects the first interconnection pattern and the second interconnection pattern.

19. The sensing module of claim 16, wherein the sensing vias are configured to transmit, to the semiconductor chip, information to measure an electric capacitance corresponding to a touch event occurring at the sensing vias on the second surface of the film substrate.

20. The sensing module of claim 16, further comprising;

an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate; and

a connector provided on one of the first surface and the second surface of the film substrate,

wherein the semiconductor chip and the connector are electrically connected through the interconnection pattern.