Stacked die semiconductor device with separate bit line and bit line bar interconnect structures
First Claim
Patent Images
1. An apparatus, comprising:
- a first tier on a first substrate;
a second tier on a second substrate, wherein the second tier is vertically stacked on the first tier; and
a memory comprising a column of memory bit cells,whereina first portion of the column of memory bit cells is on the first tier;
a second portion of the column of memory bit cells is on the second tier;
the first portion of the column of memory bit cells is coupled with a first segment of a first bit line; and
the second portion of the column of memory bit cells is coupled with a second segment of the first bit line.
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus includes a first tier, a second tier and a memory. The second tier is vertically stacked on the first tier. The memory includes a column of memory bit cells. A first portion of the column of memory bit cells is on the first tier. A second portion of the column of memory bit cells is on the second tier.
49 Citations
20 Claims
-
1. An apparatus, comprising:
-
a first tier on a first substrate; a second tier on a second substrate, wherein the second tier is vertically stacked on the first tier; and a memory comprising a column of memory bit cells, wherein a first portion of the column of memory bit cells is on the first tier; a second portion of the column of memory bit cells is on the second tier; the first portion of the column of memory bit cells is coupled with a first segment of a first bit line; and the second portion of the column of memory bit cells is coupled with a second segment of the first bit line. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. An apparatus, comprising:
-
a first tier on a first substrate; a second tier on a second substrate and vertically stacked on the first tier; and a column of memory bit cells; a first bit line and a first bit line bar in the first tier; and a second bit line and a second bit line bar in the second tier; wherein the second bit line is electrically coupled to the first bit line by at least one interconnection structure that includes a conductive bump to electrically connect the first substrate to the second substrate; a first portion of the column of memory bit cells are coupled to the first bit line and the first bit line bar; and a second portion of the column of memory bit cells are coupled to the second bit line and the second bit line bar. - View Dependent Claims (9, 10, 11)
-
-
12. An apparatus, comprising:
-
a peripheral tier; a first tier on a first substrate and a second tier on a second substrate vertically stacked on the peripheral tier; an interconnection structure that electrically connects the first substrate to the second substrate, and couples to a first bit line coupled to memory bit cells in the first tier and to a second bit line coupled to memory bit cells in the second tier; and a plurality of memory slices, each of the plurality of memory slices comprising; a first portion of a column of memory bit cells in the first tier; and a second portion of the column of memory bit cells in the second tier; wherein the peripheral tier is configured to regulate memory cell addresses by a BL-BLB pair coupled to at least one of the plurality of memory slices. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
-
Specification