Semiconductor processing system and methods using capacitively coupled plasma

• US 10,283,321 B2
• Filed: 10/03/2011
• Issued: 05/07/2019
• Est. Priority Date: 01/18/2011
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Yang, Jang-Gyoo, Miller, Matthew L., Chen, Xinglong, Chuc, Kien N., Liang, Qiwei, Venkataraman, Shankar, Lubomirsky, Dmitry
• Primary Examiner(s): Dhingra, Rakesh K
• Application Number:
  US13/251,714
• Publication Number:
  US 20130082197A1
• Time in Patent Office: 2,773 Days
• Field of Search: 118715, 118722, 118723 R, 118723 E, 15634533, 15634534, 15634543-34547
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma

Abstract

Substrate processing systems are described that have a capacitively coupled plasma (CCP) unit positioned inside a process chamber. The CCP unit may include a plasma excitation region formed between a first electrode and a second electrode. The first electrode may include a first plurality of openings to permit a first gas to enter the plasma excitation region, and the second electrode may include a second plurality of openings to permit an activated gas to exit the plasma excitation region. The system may further include a gas inlet for supplying the first gas to the first electrode of the CCP unit, and a pedestal that is operable to support a substrate. The pedestal is positioned below a gas reaction region into which the activated gas travels from the CCP unit.

Claims

1. A substrate processing system, comprising:

a lid assembly;

a showerhead comprising at least two plates defining a volume between the at least two plates;

an ion suppressor plate configured to substantially prevent the passage of ionic species through the ion suppressor plate, the ion suppressor plate comprising a plurality of openings each having a tapered portion and a cylindrical portion, wherein the tapered portion of the openings taper from a first surface of the ion suppressor plate facing the lid assembly to the cylindrical portion of the openings, wherein the cylindrical portion of the openings extend from the tapered portion to a second surface of the ion suppressor plate opposite the first surface, and wherein the ion suppressor plate is positioned between the lid assembly and the showerhead;

an electronic power source coupled with the ion suppressor plate as one of a pair of plasma generating electrodes in a capacitively-coupled plasma configuration configured to generate a plasma that is at least substantially contained in a region defined between the lid assembly and the ion suppressor plate; and

an electric insulator positioned between the lid assembly and the ion suppressor plate, wherein the lid assembly, the showerhead, and the ion suppressor plate are positioned in a stacked configuration with one another to define exterior walls of the substrate processing system, and wherein the electric insulator is positioned between ion suppressor and lid assembly in the stacked configuration to further define the exterior walls of the substrate processing system.

2. The substrate processing system of claim 1, wherein the plurality of openings of the ion suppressor plate have a depth of about 4 mm to about 8 mm.

3. The substrate processing system of claim 1, wherein the cylindrical portions of the openings of the ion suppressor plate have a diameter of about 0.4 mm to about 1 mm.

4. The substrate processing system of claim 1, wherein the tapered portions of the openings of the ion suppressor plate have a largest diameter of about 1 mm to about 2.5 mm, and a taper angle of about 15°

to about 30°

.

5. The substrate processing system of claim 1, wherein the taper angle of the openings of the ion suppressor plate is about 22°

.

6. The substrate processing system of claim 1, wherein the cylindrical portion of the plurality of openings of the ion suppressor plate face a region of the substrate processing system with fewer ionically-charged plasma species than the tapered portion of the plurality of openings that face the in-situ plasma excitation region of the substrate processing system.

7. The substrate processing system of claim 1, further comprising a remote plasma system (RPS) coupled with the lid assembly.

8. The substrate processing system of claim 7, further comprising an RF power source coupled with the lid assembly, and a ground source coupled with the ion suppressor plate.

9. The substrate processing system of claim 1, further comprising a fluid inlet assembly that delivers precursors through a central region of the lid assembly.

10. The substrate processing system of claim 1, wherein the showerhead defines a plurality of apertures, and wherein each aperture of the plurality of apertures is axially aligned with an opening of the plurality of openings of the ion suppressor plate.

11. The substrate processing system of claim 1, wherein the electronic power source is further coupled with the lid assembly.

12. The substrate processing system of claim 1, wherein the electronic power source is further coupled with the showerhead.

13. The substrate processing system of claim 1, wherein the ion suppressor plate at least partially defines an external profile of the substrate processing system.

14. The substrate processing system of claim 1, wherein the lid assembly defines a plurality of apertures proximate the in-situ plasma excitation region, wherein each aperture of the plurality of apertures are characterized by a tapered portion and a cylindrical portion, and wherein the tapered portion is exposed to the in-situ plasma excitation region.

15. The substrate processing system of claim 1, wherein the showerhead defines a port at the periphery of the exterior walls of the substrate processing system configured to receive fluids into the volume between the at least two plates.