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3D capacitor and method of manufacturing same

  • US 10,283,613 B2
  • Filed: 02/08/2018
  • Issued: 05/07/2019
  • Est. Priority Date: 11/04/2011
  • Status: Active Grant
First Claim
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1. A method of manufacturing a three-dimensional (3D) capacitor, comprising:

  • providing a substrate;

    forming a fin structure including one or more fins on the substrate;

    implanting the fin structure to form a low-resistance surface on the fin structure;

    depositing an insulation material on the substrate and on the fin structure, the insulation material substantially filling a region between each of the one or more fins;

    removing a portion of the insulation material from the region between each of the one or more fins such that a portion of each of the one or more fins is exposed;

    forming a dielectric layer over each of the one or more fins;

    forming a first electrode on a first portion of the fin structure; and

    forming a second electrode on a second portion of the fin structure,wherein the first and second portions are different, andwherein the first and second electrodes are isolated one from the other.

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