Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
First Claim
1. A device comprising:
- a gyroscope, wherein the gyroscope is operable to provide a measurement output corresponding to measurement of rotation about three axes, wherein the three axes are orthogonal, and the gyroscope is disposed in a plane;
an application specific integrated circuit (ASIC) to receive the measurement output from the gyroscope, wherein the ASIC includes at least one analog receiver and processes data from the gyroscope, the ASIC being implemented on a first silicon substrate, and wherein the gyroscope is vertically stacked, is substantially parallel to the first silicon substrate and is electrically connected to the ASIC, wherein the first silicon substrate is distinct from a printed circuit board;
a second silicon substrate that seals the gyroscope within a hermetic enclosure in between the first silicon substrate and the second silicon substrate, wherein the first silicon substrate and the second silicon substrate are the same material; and
measurement devices, wherein the measurement devices includes two or more of an accelerometer, a position sensor, a barometer, a geomagnetic sensor, or a temperature sensor.
1 Assignment
0 Petitions
Accused Products
Abstract
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
380 Citations
17 Claims
-
1. A device comprising:
-
a gyroscope, wherein the gyroscope is operable to provide a measurement output corresponding to measurement of rotation about three axes, wherein the three axes are orthogonal, and the gyroscope is disposed in a plane; an application specific integrated circuit (ASIC) to receive the measurement output from the gyroscope, wherein the ASIC includes at least one analog receiver and processes data from the gyroscope, the ASIC being implemented on a first silicon substrate, and wherein the gyroscope is vertically stacked, is substantially parallel to the first silicon substrate and is electrically connected to the ASIC, wherein the first silicon substrate is distinct from a printed circuit board; a second silicon substrate that seals the gyroscope within a hermetic enclosure in between the first silicon substrate and the second silicon substrate, wherein the first silicon substrate and the second silicon substrate are the same material; and measurement devices, wherein the measurement devices includes two or more of an accelerometer, a position sensor, a barometer, a geomagnetic sensor, or a temperature sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification