Infrared detecting device

• US 10,288,488 B2
• Filed: 01/22/2016
• Issued: 05/14/2019
• Est. Priority Date: 02/06/2015
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Kusukame, Koichi, Silawan, Nawatt, Yoneda, Aki
• Primary Examiner(s): Porta, David P
• Assistant Examiner(s): Riddick, Blake C
• Application Number:
  US15/004,024
• Publication Number:
  US 20160231179A1
• Time in Patent Office: 1,208 Days
• Field of Search: 250349, 2503383, 250DIG 1, 250332, 250334
• CPC Class Codes: G01J 2005/202 Arrays
• CPC Class Codes: G01J 5/0205 Mechanical elements; Supports for optical elements
• CPC Class Codes: G01J 5/04 Casings
• CPC Class Codes: G01J 5/045 Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements getter arrangements per se H01L23/26 and H01L21/3221
• CPC Class Codes: G01J 5/047 Mobile mounting; Scanning arrangements
• CPC Class Codes: G01J 5/048 Protective parts
• CPC Class Codes: G01J 5/07 Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position optical collimating elements G01J5/0806
• CPC Class Codes: G01J 5/0806 Focusing or collimating elements, e.g. lenses or concave mirrors
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices

Abstract

An infrared detecting device includes: an infrared sensor that has one or more infrared detection elements arranged in one or more columns; and an IC chip that performs signal processing on a signal output from the infrared sensor. The infrared sensor and the IC chip are generally juxtaposed in a direction along a scan rotation axis of the infrared sensor.

Claims

1. An infrared detecting device comprising:

an infrared sensor that has one or more infrared detection elements arranged in one or more columns; and

an integrated circuit (IC) chip that performs signal processing on a signal output from the infrared sensor,

wherein the infrared sensor and the IC chip are generally juxtaposed in a direction along a scan rotation axis of the infrared sensor.

2. The infrared detecting device according to claim 1, further comprising:

a package main portion having one surface on which the infrared sensor and the IC chip are mounted.

3. The infrared detecting device according to claim 2,

wherein the package main portion has a package lid joined to the surface so as to surround the infrared sensor and the IC chip;

the package lid has, at a position that faces the infrared sensor, a window hole through which an infrared ray travels to the infrared sensor; and

the window hole is provided with a lens which guides infrared light to the infrared sensor.

4. The infrared detecting device according to claim 1,

wherein the infrared sensor is rotated about the scan rotation axis to scan a detection range, and

the one or more columns in the infrared sensor are arranged so as to have an inclination at a predetermined angle relative to a direction of rotation about the scan rotation axis.

5. The infrared detecting device according to claim 4,

wherein the predetermined angle is an angle adjusted such that all of respective central positions of the infrared detection elements constituting the infrared sensor differ from one another, when viewed from the direction of rotation about the scan rotation axis.

6. The infrared detecting device according to claim 1,

wherein the infrared detection elements in the infrared sensor are arranged in two or more columns in an arrangement direction of the infrared sensor and the IC chip;

and

the number of two or more columns decreases for every same or different number of rows, as a distance to one end in the arrangement direction of the infrared sensor and the IC chip decreases.

7. The infrared detecting device according to claim 1,

wherein the infrared detection elements in the infrared sensor are arranged in two or more columns in an arrangement direction of the infrared sensor and the IC chip;

and

the two or more columns are offset from each other such that the column that is closer to a leading end in a direction of rotation about the scan rotation axis is closer to or farther from the IC chip.

8. The infrared detecting device according to claim 1, further comprising:

two or more thermistors,

wherein the two or more thermistors are arranged in proximity to the infrared sensor along the scan rotation axis; and

based on an output result of the two or more thermistors, the IC chip performs correction processing on a signal output from the infrared sensor and performs signal processing on the output signal on which the correction processing is performed.

9. The infrared detecting device according to claim 1,

wherein the infrared detecting device is attached to a housing installed on an installation surface that is generally orthogonal to a bottom surface of space and that is located at a predetermined height from the bottom surface;

and

an arrangement plane of the one or more infrared detection elements is arranged so as to have an inclination relative to the installation surface.

10. The infrared detecting device according to claim 9,

wherein the scan rotation axis and the arrangement plane are arranged so as to have the inclination relative to the installation surface, and

the arrangement plane is generally parallel to the scan rotation axis.

11. The infrared detecting device according to claim 9,

wherein the scan rotation axis is generally parallel to the installation surface, and

the arrangement plane intersects the scan rotation axis.

12. The infrared detecting device according to claim 11,

wherein the infrared detection elements in the infrared sensor are arranged in one or more columns;

and

a horizontal edge of each of the infrared detection elements in each column, the horizontal edge being generally parallel to the bottom surface, has a smaller dimension, as the infrared detection element is located closer to the bottom surface.

13. The infrared detecting device according to claim 12,

wherein the infrared detection elements in the infrared sensor are arranged in three or more columns;

a horizontal edge of each of the infrared detection elements in each column, the horizontal edge being generally parallel to the bottom surface, has a smaller dimension, as the infrared detection element is located closer to the bottom surface; and

a distance between central positions of the infrared detection elements at corresponding portions in the adjacent columns of the three or more columns is constant.

14. The infrared detecting device according to claim 13,

wherein positions of the topmost infrared detection elements in the three or more columns, viewed from the bottom surface, are sequentially offset toward the bottom surface.

15. The infrared detecting device according to claim 14,

wherein the position of the topmost infrared detection element in one column is offset from the topmost infrared detection element in the column adjacent thereto by one-fourth of a dimension of a vertical edge of the topmost infrared detection element in the adjacent column, the vertical edge being generally orthogonal to the bottom surface.

16. The infrared detecting device according to claim 12,

wherein the infrared detection elements in the infrared sensor are arranged in three or more columns;

the horizontal edge of each of the infrared detection elements in each of the column, the horizontal edge being generally parallel to the bottom surface, has a smaller dimension, as the infrared detection element is located closer to the bottom surface; and

each of the infrared detection elements in each of the three or more columns is located closer to a center of the three or more columns in a column direction, as the infrared detection element is located closer to the bottom surface.

17. The infrared detecting device according to claim 11,

wherein a relationship given by L_x/L_y=sin(θ

_x)/sin(θ

_y) is satisfied,

where L_x represents a dimension of a horizontal edge of one of the infrared detection elements in each column, L_y represents a dimension of a horizontal edge of the infrared detection element that is adjacent to the one infrared detection element at a bottom surface side, θ

_x represents an angle between the scan rotation axis and a main light ray at a lowest end that is included in an angle of view of the one infrared detection element and that is closest to the bottom surface, and θ

_y represents an angle between the scan rotation axis and a main light ray at a lowest end that is included in an angle of view of the adjacent infrared detection element.

18. The infrared detecting device according to claim 11,

wherein a relationship given by L_x/L_y>

sin(θ

_x)/sin(θ

_y) is satisfied,

where L_x represents a dimension of a horizontal edge of one of the infrared detection elements in each column, L_y represents a dimension of a horizontal edge of the infrared detection element that is adjacent to the one infrared detection element at a bottom surface side, θ

_x represents an angle between the scan rotation axis and a main light ray at a lowest end that is included in an angle of view of the one infrared detection element and that is closest to the bottom surface, and θ

_y represents an angle between the scan rotation axis and a main light ray at a lowest end that is included in an angle of view of the adjacent infrared detection element.

19. The infrared detecting device according to claim 11,

wherein a relationship given by L_x/L_y<

sin(θ

_X)/sin(θ

_y) is satisfied,

where L_x represents a dimension of a horizontal edge of one of the infrared detection elements in each column, L_y represents a dimension of a horizontal edge of the infrared detection element that is adjacent to the one infrared detection element at a bottom surface side, θ

_x represents an angle between the scan rotation axis and a main light ray at a lowest end that is included in an angle of view of the one infrared detection element and that is closest to the bottom surface, and θ

_y represents an angle between the scan rotation axis and a main light ray at a lowest end that is included in an angle of view of the adjacent infrared detection element.