Fingerprint chip package structure and terminal

• US 10,289,892 B2
• Filed: 05/09/2018
• Issued: 05/14/2019
• Est. Priority Date: 08/16/2016
• Status: Active Grant

• Current Assignee: Guangdong OPPO Mobile Telecommunications Corporation Limited
• Original Assignee: Guangdong OPPO Mobile Telecommunications Corporation Limited
• Inventors: Wu, Shoukuan, Zeng, Zanjian
• Primary Examiner(s): Harriston, William A
• Application Number:
  US15/974,789
• Publication Number:
  US 20180260606A1
• Time in Patent Office: 370 Days
• CPC Class Codes: G06F 1/1637 Details related to the display arrangement, including those related to the mounting of the display in the housing
• CPC Class Codes: G06F 1/1684 Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
• CPC Class Codes: G06F 2203/0338 Fingerprint track pad, i.e. fingerprint sensor used as pointing device tracking the fingertip image
• CPC Class Codes: G06F 3/03547 Touch pads, in which fingers can move on a surface
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H04M 1/0202 Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/18 Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment H04M1/19 takes precedence
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits

Abstract

The present disclosure provides a fingerprint chip package structure and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body. The package body packages the fingerprint identification chip therein. The package body includes a first package portion and a second package portion coupled to the first package portion. The first package portion includes the bottom surface, and the second package portion includes the lateral surface. The fingerprint chip package structure is configured to be received in a decoration enclosure.

Claims

1. A fingerprint chip package structure, comprising:

a package body having a bottom surface and a lateral surface connected to the bottom surface, wherein the package body defines a recessed portion at a junction of the bottom surface and the lateral surface; and

a fingerprint identification chip received in the package body, wherein the package body packages the fingerprint identification chip therein,

wherein the package body comprises a first package portion and a second package portion coupled to the first package portion, the first package portion comprises the bottom surface, and the second package portion comprises the lateral surface,

wherein the fingerprint chip package structure is configured to be received in a decoration enclosure, the decoration enclosure comprises a decoration ring and a support rim extending inwards from an inner wall of the decoration ring, the support rim is received in the recessed portion, the support rim has a hole therein, the first package portion passes through the hole in the support rim, and the second package portion is supported on the support rim,

wherein the second package portion comprises a top surface connected to the lateral surface, and the fingerprint chip package structure comprises a cover plate fixed on the top surface.

2. The fingerprint chip package structure according to claim 1, wherein the fingerprint identification chip is received in the first package portion.

3. The fingerprint chip package structure according to claim 2, wherein a shape and a size of the first package portion are matched with a shape and a size of the fingerprint identification chip.

4. The fingerprint chip package structure according to claim 1, wherein the first package portion has a rounded cuboid shape.

5. The fingerprint chip package structure according to claim 1, wherein the cover plate is fixed on the top surface through an adhesive.

6. The fingerprint chip package structure according to claim 1, wherein a shape and a size of the cover plate are matched with a shape and a size of the top surface.

7. The fingerprint chip package structure according to claim 1, wherein the recessed portion comprises a first surface and a second surface connected to the first surface, and the first surface is perpendicular to the second surface.

8. The fingerprint chip package structure according to claim 7, wherein the recessed portion has a transition fillet at a junction of the first surface and the second surface.

9. The fingerprint chip package structure according to claim 1, wherein the recessed portion comprises a first surface and a second surface connected to the first surface, and the first surface is perpendicular to the second surface.

10. The fingerprint chip package structure according to claim 9, wherein the recessed portion has a transition fillet at a junction of the first surface and the second surface.

11. A terminal, comprising a fingerprint chip package structure, wherein the fingerprint chip package structure comprises:

a package body having a bottom surface and a lateral surface connected to the bottom surface, wherein the package body defines a recessed portion at a junction of the bottom surface and the lateral surface; and

a fingerprint identification chip received in the package body, wherein the package body packages the fingerprint identification chip therein,

wherein the package body comprises a first package portion and a second package portion coupled to the first package portion, the first package portion comprises the bottom surface, and the second package portion comprises the lateral surface,

wherein the fingerprint chip package structure is configured to be received in a decoration enclosure, the decoration enclosure comprises a decoration ring and a support rim extending inwards from an inner wall of the decoration ring, the support rim is received in the recessed portion, the support rim has a hole therein, the first package portion passes through the hole in the support rim, and the second package portion is supported on the support rim,

wherein the second package portion comprises a top surface connected to the lateral surface, and the fingerprint chip package structure comprises a cover plate fixed on the top surface.

12. The terminal according to claim 11, wherein the fingerprint identification chip is received in the first package portion.

13. The terminal according to claim 12, wherein a shape and a size of the first package portion are matched with a shape and a size of the fingerprint identification chip.

14. The terminal according to claim 11, wherein the first package portion has a rounded cuboid shape.

15. The terminal according to claim 11, wherein the cover plate is fixed on the top surface through an adhesive.

16. The terminal according to claim 11, wherein a shape and a size of the cover plate are matched with a shape and a size of the top surface.

17. The terminal according to claim 11, wherein the recessed portion comprises a first surface and a second surface connected to the first surface, and the first surface is perpendicular to the second surface.

18. The terminal according to claim 17, wherein the recessed portion has a transition fillet at a junction of the first surface and the second surface.