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Forming an isolation barrier in an isolator

  • US 10,290,532 B2
  • Filed: 05/19/2017
  • Issued: 05/14/2019
  • Est. Priority Date: 05/19/2017
  • Status: Active Grant
First Claim
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1. A method of forming a dielectric insulation layer in an integrated isolator circuit, comprising:

  • receiving a partially formed integrated isolator circuit structure having a first electrode set formed on a substrate wafer;

    applying a pre-formed dielectric sheet or tape over the partially formed integrated isolator circuit structure;

    depositing a metallization layer on the pre-formed dielectric sheet or tape; and

    patterning the metallization layer deposited on the pre-formed dielectric sheet or tape to form a second electrode set on the pre-formed dielectric sheet or tape.

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