Forming an isolation barrier in an isolator
First Claim
1. A method of forming a dielectric insulation layer in an integrated isolator circuit, comprising:
- receiving a partially formed integrated isolator circuit structure having a first electrode set formed on a substrate wafer;
applying a pre-formed dielectric sheet or tape over the partially formed integrated isolator circuit structure;
depositing a metallization layer on the pre-formed dielectric sheet or tape; and
patterning the metallization layer deposited on the pre-formed dielectric sheet or tape to form a second electrode set on the pre-formed dielectric sheet or tape.
3 Assignments
0 Petitions
Accused Products
Abstract
Integrated digital isolators comprise a first transformer coil or capacitor plate mounted on an integrated circuit substrate, and separated from a second transformer coil or capacitor plate via an electrically insulating isolation layer. The electrical isolation that is achieved is dependent upon the material and thickness of the isolation layer. In order to reduce the amount of time required for fabrication while still allowing thick isolation layers to be deployed, in examples of the disclosure pre-formed sheets or tapes of dielectric material are applied to the substrate over the first transformer coil or capacitive plate, for example by being rolled onto the substrate using a heated roller. Such a technique results in a thick isolation layer that is formed using a simple process and much more quickly and reliably than conventional spin-coating or deposition techniques.
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Citations
20 Claims
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1. A method of forming a dielectric insulation layer in an integrated isolator circuit, comprising:
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receiving a partially formed integrated isolator circuit structure having a first electrode set formed on a substrate wafer; applying a pre-formed dielectric sheet or tape over the partially formed integrated isolator circuit structure; depositing a metallization layer on the pre-formed dielectric sheet or tape; and patterning the metallization layer deposited on the pre-formed dielectric sheet or tape to form a second electrode set on the pre-formed dielectric sheet or tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of fabricating an integrated digital isolator circuit, comprising:
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forming a first electrode set on an integrated circuit wafer substrate; rolling a pre-formed sheet or tape of dielectric material having a predetermined thickness to give a predetermined electrical isolation property over the first electrode set; depositing a metallization layer on the pre-formed sheet or tape of dielectric material; and patterning the metallization layer deposited on the pre-formed sheet or tape of dielectric material to form a second electrode set on the pre-formed sheet or tape of dielectric material. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of fabricating an integrated digital isolator circuit, comprising:
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applying a dielectric sheet or tape having a predetermined thickness over a first electrode formed on a wafer substrate; depositing a metallization layer on the dielectric sheet or tape; and patterning the metallization layer deposited on the dielectric sheet or tape to form a second electrode on the dielectric sheet or tape. - View Dependent Claims (18, 19, 20)
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Specification