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Multiple bond via arrays of different wire heights on a same substrate

  • US 10,290,613 B2
  • Filed: 06/14/2018
  • Issued: 05/14/2019
  • Est. Priority Date: 11/22/2013
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • a first substrate;

    first wire bond wires (“

    first wires”

    ) in a first region extending from a surface of the first substrate;

    second wire bond wires (“

    second wires”

    ) in a second region extending from the surface of the first substrate;

    wherein the first wires and the second wires are external to the first substrate;

    wherein the first region is disposed at least partially within the second region;

    wherein the first wires are of a first height;

    wherein the second wires are of a second height greater than the first height;

    a second substrate coupled to first ends of the first wires;

    the second substrate having at least one electronic component coupled thereto;

    a die coupled to second ends of the second wires; and

    the die located over the at least one electronic component.

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