Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device, comprising:
- a) a substrate having a semiconductor material;
b) a plurality of semiconductor layers of a first conductivity type, and being sequentially stacked on said substrate, wherein a doping concentration of said plurality of semiconductor layers successively increases from bottom to top;
c) a trench that extends from the surface of a topmost semiconductor layer into a bottommost semiconductor layer of said plurality of semiconductor layers;
d) a plurality of field plates that correspond to said semiconductor layers, each field plate being located in a portion of said trench that corresponds to one of said plurality of semiconductor layers; and
e) a trench pad located in a bottom and a sidewall of said trench, and filling each space between two adjacent field plates, wherein the thickness of said trench pad between each field plate and corresponding semiconductor layer sequentially decreases from the bottom to the top, and wherein an electric field peak occurs between two adjacent of said plurality of field plates.
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Accused Products
Abstract
A semiconductor device can include: a substrate having a semiconductor material; a plurality of semiconductor layers of a first conductivity type, and being sequentially stacked on the substrate, where a doping concentration of the semiconductor layers successively increases from bottom to top; a trench that extends from the surface of a topmost semiconductor layer into a bottommost semiconductor layer of the semiconductor layers; a plurality of field plates that correspond to the semiconductor layers, each field plate being located in a portion of the trench that corresponds to one of the semiconductor layers; and a trench pad located in a bottom and a sidewall of the trench, and being filled each space between two adjacent field plates, where the thickness of the trench pad between each field plate and corresponding semiconductor layer sequentially decreases from the bottom to the top.
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Citations
13 Claims
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1. A semiconductor device, comprising:
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a) a substrate having a semiconductor material; b) a plurality of semiconductor layers of a first conductivity type, and being sequentially stacked on said substrate, wherein a doping concentration of said plurality of semiconductor layers successively increases from bottom to top; c) a trench that extends from the surface of a topmost semiconductor layer into a bottommost semiconductor layer of said plurality of semiconductor layers; d) a plurality of field plates that correspond to said semiconductor layers, each field plate being located in a portion of said trench that corresponds to one of said plurality of semiconductor layers; and e) a trench pad located in a bottom and a sidewall of said trench, and filling each space between two adjacent field plates, wherein the thickness of said trench pad between each field plate and corresponding semiconductor layer sequentially decreases from the bottom to the top, and wherein an electric field peak occurs between two adjacent of said plurality of field plates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacturing a semiconductor device, the method comprising:
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a) forming a first epitaxial layer with a first conductivity type on a substrate of semiconductor material; b) forming a second epitaxial layer with the first conductivity type on said first epitaxial layer, wherein the doping concentration of said first epitaxial layer is less than that of said second epitaxial layer; c) forming a trench extending from the surface of said second epitaxial layer into said first epitaxial layer; d) forming a trench pad in said trench; e) disposing a first field plate in a portion of said trench located in said first epitaxial layer; and f) disposing a second field plate in a portion of said trench located in said second epitaxial layer, wherein said trench pad is located on a sidewall and a bottom of said trench and fills a space between said first and second field plates, and the thickness of the trench pad between said first field plate and said first epitaxial layer is greater than that of the trench pad between said second field plate and said second epitaxial layer, wherein an electric field peak occurs between said first and second field plates. - View Dependent Claims (10, 11, 12, 13)
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Specification