Pin coupling based thermoelectric device
First Claim
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1. A method comprising:
- coupling a plurality of sets of N and P thermoelectric legs to a first substrate, each set comprising an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate, and the first substrate being a flexible substrate;
forming a conductive thin film on a second substrate, the second substrate being a rigid substrate;
coupling the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate through a pin several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set to form a thermoelectric device;
applying one of;
heat and cold to the formed thermoelectric device at an end of one of;
the first substrate and the second substrate; and
controlling a temperature difference across the N thermoelectric leg and the P thermoelectric leg of the each set on the first substrate based on at least one of;
varying a height of the pin, a thickness of the pin and replacing the pin with a pin having a different area therefrom.
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Abstract
A method includes coupling a number of sets of N and P thermoelectric legs to a substrate. Each set includes an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the substrate. The method also includes forming a conductive thin film on another substrate, and coupling the each set on an end thereof away from the substrate to the conductive thin film formed on the another substrate through a pin several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set to form a thermoelectric device.
216 Citations
7 Claims
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1. A method comprising:
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coupling a plurality of sets of N and P thermoelectric legs to a first substrate, each set comprising an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate, and the first substrate being a flexible substrate; forming a conductive thin film on a second substrate, the second substrate being a rigid substrate; coupling the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate through a pin several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set to form a thermoelectric device; applying one of;
heat and cold to the formed thermoelectric device at an end of one of;
the first substrate and the second substrate; andcontrolling a temperature difference across the N thermoelectric leg and the P thermoelectric leg of the each set on the first substrate based on at least one of;
varying a height of the pin, a thickness of the pin and replacing the pin with a pin having a different area therefrom. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification