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Pin coupling based thermoelectric device

  • US 10,290,794 B2
  • Filed: 12/05/2016
  • Issued: 05/14/2019
  • Est. Priority Date: 12/05/2016
  • Status: Active Grant
First Claim
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1. A method comprising:

  • coupling a plurality of sets of N and P thermoelectric legs to a first substrate, each set comprising an N thermoelectric leg and a P thermoelectric leg electrically contacting each other through a conductive material on the first substrate, and the first substrate being a flexible substrate;

    forming a conductive thin film on a second substrate, the second substrate being a rigid substrate;

    coupling the each set on an end thereof away from the first substrate to the conductive thin film formed on the second substrate through a pin several times longer than a height of the N thermoelectric leg and the P thermoelectric leg of the each set to form a thermoelectric device;

    applying one of;

    heat and cold to the formed thermoelectric device at an end of one of;

    the first substrate and the second substrate; and

    controlling a temperature difference across the N thermoelectric leg and the P thermoelectric leg of the each set on the first substrate based on at least one of;

    varying a height of the pin, a thickness of the pin and replacing the pin with a pin having a different area therefrom.

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