Direct write sensors

• US 10,291,199 B2
• Filed: 08/25/2016
• Issued: 05/14/2019
• Est. Priority Date: 09/04/2015
• Status: Active Grant

• Current Assignee: UT-Battelle LLC
• Original Assignee: UT-Battelle LLC
• Inventors: McIntyre, Timothy J.
• Primary Examiner(s): Dougherty, Thomas M
• Assistant Examiner(s): Addison, Karen B
• Application Number:
  US15/246,907
• Publication Number:
  US 20170070204A1
• Time in Patent Office: 992 Days
• Field of Search: 310313 B, 310313 R, 310313 D
• CPC Class Codes: G01N 2291/0255 (Bio)chemical reactions, e.g. on biosensors
• CPC Class Codes: G01N 2291/0256 Adsorption, desorption, surface mass change, e.g. on biosensors
• CPC Class Codes: G01N 2291/0423 Surface waves, e.g. Rayleigh waves, Love waves
• CPC Class Codes: G01N 2291/0426 Bulk waves, e.g. quartz crystal microbalance, torsional waves
• CPC Class Codes: G01N 29/022 Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices microdevices per se B81B
• CPC Class Codes: G01N 29/22 Details , e.g. general constructional or apparatus details
• CPC Class Codes: H03H 9/02007 of bulk acoustic wave devices
• CPC Class Codes: H03H 9/02275 Comb electrodes
• CPC Class Codes: H03H 9/02535 of surface acoustic wave devices
• CPC Class Codes: H10N 30/074 by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing

Abstract

A method of making an acoustic wave sensor includes the steps of providing a piezoelectric substrate layer and printing on the substrate layer a sensor layer comprising a first interdigitated acoustic wave transducer, a sensing film, and positioned on an opposing side of the sensing film from the first interdigitated acoustic wave transducer at least one selected from the group consisting of a second interdigitated acoustic wave transducer and a Bragg reflector. An insulation layer can be printed. An antenna can be printed in an antenna layer, and the insulation layer can be interposed between the antenna layer and the sensor layer. An electrical connection can be printed between the antenna and the first interdigitated acoustic wave transducer. An acoustic wave sensor is also disclosed.

Claims

1. An acoustic wave sensor, comprising:

a piezoelectric substrate layer;

a sensor layer joined to the substrate layer and comprising a first interdigitated acoustic wave transducer and at least one other feature selected from the group consisting of a sensing film, an interdigitated acoustic wave transducer, and a Bragg reflector;

wherein all of the interdigitated acoustic wave transducers and Bragg reflector are aerosol jet printed;

an antenna layer and an insulation layer interposed between the antenna layer and the sensor layer, wherein the insulation layer and antenna layer are aerosol jet printed; and

,

wherein at least one of the sensor layer and antenna layer comprise a dielectric matrix material.

2. An acoustic wave sensor, comprising:

a piezoelectric substrate layer;

a sensor layer joined to the substrate layer and comprising a first interdigitated acoustic wave transducer and at least one other feature selected from the group consisting of a sensing film, an interdigitated acoustic wave transducer, and a Bragg reflector;

wherein all of the interdigitated acoustic wave transducers and Bragg reflector are aerosol jet printed;

an antenna layer and an insulation layer interposed between the antenna layer and the sensor layer, wherein the insulation layer and antenna layer are aerosol jet printed; and

,

wherein the sensor layer and the antenna layer are printed on opposing sides of the piezoelectric substrate layer.