Power module with integrated liquid cooling

• US 10,292,316 B2
• Filed: 09/08/2017
• Issued: 05/14/2019
• Est. Priority Date: 09/08/2017
• Status: Active Grant

• Current Assignee: Hamilton Sundstrand Corporation (Rtx Corporation)
• Original Assignee: Hamilton Sundstrand Corporation (Rtx Corporation)
• Inventors: Pal, Debabrata
• Primary Examiner(s): Wu, James
• Assistant Examiner(s): Matey, Michael A
• Application Number:
  US15/698,722
• Publication Number:
  US 20190082561A1
• Time in Patent Office: 613 Days
• CPC Class Codes: H02K 11/33 Drive circuits, e.g. power electronics H02K11/38 takes precedence
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A module has a first layer with a plurality of transistors mounted thereon. Circuit traces are configured to communicate current between the transistors outwardly of the module. A second layer is in operable communication with the first layer. A third layer is in operable communication with the second layer. A baseplate is in grounded communication with the third layer. A plurality of ribs are positioned between the third layer and the baseplate. The module is configured to allow fluid to flow between the third layer and the baseplate and around the plurality of ribs. A motor drive and a method are also disclosed.

Claims

1. A module comprising:

a first layer having a plurality of transistors mounted thereon having circuit traces configured to communicate current between said transistors outwardly of said module;

a second layer in operable communication with the first layer;

a third layer in operable communication with the second layer;

a baseplate in grounded communication with the third layer;

a plurality of ribs positioned between the third layer and the baseplate, the module being configured to allow fluid to flow between the third layer and the baseplate and around the plurality of ribs;

said ribs are formed integrally on said third layer, and of a common material with said third layer; and

said ribs being soldered to said baseplate to provide a ground connection.

2. The module as set forth in claim 1, wherein said first layer and said third layer are both direct bond copper layers.

3. The module as set forth in claim 1, wherein said first layer and said third layer are formed of one of molybdenum and beryllium copper.

4. The module as set forth in claim 1, wherein there is a grid of said plurality of transistors and said cooling fluid passes along a first row of said transistors and then returns in an opposed direction across at least a second row of said transistors to an outlet.

5. The module as set forth in claim 1, further comprising O-ring seals sealingly engaged with an inlet connection and an outlet connection extending through said baseplate.

6. The module as set forth in claim 1, wherein said transistors are one of IGBTs and MOSFETs.

7. A motor drive comprising:

a motor, at least one inductor and at least one said power control module including a plurality of transistors mounted on a first layer having circuit traces configured to communicate current between said transistors outwardly of said module, a second layer in operable communication with the first layer, a third layer in operable communication with the second layer, a baseplate in grounded communication with the third layer, and a plurality of ribs positioned between the third layer and the baseplate, the module being configured to allow fluid to flow between the third layer and the baseplate and around the plurality of ribs;

said ribs are formed integrally on said third layer, and of a common material with said third layer; and

said ribs being soldered to said baseplate to provide a ground connection.

8. The motor drive as set forth in claim 7, wherein said first layer and said third layer are both direct bond copper layers.

9. The motor drive as set forth in claim 7, wherein said first layer and said third layer are formed of one of molybdenum and beryllium copper.

10. The motor drive as set forth in claim 7, wherein there is a grid of said plurality of transistors and said cooling fluid passes along a first row of said transistors and then returns in an opposed direction across at least a second row of said transistors to an outlet.

11. The motor drive as set forth in claim 7, wherein there are O-ring seals on an inlet connection and an outlet connection extending through said baseplate and to supply said cooling fluid.

12. The motor drive as set forth in claim 7, wherein said transistors are one of IGBTs and MOSFETs.