Microfluidic cartridge assembly

• US 10,293,339 B2
• Filed: 12/17/2017
• Issued: 05/21/2019
• Est. Priority Date: 07/22/2013
• Status: Active Grant

• Current Assignee: President and Fellows of Harvard College (Harvard Corporation)
• Original Assignee: President and Fellows of Harvard College (Harvard Corporation)
• Inventors: Ingber, Donald E., Levner, Daniel, Thompson, II, Guy, Hinojosa, Christopher David
• Primary Examiner(s): Sines, Brian J.
• Application Number:
  US15/844,562
• Publication Number:
  US 20180117588A1
• Time in Patent Office: 520 Days
• Field of Search: 422 681, 422 8182, 422502, 422503, 422504, 422505, 422509, 422501, 422521, 422537, 422538, 422544, 422560, 422561, 436 43, 436174, 436180
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2200/0684 Venting, avoiding backpressure, avoid gas bubbles
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0874 Three dimensional network
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 2400/0481 squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B01L 3/56 Labware specially adapted for transferring fluids

Abstract

According to aspects of the present invention, a cartridge assembly for transporting fluid into or out of one or more fluidic devices includes a first layer and a second layer. The first layer includes a first surface. The first surface includes at least one partial channel disposed thereon. The second layer abuts the first surface, thereby forming a channel from the at least one partial channel. At least one of the first layer and the second layer is a resilient layer formed from a pliable material. At least one of the first layer and the second layer includes a via hole. The via hole is aligned with the channel to pass fluid thereto. The via hole is configured to pass fluid through the first layer or the second layer substantially perpendicularly to the channel. Embossments are also used to define aspects of a fluidic channel.

Claims

1. A fluidic device configured for fluidic interconnection with a microfluidic device, the fluidic device comprising:

a first structure including a surface and an embossment, the embossment being disposed on the surface of the first structure;

a second structure coupled to the first structure configured such that the embossment abuts the second structure, the abutment thereby forming a seal between the embossment and the second structure; and

an interconnect adapter abutting at least one of the first structure or the second structure, the interconnect adapter configured to form a fluidic connection between the fluidic device and the microfluidic device,

wherein the embossment, when abutting the second structure, is configured to define an aspect of a fluidic channel that connects a first via hole and a second via hole, the fluidic channel being disposed between the first structure and the second structure, wherein in response to the embossment abutting the second structure, a working fluid is configured to flow within the fluidic channel from the first via hole to the second via hole, and

wherein at least one of the first structure and the second structure include a resilient material.

2. The fluidic device of claim 1, wherein the channel is a microfluidic channel.

3. The fluidic device of claim 1, wherein the embossment defines the entire channel.

4. The fluidic device of claim 3, wherein the embossment encloses one or more via holes passing through the surface.

5. The fluidic device of claim 1, wherein the first structure is formed from a resilient material.

6. The fluidic device of claim 5, wherein the second structure is formed from a resilient material.

7. The fluidic device of claim 1, wherein the first structure is formed from a rigid material.

8. The fluidic device of claim 1, further comprising a third structure, the third structure being disposed between the first structure and the second structure, the third structure including an aperture forming a passageway therethrough, the embossment extending between the first layer and the second layer through the passageway.

9. The fluidic device of claim 1, wherein the second structure is a sensing element.

10. The fluidic device of claim 1, wherein the first structure is a first layer and the second structure is a second layer.