Light emitter packages and methods
First Claim
1. A light emitter package comprising:
- a substrate for supporting at least one light emitter chip;
a first electrically conductive layer and a second electrically conductive layer on the substrate, comprising a gap between the first and second electrically conductive layers, wherein each of the first and second electrically conductive layers has a side wall;
a reflective stack of materials comprising;
a reflective layer; and
a reflective polymeric material disposed on the reflective layer, wherein the reflective polymeric material is thicker than the underlying reflective layer and is disposed in and substantially extends across a width of the gap; and
wherein the reflective stack of materials comprising the reflective layer and reflective polymeric material is disposed over the side walls of the first and second electrically conductive layers, wherein the side walls of the first and second electrically conductive layers having the reflective stack of materials disposed thereon are substantially orthogonal with respect to the substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
Light emitter packages and related methods having improved performance are disclosed. In one aspect, a light emitter package can include at least one light emitter chip disposed over a substrate or submount. In some aspects, the package can include a reflective polymeric material or polymeric reflector (sometimes referred to as a “solder mask” or “solder mask material”), a reflective material, and a conductive material disposed adjacent each other within a portion of the light emitter package. In some aspects, the reflective material can include a metallic material or metallic reflector applied to side walls of traces and/or within portions of a gap between traces prior to application of the reflective polymeric material within the gap.
-
Citations
49 Claims
-
1. A light emitter package comprising:
- a substrate for supporting at least one light emitter chip;
a first electrically conductive layer and a second electrically conductive layer on the substrate, comprising a gap between the first and second electrically conductive layers, wherein each of the first and second electrically conductive layers has a side wall;
a reflective stack of materials comprising;
a reflective layer; and
a reflective polymeric material disposed on the reflective layer, wherein the reflective polymeric material is thicker than the underlying reflective layer and is disposed in and substantially extends across a width of the gap; and
wherein the reflective stack of materials comprising the reflective layer and reflective polymeric material is disposed over the side walls of the first and second electrically conductive layers, wherein the side walls of the first and second electrically conductive layers having the reflective stack of materials disposed thereon are substantially orthogonal with respect to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- a substrate for supporting at least one light emitter chip;
-
15. A light emitter package comprising:
-
a substrate comprising a substrate surface; a first trace disposed over the substrate surface; a second trace disposed over the substrate surface; a gap disposed between the first and second traces; a plurality of traces centrally disposed between the first and second traces; and at least one light emitter chip disposed over the substrate surface, the chip being adapted to electrically communicate with portions of the first and second traces; wherein first and second side walls of the first and second traces, respectively, are orthogonally disposed with respect to the substrate surface and oppose each other across the gap, and wherein the first and second side walls are coated with a reflective plastic material and a metallic material, wherein the reflective plastic material is disposed directly adjacent to the first and second side walls, within the gap, wherein the reflective plastic material is disposed in and extends substantially across a width of the gap. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
-
-
24. A method of producing a light emitter package, the method comprising:
- providing a substrate for supporting a light emitter;
providing an electrically conductive layer having at least two side walls and a gap therebetween on the substrate;
providing a reflective stack of materials comprising;
a reflective layer; and
a reflective polymeric material disposed over the reflective layer, wherein the reflective polymeric material is thicker than the underlying reflective layer and is disposed in and substantially extends across a width of the gap; and
providing the reflective stack of materials comprising the reflective layer and reflective polymeric material over the at least two side walls of the electrically conductive layer, wherein the at least two side walls of the electrically conductive layer having the reflective stack of materials disposed thereon are substantially orthogonal with respect to the substrate. - View Dependent Claims (25, 26, 27, 28, 29, 30)
- providing a substrate for supporting a light emitter;
-
31. A light emitter package comprising:
- a substrate for at least one light emitter chip;
a conductive layer on the substrate;
a trace disposed over the substrate, the trace comprising at least two side walls and a gap therebetween;
a first reflective layer disposed on portions of the substrate, the conductive layer and on a portion of the trace; and
a second reflective layer disposed over the first reflective layer and disposed in and substantially extending across a width of the gap;
wherein the first reflective layer is disposed over a side wall of the conductive layer;
wherein the second reflective layer is a reflective polymeric material that is electrically insulating, thermally insulating, and both light reflective and light permeable to re-reflect permeated light from the light emitter package via the underlying first reflective layer. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
- a substrate for at least one light emitter chip;
-
44. A method of producing a light emitter package, the method comprising:
- providing a substrate;
providing a conductive layer on the substrate;
providing a trace over the substrate, the trace comprising at least two side walls and a gap therebetween;
providing a first reflective layer on portions of the substrate and on a portion of the trace; and
providing a second reflective layer over the first reflective layer and disposed in and substantially extending across a width of the gap;
wherein the first reflective layer is disposed over a side wall of the conductive layer;
wherein the second reflective layer is a reflective polymeric material that is electrically insulating, thermally insulating, and both light reflective and light permeable to re-reflect permeated light from the light emitter package via the underlying first reflective layer. - View Dependent Claims (45, 46, 47, 48, 49)
- providing a substrate;
Specification