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Light emitter packages and methods

  • US 10,295,124 B2
  • Filed: 02/27/2013
  • Issued: 05/21/2019
  • Est. Priority Date: 02/27/2013
  • Status: Active Grant
First Claim
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1. A light emitter package comprising:

  • a substrate for supporting at least one light emitter chip;

    a first electrically conductive layer and a second electrically conductive layer on the substrate, comprising a gap between the first and second electrically conductive layers, wherein each of the first and second electrically conductive layers has a side wall;

    a reflective stack of materials comprising;

    a reflective layer; and

    a reflective polymeric material disposed on the reflective layer, wherein the reflective polymeric material is thicker than the underlying reflective layer and is disposed in and substantially extends across a width of the gap; and

    wherein the reflective stack of materials comprising the reflective layer and reflective polymeric material is disposed over the side walls of the first and second electrically conductive layers, wherein the side walls of the first and second electrically conductive layers having the reflective stack of materials disposed thereon are substantially orthogonal with respect to the substrate.

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