Current sensor device having a sense resistor in a re-distribution layer
First Claim
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1. An electronic device for sensing a current, comprising:
- a semiconductor chip comprising a main face;
an electronic circuit integrated in the semiconductor chip, wherein the electronic circuit is connected with contact pads disposed on the main face of the semiconductor chip;
a redistribution metallization layer disposed above the main face of the semiconductor chip;
a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points;
external contact elements connected with the two resistance defining endpoints of the resistor for feeding a current to be sensed into the current path;
sense lines formed in the redistribution metallization layer and connected with the two resistance defining endpoints, each sense line connected between one of the two resistance defining endpoints and one of the contact pads that is connected with the electronic circuit, the electronic circuit sensing a current flowing through the current path.
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Abstract
The electronic device for sensing a current comprises a semiconductor chip comprising a main face, an electronic circuit integrated in the semiconductor chip, a redistribution metallization layer disposed above the main face of the semiconductor chip, a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points to the electronic circuit for sensing a current flowing through the current path, and external contact elements connected with the redistribution metallization layer for feeding a current to be sensed into the current path.
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Citations
17 Claims
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1. An electronic device for sensing a current, comprising:
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a semiconductor chip comprising a main face; an electronic circuit integrated in the semiconductor chip, wherein the electronic circuit is connected with contact pads disposed on the main face of the semiconductor chip; a redistribution metallization layer disposed above the main face of the semiconductor chip; a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points; external contact elements connected with the two resistance defining endpoints of the resistor for feeding a current to be sensed into the current path; sense lines formed in the redistribution metallization layer and connected with the two resistance defining endpoints, each sense line connected between one of the two resistance defining endpoints and one of the contact pads that is connected with the electronic circuit, the electronic circuit sensing a current flowing through the current path. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A current sensor device, comprising:
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a semiconductor chip comprising a main face and contact pads disposed on the main face; a redistribution metallization layer disposed above the main face of the chip and connected to at least two of the contact pads; at least two external contact elements disposed above the redistribution metallization layer; a current path connected with the at least two external contact elements, the current path being integral to said redistribution metallization layer, the current path comprising two end points, each one of the two end points being connected through the redistribution metallization layer with at least one of the at least two of the contact pads; and an electronic circuit integrated in the semiconductor chip and connected with the at least two of the contact pads that are connected with the two end points, the electronic circuit sensing a current flowing through the current path,.
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17. A current sensor device, comprising:
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a substrate; contact pads disposed on a main face of the substrate; a redistribution layer disposed above the main face of the substrate and connected with at least two of the contact pads; at least two external contact elements disposed above the redistribution layer; a shunt line connecting the at least two external contact elements and being formed in the redistribution layer; two sense lines, each one of the two sense lines formed in the redistribution layer and connecting one of the at least two of the contact pads with one of two end points of the shunt line; and an electronic circuit integrated in the substrate and connected with the at least two of the contact pads connected with the two sense lines, the electronic circuit sensing a current flowing through the shunt line.
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Specification