Narrow pre-deposition laser deletion
First Claim
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1. A method of fabricating an optical device comprising one or more material layers sandwiched between a first and a second conductor layer, the method comprising:
- receiving a substrate with the first conductor layer over its work surface;
(ii) removing a first width of the first conductor layer in a region along between about 50% and about 90% of the perimeter of the substrate while leaving a pad of the first conductor layer coextensive with the first width along the perimeter;
(iii) depositing said one or more material layers of the optical device and the second conductor layer over the work surface of the substrate; and
(iv) removing a second width of all the layers along substantially the entire perimeter of the substrate, wherein the depth of removal is at least sufficient to remove the first conductor layer, and wherein the second width of removal is sufficient to remove the pad and the remaining 10% to 50% of the first conductor layer along the perimeter of the substrate,wherein at least one of the first and second conductor layers is transparent.
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Abstract
Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.
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Citations
25 Claims
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1. A method of fabricating an optical device comprising one or more material layers sandwiched between a first and a second conductor layer, the method comprising:
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receiving a substrate with the first conductor layer over its work surface; (ii) removing a first width of the first conductor layer in a region along between about 50% and about 90% of the perimeter of the substrate while leaving a pad of the first conductor layer coextensive with the first width along the perimeter; (iii) depositing said one or more material layers of the optical device and the second conductor layer over the work surface of the substrate; and (iv) removing a second width of all the layers along substantially the entire perimeter of the substrate, wherein the depth of removal is at least sufficient to remove the first conductor layer, and wherein the second width of removal is sufficient to remove the pad and the remaining 10% to 50% of the first conductor layer along the perimeter of the substrate, wherein at least one of the first and second conductor layers is transparent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification