Fingerprint sensor and manufacturing method thereof

• US 10,297,515 B2
• Filed: 04/18/2016
• Issued: 05/21/2019
• Est. Priority Date: 05/12/2015
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Park, Sung Sun, Chung, Ji Young, Berry, Christopher
• Primary Examiner(s): Whalen, Daniel
• Application Number:
  US15/131,967
• Publication Number:
  US 20160335470A1
• Time in Patent Office: 1,128 Days
• Field of Search: None
• CPC Class Codes: B81C 3/00 Assembling of devices or systems from individually processed components
• CPC Class Codes: G06V 40/13 Sensors therefor
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/034 by blanket deposition of the material of the bonding area
• CPC Class Codes: H01L 2224/0345 Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/03452 Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/03464 Electroless plating
• CPC Class Codes: H01L 2224/0347 using a lift-off mask
• CPC Class Codes: H01L 2224/0361 Physical or chemical etching
• CPC Class Codes: H01L 2224/03912 the bump being used as a mask for patterning the bonding area
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05666 : Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05671 : Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05684 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/1132 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/114 : by blanket deposition of the material of the bump connector
• CPC Class Codes: H01L 2224/1146 : Plating
• CPC Class Codes: H01L 2224/1147 : using a lift-off mask
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/119 : Methods of manufacturing bump connectors involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/13013 : being rectangular or square
• CPC Class Codes: H01L 2224/13014 : being circular or elliptic
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291
• CPC Class Codes: H01L 2224/133 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/27312 : Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
• CPC Class Codes: H01L 2224/2732 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/27622 : Photolithography
• CPC Class Codes: H01L 2224/2784 : involving a mechanical process, e.g. planarising the layer connector
• CPC Class Codes: H01L 2224/29006 : Layer connector larger than the underlying bonding area
• CPC Class Codes: H01L 2224/29007 : Layer connector smaller than the underlying bonding area
• CPC Class Codes: H01L 2224/29011 : comprising apertures or cavities
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29299 : Base material
• CPC Class Codes: H01L 2224/2939 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/33181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81424 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/81439 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/81444 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81447 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/81455 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/8146 : Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2224/81464 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/81466 : Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/81471 : Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/81484 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/8185 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83101 : as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83102 : using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/92225 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/053 : the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/069 : Polyurethane
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18161 : of a flip chip

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

Claims

1. A fingerprint sensor device comprising:

a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;

a semiconductor die having a top die side, a bottom die side facing and coupled to the top substrate side, and lateral die sides between the top and bottom die sides, where the bottom die side comprises a sensing area that comprises a fingerprint sensing unit;

a plurality of first interconnection structures electrically connecting the bottom die side to the top substrate side; and

a protection plate on the top die side through which a fingerprint is sensed, the protection plate having a top plate side, a bottom plate side, and lateral plate sides between the top and bottom plate sides.

2. The fingerprint sensor device of claim 1, wherein the fingerprint sensing unit comprises fingerprint sensing circuitry.

3. The fingerprint sensor device of claim 1, wherein the sensing area is in a central area of the bottom die side, and the plurality of first interconnection structures are positioned outside of the sensing area on at least two laterally opposite sides of the sensing area.

4. The fingerprint sensor device of claim 1, comprising an adhesive layer adhered to the top die side and to the bottom plate side.

5. The fingerprint sensor device of claim 4, wherein the adhesive layer completely covers the top die side.

6. The fingerprint sensor device of claim 1, wherein no fingerprint sensing electrodes of the fingerprint sensor device are directly above the sensing area of the semiconductor die.

7. The fingerprint sensor device of claim 1, comprising fingerprint sensing electrodes positioned directly above the semiconductor die.

8. The fingerprint sensor device of claim 1, wherein the protection plate comprises glass.

9. The fingerprint sensor device of claim 1, comprising an interposer between the top die side and the protection plate, wherein the interposer comprises a plurality of fingerprint sensing electrodes sandwiched between dielectric layers.

10. The fingerprint sensor device of claim 9, comprising a plurality of second interconnection structures coupled to a bottom side of the interposer and to the top substrate side outside of a footprint of the semiconductor die, and where each of the plurality of fingerprint sensing electrodes is electrically connected to a respective one of the second interconnection structures.

11. A fingerprint sensor device comprising:

a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;

a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the bottom die side comprises a sensing area that comprises fingerprint sensing circuitry;

a plurality of first interconnection structures electrically connecting the bottom die side to the top substrate side;

a body surrounding the lateral die sides; and

a protective layer on the top die side through which a fingerprint is sensed, the protective layer having a top protective layer side, a bottom protective layer side, and lateral protective layer sides between the top and bottom protective layer sides.

12. The fingerprint sensor device of claim 11, wherein the body is directly coupled to the protective layer.

13. The fingerprint sensor device of claim 11, wherein the protective layer is laterally wider than the semiconductor die and laterally narrower than the body.

14. The fingerprint sensor device of claim 11, wherein the body comprises a bezel.

15. The fingerprint sensor device of claim 11, wherein a perimeter of the protective layer directly contacts the body.