Semiconductor package and method of fabricating the same

• US 10,297,554 B2
• Filed: 04/02/2018
• Issued: 05/21/2019
• Est. Priority Date: 09/17/2014
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Yeongseok
• Primary Examiner(s): Thai, Luan C
• Application Number:
  US15/942,994
• Publication Number:
  US 20180226354A1
• Time in Patent Office: 414 Days
• Field of Search: 257795
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2223/54433 containing identification or tracking information
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

Claims

1. A marking film comprising:

a reflection layer for reflecting an electromagnetic wave; and

a thermoreactive layer on the reflection layer,

the thermoreactive layer configured to form a discoloration region in response to the electromagnetic wave, and

the thermoreactive layer being configured to separate from a base film thereon.

2. The marking film of claim 1, wherein

at least one of the thermoreactive layer and the reflection layer includes a thermosetting resin.

3. The marking film of claim 1, wherein the reflection layer includes an adhesive material.

4. The marking film of claim 3, wherein the adhesive material is a thermosetting resin.

5. The marking film of claim 1, wherein

the reflection layer includes a reflection material for reflecting the electromagnetic wave, and

the reflection material includes at least one of Sb₂O₃, BaSO₄, (PbCO₃)₂Pb(OH)₂, TiO₂, ZnO, ZnS, Al₂0₃, or a combination thereof.

6. The marking film of claim 1, wherein

the thermoreactive layer includes a thermosetting resin.

7. The marking film of claim 1, wherein

the thermoreactive layer includes a light absorber and at least one of a discoloration material or a carbonization material.

8. The marking film of claim 7, wherein

the light absorber includes one of carbon black, titanium black, Fe₃O₄, or mordant black.

9. The marking film of claim 7, wherein

the thermoreactive layer includes the discoloration material, and

the discoloration material includes one of thermochromic material, photochromic material, ionochromic material, electrochromic material, solvatochromic material, piezochromic material, gasochromic material, vapochromic material, or chronochromic material.

10. The marking film of claim 7, wherein

the thermoreactive layer includes the carbonization material, and

the carbonization material includes one of acrylic, phenolic, epoxy, urethane, polyamide, or polyolefin.

11. The marking film of claim 1, wherein

the thermoreactive layer is configured to separate from a release layer that includes a release agent and is in the base film, or

the thermoreactive layer is configured to separate from a base layer that has a releasing property and is in the base film.

12. A package film, comprising:

the marking film of claim 1; and

at least one of a release layer or a base layer on the marking film, wherein

the base film includes the at least one of the release layer or the base layer, and

the marking film is configured to separate from the base film.

13. The package film of claim 12, wherein

the base film includes the release layer,

the release layer includes a release agent, and

the marking film is configured to separate from the release layer to expose an upper surface of the marking film.

14. The package film of claim 13, wherein

the release agent of the release layer is a silicone release agent, an epoxy release agent, or a fluorine release agent.

15. The package film of claim 12, wherein

the base film further includes the base layer on the release layer.

16. The package film of claim 12, wherein

the base film includes the base layer, and

the base layer has a releasing property.

17. A marking film comprising:

a reflection layer for reflecting an electromagnetic wave; and

a thermoreactive layer on the reflection layer,

the thermoreactive layer configured to form a discoloration region in response to the electromagnetic wave, and

an upper surface of the thermoreactive layer being exposed to an external environment.