Multi-resolution compound micro-devices
First Claim
1. A compound micro-assembled device, comprising:
- a device substrate;
a first component having a first component native resolution, the first component disposed on the device substrate;
a second component having a second component native resolution different from the first component native resolution, the second component disposed on the device substrate; and
one or more device interconnections electrically connecting the first component to the second component on the device substrate,wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, andwherein the first component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the first component, andwherein the second component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the second component.
3 Assignments
0 Petitions
Accused Products
Abstract
A compound micro-assembled device comprises a device substrate. A first component having a first native resolution and a second component having a second native resolution different from the first native resolution are both disposed on the device substrate. The device substrate can comprise a device circuit having a native resolution different from or less than the first and second native resolutions. One or more device interconnections electrically connect the first component to the second component or to the device circuit. In certain embodiments, the first component or the second component can be micro-transfer printed onto the device substrate. In certain embodiments, the compound micro-assembled device can be micro-transfer printed onto a destination substrate or the compound micro-assembled device can comprise a destination substrate onto which the device substrate is micro-transfer printed. At least one of the first component and second components and, optionally, the device substrate, comprises at least a portion of a tether.
-
Citations
25 Claims
-
1. A compound micro-assembled device, comprising:
-
a device substrate; a first component having a first component native resolution, the first component disposed on the device substrate; a second component having a second component native resolution different from the first component native resolution, the second component disposed on the device substrate; and one or more device interconnections electrically connecting the first component to the second component on the device substrate, wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, and wherein the first component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the first component, and wherein the second component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the second component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method of making a compound micro-assembled device, comprising;
-
providing a device substrate comprising one or more device interconnections; providing a first component having a first component native resolution on a first source wafer, wherein the first component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the first component; providing a second component having a second component native resolution different from the first component native resolution, disposed on the device substrate, wherein the second component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the second component; micro-transfer printing the first component from the first source wafer onto the device substrate such that the first component comprises at least a portion of a fractured or separated tether after printing; and electrically connecting the first component to the one or more device interconnections, and wherein the second component is electrically connected to the one or more device interconnections. - View Dependent Claims (16, 17, 18, 19, 20, 21)
-
-
22. A compound micro-assembled device, comprising:
-
a device substrate; a first component having a first native resolution, the first component disposed on the device substrate; a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate; and one or more device interconnections electrically connecting the first component to the second component on the device substrate, wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, wherein the device substrate comprises a device material that is a semiconductor material, wherein the device substrate comprises a device circuit disposed in or on the device material and the device circuit is electrically connected to at least one of the one or more device interconnections, wherein the device circuit has a device native resolution, and wherein the device native resolution is the same as one of the first native resolution and the second native resolution.
-
-
23. A compound micro-assembled device, comprising:
-
a device substrate; a first component having a first native resolution, the first component disposed on the device substrate; a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate; and one or more device interconnections electrically connecting the first component to the second component on the device substrate, wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, wherein the device substrate comprises a device material that is a semiconductor material, wherein the device substrate comprises a device circuit disposed in or on the device material and the device circuit is electrically connected to at least one of the one or more device interconnections, wherein the device circuit has a device native resolution, and wherein the device native resolution is less than the first native resolution and less than the second native resolution.
-
-
24. A compound micro-assembled device, comprising:
-
a device substrate; a first component having a first native resolution, the first component disposed on the device substrate; a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate; one or more device interconnections electrically connecting the first component to the second component on the device substrate; and a destination substrate comprising one or more destination substrate interconnections, the device substrate is disposed on the destination substrate, and the one or more device interconnections are electrically connected to the one or more destination substrate interconnections, wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, and wherein the one or more device interconnections comprise one or more device interconnection materials and the one or more destination substrate interconnections comprise one or more destination substrate interconnection materials, and wherein at least one of (i) the one or more device interconnection materials are different from the one or more destination substrate interconnection materials, and (ii) the one or more destination substrate interconnections have a different native resolution from the one or more device interconnections.
-
-
25. A compound micro-assembled device, comprising:
-
a device substrate; a first component having a first native resolution, the first component disposed on the device substrate; a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate; one or more device interconnections electrically connecting the first component to the second component on the device substrate; and a destination substrate comprising one or more destination substrate interconnections, the device substrate is disposed on the destination substrate, and the one or more device interconnections are electrically connected to the one or more destination substrate interconnections, wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, and wherein the one or more device interconnections comprise one or more device interconnection materials and the one or more destination substrate interconnections comprise one or more destination substrate interconnection materials and the one or more device interconnection materials are made in a different process from the one or more destination substrate interconnection materials.
-
Specification