Multi-resolution compound micro-devices

• US 10,297,585 B1
• Filed: 12/21/2017
• Issued: 05/21/2019
• Est. Priority Date: 12/21/2017
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher Andrew, Meitl, Matthew, Cok, Ronald S.
• Primary Examiner(s): Ullah, Elias
• Application Number:
  US15/850,049
• Time in Patent Office: 516 Days
• CPC Class Codes: H01L 2224/02335 Free-standing redistribution layers
• CPC Class Codes: H01L 2224/02371 connecting the bonding area on a surface of the semiconductor or solid-state body with another surface of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13008 Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24105 Connecting bonding areas at different heights
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/245 Material
• CPC Class Codes: H01L 2224/24991 being formed on the semiconductor or solid-state body to be connected
• CPC Class Codes: H01L 2224/2512 Layout
• CPC Class Codes: H01L 2224/25175 Parallel arrangements
• CPC Class Codes: H01L 2224/25177 Combinations of a plurality of arrangements
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/82106 : by subtractive methods
• CPC Class Codes: H01L 2224/92244 : the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 2224/951 : Supplying the plurality of semiconductor or solid-state bodies
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 23/5383 : Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/25 : of a plurality of high density interconnect connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/013 : Alloys

Abstract

A compound micro-assembled device comprises a device substrate. A first component having a first native resolution and a second component having a second native resolution different from the first native resolution are both disposed on the device substrate. The device substrate can comprise a device circuit having a native resolution different from or less than the first and second native resolutions. One or more device interconnections electrically connect the first component to the second component or to the device circuit. In certain embodiments, the first component or the second component can be micro-transfer printed onto the device substrate. In certain embodiments, the compound micro-assembled device can be micro-transfer printed onto a destination substrate or the compound micro-assembled device can comprise a destination substrate onto which the device substrate is micro-transfer printed. At least one of the first component and second components and, optionally, the device substrate, comprises at least a portion of a tether.

Claims

1. A compound micro-assembled device, comprising:

a device substrate;

a first component having a first component native resolution, the first component disposed on the device substrate;

a second component having a second component native resolution different from the first component native resolution, the second component disposed on the device substrate; and

one or more device interconnections electrically connecting the first component to the second component on the device substrate,

wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, and

wherein the first component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the first component, and

wherein the second component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the second component.

2. The compound micro-assembled device of claim 1, wherein the first component is formed at least partially in a first material, the second component is formed at least partially in a second material, and the first and second materials are a same material.

3. The compound micro-assembled device of claim 2, wherein the same material is a semiconductor material forming a component substrate for the first component and for the second component.

4. The compound micro-assembled device of claim 1, wherein the device substrate comprises a device material that is a semiconductor material.

5. The compound micro-assembled device of claim 4, wherein the first component is formed at least partially in a first material, the second component is formed at least partially in a second material, and the first material, the second material, and the device material are a same material.

6. The compound micro-assembled device of claim 4, wherein the first component is formed at least partially in a first material, the second component is formed at least partially in a second material, and the device material comprises a same material as the first material or the second material.

7. The compound micro-assembled device of claim 4, wherein the first component is formed at least partially in a first material, the second component is formed at least partially in a second material, and the first material, the second material, and the device material are each a different material.

8. The compound micro-assembled device of claim 4, wherein the device substrate comprises a device circuit disposed in or on the device material and the device circuit is electrically connected to at least one of the one or more device interconnections.

9. The compound micro-assembled device of claim 8, wherein the device circuit has a device native resolution.

10. The compound micro-assembled device of claim 9, wherein the device native resolution is different from the first component native resolution and different from the second component native resolution.

11. The compound micro-assembled device of claim 1, wherein the first component and the second component are micro-transfer printed onto the device substrate and each of the first component and the second component comprises at least a portion of a fractured or separated tether.

12. The compound micro-assembled device of claim 1, comprising a destination substrate comprising one or more destination substrate interconnections, the device substrate is disposed on the destination substrate, and the one or more device interconnections are electrically connected to the one or more destination substrate interconnections.

13. The compound micro-assembled device of claim 1, wherein the device interconnections have a device native resolution that is less than the first component native resolution or the second component native resolution.

14. The compound micro-assembled device of claim 1, wherein the device interconnections have a device native resolution that is less than the first component native resolution and less than the second component native resolution.

15. A method of making a compound micro-assembled device, comprising;

providing a device substrate comprising one or more device interconnections;

providing a first component having a first component native resolution on a first source wafer, wherein the first component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the first component;

providing a second component having a second component native resolution different from the first component native resolution, disposed on the device substrate, wherein the second component native resolution is defined by the smallest of (i) a smallest structure and (ii) a smallest spacing between two structures defined in the second component;

micro-transfer printing the first component from the first source wafer onto the device substrate such that the first component comprises at least a portion of a fractured or separated tether after printing; and

electrically connecting the first component to the one or more device interconnections, and wherein the second component is electrically connected to the one or more device interconnections.

16. The method of claim 15, comprising:

providing the second component on a second source wafer; and

micro-transfer printing the second component from the second source wafer onto the device substrate such that the second component comprises at least a portion of a fractured or separated tether after printing; and

electrically connecting the second component to the one or more device interconnections.

17. The method of claim 15, comprising forming the one or more device interconnections after the first component is micro-transfer printed.

18. The method of claim 15, comprising forming the one or more device interconnections by micro-transfer printing.

19. The method of claim 15, comprising:

disposing the device substrate on or in a device source wafer;

providing a destination substrate comprising one or more destination substrate interconnections;

after electrically connecting the first component to the one or more device interconnections, micro-transfer printing the device substrate from the device source wafer onto the destination substrate such that the device substrate comprises at least a portion of a fractured or separated tether; and

electrically connecting the one or more device interconnections to the one or more destination substrate interconnections.

20. The method of claim 19, wherein micro-transfer printing the device substrate causes one or more of the one or more device interconnections to be electrically connected to one or more of the one or more destination substrate interconnections.

21. The method of claim 15, wherein micro-transfer printing the first component causes the first component to be electrically connected to the one or more device interconnections.

22. A compound micro-assembled device, comprising:

a device substrate;

a first component having a first native resolution, the first component disposed on the device substrate;

a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate; and

one or more device interconnections electrically connecting the first component to the second component on the device substrate,

wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether,

wherein the device substrate comprises a device material that is a semiconductor material,

wherein the device substrate comprises a device circuit disposed in or on the device material and the device circuit is electrically connected to at least one of the one or more device interconnections,

wherein the device circuit has a device native resolution, and

wherein the device native resolution is the same as one of the first native resolution and the second native resolution.

23. A compound micro-assembled device, comprising:

a device substrate;

a first component having a first native resolution, the first component disposed on the device substrate;

a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate; and

one or more device interconnections electrically connecting the first component to the second component on the device substrate,

wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether,

wherein the device substrate comprises a device material that is a semiconductor material,

wherein the device substrate comprises a device circuit disposed in or on the device material and the device circuit is electrically connected to at least one of the one or more device interconnections,

wherein the device circuit has a device native resolution, and

wherein the device native resolution is less than the first native resolution and less than the second native resolution.

24. A compound micro-assembled device, comprising:

a device substrate;

a first component having a first native resolution, the first component disposed on the device substrate;

a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate;

one or more device interconnections electrically connecting the first component to the second component on the device substrate; and

a destination substrate comprising one or more destination substrate interconnections, the device substrate is disposed on the destination substrate, and the one or more device interconnections are electrically connected to the one or more destination substrate interconnections,

wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, and

wherein the one or more device interconnections comprise one or more device interconnection materials and the one or more destination substrate interconnections comprise one or more destination substrate interconnection materials, and wherein at least one of (i) the one or more device interconnection materials are different from the one or more destination substrate interconnection materials, and (ii) the one or more destination substrate interconnections have a different native resolution from the one or more device interconnections.

25. A compound micro-assembled device, comprising:

a device substrate;

a first component having a first native resolution, the first component disposed on the device substrate;

a second component having a second native resolution different from the first native resolution, the second component disposed on the device substrate;

one or more device interconnections electrically connecting the first component to the second component on the device substrate; and

a destination substrate comprising one or more destination substrate interconnections, the device substrate is disposed on the destination substrate, and the one or more device interconnections are electrically connected to the one or more destination substrate interconnections,

wherein at least one of the first component, the second component, and the device substrate comprises at least a portion of a tether, and

wherein the one or more device interconnections comprise one or more device interconnection materials and the one or more destination substrate interconnections comprise one or more destination substrate interconnection materials and the one or more device interconnection materials are made in a different process from the one or more destination substrate interconnection materials.